公开(公告)号：US6045897A

公开(公告)日：2000-04-04

申请号：US178852

申请日：1998-10-26

Applicant: Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

Inventor： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC: B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  D21H13/02

CPC classification number: H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

Abstract: A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

Abstract translation: 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。

公开(公告)号：US6040252A

公开(公告)日：2000-03-21

申请号：US295954

申请日：1999-04-21

Applicant: Minoru Ootuka ,  Hirokazu Hiraoka ,  Toru Shimadu ,  Masayuki Noda

Inventor： Minoru Ootuka ,  Hirokazu Hiraoka ,  Toru Shimadu ,  Masayuki Noda

IPC: C08J5/24 ,  B29C70/06 ,  B29K101/10 ,  B29K105/12 ,  D04H1/587 ,  H05K1/03 ,  B32B27/34

CPC classification number: H05K1/0366 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/54 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T442/2475 ,  Y10T442/273 ,  Y10T442/2738 ,  Y10T442/2746 ,  Y10T442/2861 ,  Y10T442/2893 ,  Y10T442/2902 ,  Y10T442/60 ,  Y10T442/697 ,  Y10T442/698

Abstract: A laminate base material of aromatic polyamide fiber non-woven fabric which comprises a combined non-woven fabric of para-aramid fibers and meta-aramid fibers bonded with each other by a resin binder such as an epoxy resin binder and meta-aramid fibers being thermally adhered to each other and meta-aramid fibers being thermally adhered to para-aramid fibers while they are passing through a pair of thermal rolls and heated and pressed by them and the meta-aramid fibers being included preferably by 5 through 30 weight %.

Abstract translation: 芳族聚酰胺纤维无纺织物的叠层基材包括对位芳族聚酰胺纤维的组合无纺织物和间位芳族聚酰胺纤维，它们通过树脂粘合剂如环氧树脂粘合剂和间位芳族聚酰胺纤维彼此粘合， 彼此热粘合并且间位芳族聚酰胺纤维在它们通过一对热辊时被热粘附到对位芳族聚酰胺纤维上，并被它们加热和加压，间位芳族聚酰胺纤维优选包含5至30重量％。

公开(公告)号：US5972484A

公开(公告)日：1999-10-26

申请号：US980770

申请日：1997-12-01

Applicant: Yachin Cohen ,  Dimitri Rein ,  Lev Vaykhansky

Inventor： Yachin Cohen ,  Dimitri Rein ,  Lev Vaykhansky

IPC: B32B27/02 ,  C08J5/04 ,  H05K1/00 ,  H05K1/03 ,  B32B3/00 ,  B32B5/06

CPC classification number: H05K1/0366 ,  B32B27/02 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/31681 ,  Y10T442/3415 ,  Y10T442/656

Abstract: An ultrahigh molecular weight polyethylene composite for a printed circuit board or antenna base material, a base material including the composite and electronic modules including the base material. The base material includes at least one dielectric layer including an ultrahigh molecular weight polyethylene composite and at least one electroconductive layer including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another.

Abstract translation: 用于印刷电路板或天线基材的超高分子量聚乙烯复合材料，包括复合材料的基材和包括基材的电子模块。 基材包括至少一个介电层，包括超高分子量聚乙烯复合材料和至少一个包含导电材料的导电层，电介质层和导电层彼此紧密结合。

公开(公告)号：US5851646A

公开(公告)日：1998-12-22

申请号：US732577

申请日：1996-10-15

Applicant: Tsutomu Takahashi ,  Yoshifumi Tsujimoto ,  Hiroaki Kumada ,  Hiroyuki Sato

Inventor： Tsutomu Takahashi ,  Yoshifumi Tsujimoto ,  Hiroaki Kumada ,  Hiroyuki Sato

IPC: B32B15/14 ,  C08J5/04 ,  C08J5/24 ,  C09D5/25 ,  H05K1/03 ,  B32B5/28 ,  B32B5/26 ,  B32B17/04

CPC classification number: C08J5/24 ,  B32B15/14 ,  C08J5/04 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/91 ,  Y10T428/24917 ,  Y10T428/24993 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/2907 ,  Y10T428/2938 ,  Y10T428/2969 ,  Y10T428/2971 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T442/2008 ,  Y10T442/2893 ,  Y10T442/2902

Abstract: The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.

