公开(公告)号：US20180042119A1

公开(公告)日：2018-02-08

申请号：US15540828

申请日：2015-12-30

Applicant: AIRBUS GROUP, SAS ,  MALLARD

Inventor： Benoît DANTIN ,  Pascal LEMEILLE

IPC: H05K3/14 ,  C23C28/02 ,  C23C4/02 ,  H05K3/10 ,  C23C4/129 ,  C23C4/18 ,  H05K3/46 ,  C23C24/04 ,  C23C4/08

CPC classification number: H05K3/14 ,  C23C4/02 ,  C23C4/08 ,  C23C4/129 ,  C23C4/18 ,  C23C24/04 ,  C23C28/021 ,  H05K1/056 ,  H05K1/165 ,  H05K3/102 ,  H05K3/225 ,  H05K3/4685 ,  H05K2201/0341 ,  H05K2203/1344 ,  H05K2203/173

Abstract: A structure including at least one electrical line on one surface of the structure, one electrically conductive layer of the line resulting from deposition of an electrically conductive material via a cold spraying method, and the line includes a protective bonding layer on which the electrically conductive material is deposited via the cold spraying method, the protective bonding layer forming a continuous protective shield between the structure and the cold-sprayed material. An insulating layer is advantageously located between the structure and the protective bonding layer. Achieving an electrical line on a surface of the structure involves implementing a step of oxy-fuel flame spraying of a protective material to form a protective bonding layer, followed by a step of cold spraying of the electrically conductive material of the electrically conductive layer onto the protective bonding layer.

公开(公告)号：US09869027B2

公开(公告)日：2018-01-16

申请号：US15134672

申请日：2016-04-21

Applicant: Samsung Display Co., Ltd. ,  LTCAM CO., LTD.

Inventor： Bong-Yeon Kim ,  Jin-Ho Ju ,  Jun-Hyuk Woo ,  Jung-Hwan Song ,  Seok-Ho Lee ,  Seong-Sik Jeon ,  Jong-Su Han

IPC: C09K13/04 ,  C23F1/16 ,  C11D11/00 ,  H01L21/02 ,  H05K3/26 ,  C11D7/32 ,  C11D7/26 ,  C11D7/08 ,  C11D7/06 ,  C23F11/04 ,  H05K3/06 ,  H05K1/03 ,  H05K3/38

CPC classification number: C23F1/16 ,  C11D7/06 ,  C11D7/08 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D11/0047 ,  C23F11/04 ,  H01L21/02068 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0341 ,  H05K2203/124 ,  H05K2203/125

Abstract: A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water.

公开(公告)号：US20170271303A1

公开(公告)日：2017-09-21

申请号：US15593186

申请日：2017-05-11

Applicant: Skyworks Solutions, Inc.

Inventor： Sandra Louise Petty-Weeks ,  Guohao Zhang ,  Hardik Bhupendra Modi

IPC: H01L23/00 ,  H01L23/66 ,  H05K1/02 ,  H05K3/24

CPC classification number: H01L24/85 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48159 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/1421 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K3/244 ,  H05K2201/0341 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This disclosure relates to a diffusion barrier layer for a radio frequency (RF) transmission line. The diffusion barrier layer includes a material and has a thickness. The thickness of the diffusion barrier layer is sufficiently small such that an RF signal is allowed to penetrate the diffusion barrier layer. Related RF modules and mobile devices that include an RF transmission line with such a diffusion barrier layer are disclosed.

公开(公告)号：US20160374206A1

公开(公告)日：2016-12-22

申请号：US14742070

申请日：2015-06-17

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jaen-Don Lan ,  PIN-CHUNG LIN ,  CHEN-RUI TSENG ,  CHENG-EN HO ,  YU-AN CHEN

IPC: H05K3/00 ,  B23K26/402 ,  H05K3/16 ,  B23K26/386

CPC classification number: B23K26/402 ,  B23K26/382 ,  B23K26/389 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0341

Abstract: Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.

Abstract translation: 公开了一种制造电路板的方法，包括制备具有树脂层和停止层的基板，形成穿过树脂层的至少一个导电孔并在停止层处停止，通过溅射工艺形成第一金属层， 通过化学镀工艺在第一金属层上形成第二金属层，形成具有电路图案的第三金属层，暴露第二金属层的一部分并通过电镀工艺填充导电孔，并蚀刻第二金属层 以及第二金属层下面的第一金属层，以暴露第一金属层下的树脂层。 由于第一金属层提供优异的表面性质，所以第二和第三金属层是良好固定和稳定的。 蚀刻电路图案对于细线宽/间距具有小于10μm的线宽/间距。

公开(公告)号：US09340759B2

公开(公告)日：2016-05-17

申请号：US14264193

申请日：2014-04-29

Applicant: Samsung Display Co., Ltd. ,  Cowon Innotech Inc.

Inventor： Bong-Yeon Kim ,  Jin-Ho Ju ,  Jun-Hyuk Woo ,  Jung-Hwan Song ,  Seok-Ho Lee ,  Seong-Sik Jeon ,  Jong-Su Han

IPC: C09K13/04 ,  C11D11/00 ,  H01L21/02 ,  H05K3/26 ,  C11D7/32 ,  C11D7/26 ,  C11D7/08 ,  C11D7/06 ,  H05K3/06 ,  H05K1/03 ,  H05K3/38

CPC classification number: C23F1/16 ,  C11D7/06 ,  C11D7/08 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D11/0047 ,  C23F11/04 ,  H01L21/02068 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0341 ,  H05K2203/124 ,  H05K2203/125

Abstract: A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water.

