公开(公告)号：US07658988B2

公开(公告)日：2010-02-09

申请号：US11732344

申请日：2007-04-03

Applicant: Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

Inventor： Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

IPC: B32B9/00

CPC classification number: H05K1/0373 ,  H01L23/145 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/10253 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  H01L2924/00

Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.

Abstract translation: 提供了由环氧组合物制备印刷电路的组合物和方法。 环氧组合物在未固化状态下表现出低粘度，并且在固化状态下表现出低的热膨胀系数。 本发明的低介电常数组合物非常适用于多层印刷电路板。

公开(公告)号：US20100009071A1

公开(公告)日：2010-01-14

申请号：US12169090

申请日：2008-07-08

Applicant: Naveen CHOPRA ,  Yuning LI ,  Peter M. KAZMAIER

Inventor： Naveen CHOPRA ,  Yuning LI ,  Peter M. KAZMAIER

IPC: B05D5/12 ,  B22F1/00 ,  C09D5/00

CPC classification number: H05K1/097 ,  B22F1/0014 ,  B22F2001/0092 ,  B22F2999/00 ,  C09D11/037 ,  C09D11/36 ,  C09D11/52 ,  H05K2201/0224 ,  H05K2201/0266 ,  B22F1/0018

Abstract: A bimodal metal nanoparticle composition includes first metal nanoparticles having an average diameter of from about 50 nm to about 1000 nm, and second stabilized metal nanoparticles having an average diameter of from about 0.5 nm to about 20 nm, the second stabilized metal nanoparticles including metal cores having a stabilizer attached to the surfaces thereof, wherein the stabilizer is a substituted dithiocarbonate.

Abstract translation: 双峰金属纳米颗粒组合物包含平均直径为约50nm至约1000nm的第一金属纳米颗粒和平均直径为约0.5nm至约20nm的第二稳定金属纳米颗粒，第二稳定化金属纳米颗粒包括金属芯 具有附着在其表面上的稳定剂，其中稳定剂是取代的二硫代碳酸酯。

公开(公告)号：US20090188702A1

公开(公告)日：2009-07-30

申请号：US12334413

申请日：2008-12-12

Applicant: Kiyomi Muro ,  Akihiko Happoya ,  Yasuki Torigoshi

Inventor： Kiyomi Muro ,  Akihiko Happoya ,  Yasuki Torigoshi

IPC: H05K1/00

CPC classification number: H05K1/0218 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/281 ,  H05K3/4664 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618

Abstract: An embodiment of a flexible printed wiring board includes: a base layer comprising one surface and the other surface, the one surface being exposed; a signal layer formed on the other surface of the base layer; a cover layer stacked on the base layer to cover the signal layer; and a ground layer coated on the cover layer to cover the signal layer, the ground layer comprising a conductive paste in which metal powder and metal nanoparticles are mixed.

Abstract translation: 柔性印刷布线板的一个实施例包括：基底层，其包括一个表面和另一个表面，该一个表面被暴露; 形成在所述基底层的另一个表面上的信号层; 层叠在所述基底层上以覆盖所述信号层的覆盖层; 以及涂覆在覆盖层上以覆盖信号层的接地层，所述接地层包括其中混合金属粉末和金属纳米颗粒的导电浆料。

公开(公告)号：US20090110893A1

公开(公告)日：2009-04-30

申请号：US12260042

申请日：2008-10-28

Applicant: Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

Inventor： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

IPC: B32B7/02 ,  B32B9/04 ,  B32B37/06

CPC classification number: H05K3/4611 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0266 ,  H05K2203/308 ,  Y10T428/24992

Abstract: Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate using the same. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on the top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. Thus, a shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders that are different in terms of density and particle diameter.

Abstract translation: 本发明提供约束生片和使用其的多层陶瓷基片的制造方法。 约束生片包括第一约束层和第二约束层。 第一约束层具有设置在多层陶瓷层叠结构上的一侧，并且由具有第一粒径的第一无机粉末形成。 第二约束层设置在第一约束层的顶部，并由具有大于第一粒径的第二粒径的第二无机粉末形成。 因此，通过使用由密度和粒径不同的无机粉末形成的约束生片，可以在陶瓷层叠结构的烧成工序中确保收缩抑制率，并且可以确保脱粘合剂通道。