Abstract translation: 本发明提供一种具有均匀形成，低线性热膨胀系数和良好机械强度的轻质预浸料，包括多孔对位芳族聚酰胺薄膜和热塑性树脂和/或热固性树脂，多孔对位芳族聚酰胺薄膜为 用热塑性树脂和/或热固性树脂浸渍，其制造方法和使用该热塑性树脂的印刷电路基板/印刷电路板。

公开(公告)号：US5833883A

公开(公告)日：1998-11-10

申请号：US781301

申请日：1997-01-13

Applicant: Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

Inventor： Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

IPC: C08L97/00 ,  H05K1/03 ,  H01B1/00

CPC classification number: C08H6/00 ,  C08L97/005 ,  H05K1/0313 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/178

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fiberglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

Abstract translation: 描述了生物基交联组合物，制造方法和结构，特别是使用组合物的生物基印刷线路板和制造结构的方法。 生物基材料如木质素，作物油，木材树脂，单宁和多糖及其组合是优选使用热交联剂和引发剂交联的。 制造的材料具有适用于印刷线路板的性能，其通过用生物基材料，交联剂和引发剂的混合物浸渍玻璃纤维或生物基布而制成，其通过常规方法加工以生产印刷线路板。

公开(公告)号：US5753358A

公开(公告)日：1998-05-19

申请号：US591043

申请日：1996-01-25

Applicant: Joseph E. Korleski

Inventor： Joseph E. Korleski

IPC: C08L27/18 ,  C09J7/02 ,  H05K1/03 ,  B32B5/16 ,  B32B5/18 ,  B32B27/04 ,  B32B27/20

CPC classification number: C09J7/0289 ,  C09J7/0296 ,  H05K1/0353 ,  C08L27/18 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2400/263 ,  C09J2427/006 ,  C09J2463/00 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249953 ,  Y10T428/249958 ,  Y10T428/249978 ,  Y10T428/24998 ,  Y10T428/249982 ,  Y10T428/249985 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31544 ,  Y10T428/31699 ,  Y10T428/31931

Abstract: An adhesive composite material comprises an expanded fluoropolymer with nodes and interconnected fibrils, the fluoropolymer having a void volume which is at least partially filled with a mixture containing a thermoset or thermoplastic adhesive and a particulate inorganic filler. The composite material contains sufficient adhesive and filler such that the composite contains between about 5 to about 40 volume percent expanded fluoropolymer; 5-85 volume percent inorganic filler; and 10-95 volume percent of adhesive and filler, the adhesive and filler being contained within the voids of the expanded fluoropolymer. In the composite, the ratio of the mean flow pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 2 and/or the ratio of the minimum pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 1.4.

Abstract translation: 粘合剂复合材料包括具有节点和相互连接的原纤维的膨胀氟聚合物，所述含氟聚合物具有至少部分地填充有含有热固性或热塑性粘合剂和颗粒状无机填料的混合物的空隙体积。 复合材料包含足够的粘合剂和填料，使得复合材料含有约5至约40体积％的膨胀氟聚合物; 5-85体积％无机填料; 和10-95体积％的粘合剂和填料，粘合剂和填料包含在膨胀的含氟聚合物的空隙内。 在复合材料中，膨胀的含氟聚合物的平均流量孔径与填料的最大粒度的比率至少为约2和/或膨胀的含氟聚合物的最小孔径与最大颗粒尺寸之比 填料至少约为1.4。

公开(公告)号：US5346747A

公开(公告)日：1994-09-13

申请号：US996651

申请日：1992-12-24

Applicant: Vincent M. Vancho ,  Hak H. Wu ,  Yutao Ma ,  Erik L. Jorgensen

Inventor： Vincent M. Vancho ,  Hak H. Wu ,  Yutao Ma ,  Erik L. Jorgensen

IPC: B32B15/08 ,  C08J5/04 ,  D01F6/62 ,  D04H3/00 ,  D21H13/24 ,  H05K1/03 ,  B32B9/00

CPC classification number: H05K1/0366 ,  C08J5/04 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917

Abstract: Composite printed circuit board substrates having fiber reinforcement in a polymer matrix are disclosed. The fibers may be thermotropic melt processable liquid crystal polymer fibers.

Abstract translation: 公开了在聚合物基体中具有纤维增强的复合印刷电路板基板。 纤维可以是热致熔融加工的液晶聚合物纤维。

公开(公告)号：US5229192A

公开(公告)日：1993-07-20

申请号：US748690

申请日：1991-08-21

Applicant: Horst Kober ,  Thomas Kuhlmann ,  Jorg Hausdorf ,  Steffen Kosack ,  Werner Schafer ,  Volker Siekermann

Inventor： Horst Kober ,  Thomas Kuhlmann ,  Jorg Hausdorf ,  Steffen Kosack ,  Werner Schafer ,  Volker Siekermann

IPC: B32B27/04 ,  B32B27/18 ,  C08K3/02 ,  C08K3/32 ,  D04H1/58 ,  D04H1/64 ,  D21H19/24 ,  D21H21/00 ,  D21H21/34 ,  H01B3/44 ,  H05K1/00 ,  H05K3/28

CPC classification number: H05K3/281 ,  C08K3/02 ,  C08K3/32 ,  H01B3/44 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A flame-resistant cover film for flexible circuit boards having excellent flame-resistance, handling, and storage qualities may be produced by treating an insulating film of a nonwoven polymer fabric with a flame-resistant, halogen-free polymeric adhesive. The polymeric adhesive comprises an aqueous mixture of a copolymerizate of acrylic acid esters and styrene, and an aminoplastic or phenoplastic precondensate to which a mixture of fine-particle red phosphorus and fine-particle ammonium polyphosphate is also added.