Abstract translation: 清洁组合物包含约0.01至约5重量％的螯合剂; 约0.01至约0.5重量％的有机酸; 约0.01至约1.0重量％的无机酸; 约0.01至约5重量％的碱金属化合物; 和去离子水。

公开(公告)号：US09320142B2

公开(公告)日：2016-04-19

申请号：US14598595

申请日：2015-01-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Min Baek ,  Yoon Su Kim ,  Jin Hyuck Yang ,  Chang Bae Lee

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/18

CPC classification number: H05K1/111 ,  H05K3/108 ,  H05K3/188 ,  H05K3/388 ,  H05K3/4007 ,  H05K2201/0341 ,  H05K2201/09381 ,  H05K2203/0713 ,  H05K2203/0716 ,  H05K2203/0723 ,  H05K2203/1407 ,  Y10T428/12396

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract translation: 本发明涉及电极结构，其包括：基底; 种子层，设置在所述基底基板的一个或两个表面上; 设置在种子层上的电镀层; 并且在种子层和电镀层之间不连续地提供阻挡层。

公开(公告)号：US20160044780A1

公开(公告)日：2016-02-11

申请号：US14820978

申请日：2015-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasushi INAGAKI ,  Kota NODA

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/18 ,  H05K3/20 ,  H05K3/06 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/111 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/007 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/202 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4069 ,  H05K2201/0302 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/098 ,  H05K2203/06 ,  Y02P70/611

Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.

Abstract translation: 印刷布线板包括绝缘层，第一导体层，其嵌入绝缘层的第一表面中，并且包括用于连接电子部件的连接部分，从绝缘层的第二表面突出的第二导体层，阻焊层 覆盖第一导体层并具有露出连接部分的开口结构，形成在连接部分上的阻挡金属层，使得阻挡层从绝缘层的第一表面突出，以及形成在阻挡层上的金属柱，使得 金属柱分别位于连接部分上。 每个金属柱的宽度大于相应连接部分的宽度，并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。

公开(公告)号：US20160021758A1

公开(公告)日：2016-01-21

申请号：US14799860

申请日：2015-07-15

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki FURUTANI ,  Yasushi INAGAKI

IPC: H05K3/10 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/09 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/103 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0341 ,  H05K2201/094 ,  H05K2203/0384 ,  Y02P70/611

Abstract: A printed wiring board includes an insulation layer, a first conductive layer embedded into first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer, a via conductor penetrating through the insulation layer and electrically connecting the first and second layers, and a solder-resist layer covering the first layer and having an opening structure forming an exposed structure of the first layer. The exposed structure is formed to connect an electronic component to the first layer, and the first layer has a barrier-metal layer and a metal layer on the first layer such that the barrier-metal layer is on surface of the first layer and includes metal different from metal forming the metal layer and that the metal layer is on surface of the barrier-metal layer in the exposed structure and protruding from the first surface of the insulation layer.

Abstract translation: 印刷布线板包括绝缘层，嵌入绝缘层的第一表面中的第一导电层，形成在绝缘层的第二表面上的第二导电层，穿过绝缘层的通孔导体，并将第一和第二 层，以及覆盖第一层并具有形成第一层的暴露结构的开口结构的阻焊层。 形成暴露结构以将电子部件连接到第一层，并且第一层在第一层上具有阻挡金属层和金属层，使得阻挡金属层在第一层的表面上并且包括金属 与形成金属层的金属不同，并且金属层位于暴露结构中的阻挡金属层的表面上并且从绝缘层的第一表面突出。

公开(公告)号：US09089041B2

公开(公告)日：2015-07-21

申请号：US13742681

申请日：2013-01-16

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kotaro Kodani ,  Kentaro Kaneko ,  Kazuhiro Kobayashi

IPC: H05K3/02 ,  H05K3/10 ,  H05K3/00 ,  H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/46 ,  H05K3/20

CPC classification number: H05K3/10 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15174 ,  H05K1/113 ,  H05K3/00 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/09472 ,  H05K2201/10674 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/1184 ,  Y10T29/49155 ,  H01L2224/0401

Abstract: A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad.

Abstract translation: 布线基板包括具有第一表面和位于与第一表面相反一侧的第二表面的电极焊盘，连接到电极焊盘的第一表面的导体图案，以及嵌入电极焊盘和导体的绝缘体层 模式。 绝缘体层覆盖电极焊盘的第二表面的外周部。

公开(公告)号：US20140339699A1

公开(公告)日：2014-11-20

申请号：US14447908

申请日：2014-07-31

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Minhua Lu ,  Eric D. Perfecto ,  David J. Russell ,  Wolfgang Sauter ,  Krystyna W. Semkow ,  Thomas A. Wassick

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49816 ,  H01L21/76843 ,  H01L21/76885 ,  H01L23/49866 ,  H01L2224/11 ,  H05K1/09 ,  H05K3/3478 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0344 ,  H05K2201/09745 ,  H05K2203/041

Abstract: An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer layer, a first nickel (Ni) barrier layer that is present in direct contact with copper (Cu) seed layer, and a layered structure of at least one copper (Cu) conductor layer and at least one second nickel (Ni) barrier layer present on the first nickel (Ni) barrier layer. A solder ball may be present on second nickel (Ni) barrier layer.

Abstract translation: 一种互连结构，其包括其中存在电气部件的基板以及与接触焊盘接触的凸起下冶金（UBM）堆叠，所述凸块冶金（UBM）堆叠存在于所述基板中的所述电气部件。 UBM堆叠包括与接触焊盘直接接触电气部件的金属粘合层，与金属粘附层层直接接触的铜（Cu）种子层，第一镍（Ni）阻挡层， 存在于铜（Cu）种子层的直接接触中，以及存在于第一镍（Ni）阻挡层上的至少一个铜（Cu）导体层和至少一个第二镍（Ni）阻挡层的层状结构。 第二镍（Ni）阻挡层上可能存在焊球。