公开(公告)号：US20080257588A1

公开(公告)日：2008-10-23

申请号：US11814129

申请日：2006-01-17

Applicant: Naohiko Abe ,  Akiko Sugioka ,  Akihiro Kanno

Inventor： Naohiko Abe ,  Akiko Sugioka ,  Akihiro Kanno

IPC: H05K1/00 ,  H01G9/00

CPC classification number: H01G4/33 ,  H05K1/09 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0266 ,  H05K2201/0355

Abstract: A capacitor layer forming material that consists of a dielectric film making use of the sol-gel process excelling in production cost merit, being capable of producing a capacitor circuit of prolonged life having a nonconventional high electric capacity. There is provided capacitor layer forming material (1) having dielectric layer (4) interposed between first conductive layer (2) for formation of an upper electrode and second conductive layer (3) for formation of a lower electrode, characterized in that the dielectric layer (4) consists of an oxide dielectric film produced by the sol-gel process containing an oxide crystal structure of 50 to 300 nm grain diameter (major axis) being a coarse crystal structure having grown in the thickness direction and plane direction of the dielectric layer. Further, there is provided a process for efficiently producing this capacitor layer forming material.

Abstract translation: 一种电容器层形成材料，其由使用优异的制造成本优点的溶胶 - 凝胶法制成的电介质膜构成，能够制造具有非常规高电容的长寿命的电容器电路。 提供电容器层形成材料（1），其具有插入用于形成上电极的第一导电层（2）和用于形成下电极的第二导电层（3）之间的介电层（4），其特征在于，介电层 （4）由通过溶胶 - 凝胶法制造的氧化物介电膜构成，该氧化物电介质膜含有在厚度方向和电介质层的平面方向上生长的粗晶体结构的长径为50〜300nm 。 此外，提供了一种用于有效地制造该电容器层形成材料的方法。

公开(公告)号：US20070231469A1

公开(公告)日：2007-10-04

申请号：US11732344

申请日：2007-04-03

Applicant: Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

Inventor： Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

IPC: B32B3/00 ,  B32B7/00 ,  B32B15/00 ,  B05D5/12

CPC classification number: H05K1/0373 ,  H01L23/145 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/10253 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  H01L2924/00

Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.

Abstract translation: 提供了由环氧组合物制备印刷电路的组合物和方法。 环氧组合物在未固化状态下表现出低粘度，并且在固化状态下表现出低的热膨胀系数。 本发明的低介电常数组合物非常适用于多层印刷电路板。

公开(公告)号：US20070224511A1

公开(公告)日：2007-09-27

申请号：US11798797

申请日：2007-05-17

Applicant: Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

Inventor： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC: H01M4/62

CPC classification number: H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

Abstract: A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

公开(公告)号：US20070074391A1

公开(公告)日：2007-04-05

申请号：US11503896

申请日：2006-08-14

Applicant: Masashi Totokawa ,  Yasunori Ninomiya

Inventor： Masashi Totokawa ,  Yasunori Ninomiya

IPC: H05K3/10 ,  H01K3/22

CPC classification number: H05K1/097 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0266 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as to form a circuit conductor. In the sintering step, the conductive paste is sintered in a low-oxygen condition including alcohol such that the metal nano-particles are sintered.

Abstract translation: 制造电路板的方法包括在绝缘基板上提供包含金属纳米颗粒的导电糊料的步骤，以及烧结导电浆料以形成电路导体的步骤。 在烧结步骤中，导电浆料在包含醇的低氧条件下烧结，使得金属纳米粒子被烧结。

公开(公告)号：US20070023909A1

公开(公告)日：2007-02-01

申请号：US11191566

申请日：2005-07-27

Applicant: David Fork ,  Thomas Hantschel ,  Michael Chabinyc

Inventor： David Fork ,  Thomas Hantschel ,  Michael Chabinyc

IPC: H01L23/48

CPC classification number: H05K3/32 ,  B82Y30/00 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/083 ,  H01L2924/00

Abstract: A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

Abstract translation: 描述形成自组装互连结构的方法。 在该方法中，接触垫表面和溶液中的颗粒被聚集在一起。 颗粒被选择成使得颗粒粘附到接触垫表面。 接触的形成通过将相对的接触压入颗粒中而完成，使得经由相对的接触垫和基板表面接触垫之间的颗粒形成电连接。 所描述的自组装互连结构在显示器件制造中特别有用。

公开(公告)号：US20050127536A1

公开(公告)日：2005-06-16

申请号：US10969320

申请日：2004-10-21

Applicant: Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

Inventor： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC: C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/58 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

Abstract: A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

Abstract translation: 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10nm以下的低结晶性Ag填料。