Abstract translation: 通过用耐火无卤聚合物粘合剂处理非织造聚合物织物的绝缘膜，可以制备具有优异的阻燃性，操作性和储存性的柔性电路板的阻燃覆盖膜。 聚合物粘合剂包括丙烯酸酯和苯乙烯的共聚物的水性混合物，以及还加入微粒红磷和细颗粒多磷酸铵的混合物的氨基塑料或酚醛预缩合物。

公开(公告)号：US4853273A

公开(公告)日：1989-08-01

申请号：US136746

申请日：1987-12-21

Applicant: Earl C. Harris, Jr.

Inventor： Earl C. Harris, Jr.

IPC: B23B35/00 ,  B32B3/28 ,  H05K3/00

CPC classification number: B32B3/28 ,  B23B35/005 ,  H05K3/0047 ,  B23B2228/36 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0214 ,  Y10S428/901 ,  Y10T156/1049 ,  Y10T156/1051 ,  Y10T428/24149 ,  Y10T428/24686 ,  Y10T428/24711 ,  Y10T428/24934

Abstract: A backup board for use when drilling through a circuit board having a conductive layer therein, the backup board comprises a lamination of outer planar sheets, and an inner core of a double wall corrugated material, the outer sheets being impregnated with a thermosetting adhesive, the sheets and the core being subjected to heat and pressure to form a laminate where said corrugations fold over and bond to said outer planar sheets, to provide a backup board giving surface support by said outer sheets with a less rigid core therebetween.

Abstract translation: 一种用于在通过其中具有导电层的电路板钻孔时使用的备用板，所述备用板包括外平面片的叠层和双壁波纹材料的内芯，外片浸渍有热固性粘合剂， 片材和芯经受热和压力以形成层压体，其中所述波纹折叠并结合到所述外平面片材上，以提供备用板，其通过所述外片在其间具有较小刚性的芯片给予表面支撑。

公开(公告)号：US4652324A

公开(公告)日：1987-03-24

申请号：US655446

申请日：1984-09-28

Applicant: Naotoshi Yamashina ,  Fumihiko Yabuta

Inventor： Naotoshi Yamashina ,  Fumihiko Yabuta

IPC: B32B37/10 ,  B32B15/08 ,  B32B15/088 ,  B32B15/092 ,  B32B21/08 ,  B32B27/02 ,  B32B29/06 ,  C08J5/24 ,  D21H11/00 ,  D21H19/04 ,  D21H27/00 ,  D21H27/30 ,  H05K1/03 ,  B32B23/06 ,  B32B31/04

CPC classification number: D21H19/04 ,  B32B29/06 ,  C08J5/24 ,  D21H27/30 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S162/05

Abstract: A process for the production of a laminated sheet is disclosed, which comprises impregnating a base paper for laminated sheet using a wood pulp having an .alpha.-cellulose content of 87.0% or more with a synthetic resin to prepare a prepreg and subjecting the prepreg to laminate molding by heat. A process for the production of a metal foil-clad laminated sheet is also disclosed, which comprises impregnating a base paper for laminated sheet using a wood pulp having an .alpha.-cellulose content of 87.0% or more with a synthetic resin to prepare a prepreg, piling up the prepreg, placing a metal foil one either one or both sides of the prepregs, and subjecting the resulting prepregs with metal foil to laminate molding by heat. The laminated sheet or metal foil-clad laminated sheet of this invention has not only excellent punchability but also excellent electric characteristics and heat resistance and hence, it is quite useful as a laminated sheet for high density printed wiring system.

Abstract translation: 公开了一种层压片材的制造方法，其包括用合成树脂浸渍含有α-纤维素含量为87.0％以上的木浆的层压片材用原料，制备预浸料坯，并对预浸料进行层压 热成型。 还公开了一种用于生产金属箔包覆层压片的方法，其包括用合成树脂使用α-纤维素含量为87.0％或更高的木浆浸渍用于层压片材的原纸以制备预浸料， 堆叠预浸料，将预浸料坯的一面或两面放置金属箔，并用金属箔对所得的预浸料进行加热成型。 本发明的层压片或金属箔包覆层压片不仅具有优异的冲压性，而且具有优异的电特性和耐热性，因此作为高密度印刷布线系统的层压片是非常有用的。