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21.发明授权公开(公告)号：US09648736B2
公开(公告)日：2017-05-09
申请号：US14528346
申请日：2014-10-30
Inventor： Robert Christopher Burns , Wolfgang Tusler , Bernd Haegele
IPC: H05K7/00 , H05K1/05 , H01L23/492 , H01L25/07 , H05K1/02 , H02M7/00 , H05K7/02 , H05K7/04 , H01L25/18
CPC classification number: H05K1/05 , H01L23/492 , H01L25/072 , H01L25/18 , H01L2924/0002 , H02M7/003 , H05K1/021 , H05K1/0263 , H05K1/053 , H05K1/056 , H05K1/09 , H05K3/4644 , H05K7/023 , H05K7/04 , H05K2201/0326 , H05K2201/04 , H05K2201/06 , H05K2201/10166 , H01L2924/00
Abstract: The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate.
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公开(公告)号：US20170072835A1
公开(公告)日：2017-03-16
申请号：US15362703
申请日：2016-11-28
Applicant: UUSI, LLC
Inventor： David W. Shank , John M. Washeleski , Edward J. Cox, II
CPC classification number: B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.
Abstract translation: 车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。 第一电路板各自具有支撑在基板上的多个电路元件的基板。 第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。 第二电路板各自具有支撑在它们上的多个电路元件的基板。 第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。 第二电路板基板包括与外边缘轮廓的多个第二偏差。 第二偏差的至少一部分不同于第一电路板的第一偏差。
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23.发明申请SMALL FORM-FACTOR MODULAR PLUGS WITH LOW-PROFILE SURFACE MOUNTED PRINTED CIRCUIT BOARD PLUG BLADES 审中-公开低表面贴装印刷电路板插头片的小型模块式插头公开(公告)号：US20170040762A1
公开(公告)日：2017-02-09
申请号：US15333228
申请日：2016-10-25
Applicant: CommScope, Inc. of North Carolina
Inventor： Richard A. Schumacher , Scott Lynn Michaelis
IPC: H01R24/64 , H01R13/6466 , H05K1/11 , H01R13/66 , H01R24/28 , H01R12/53 , H01R13/6469
CPC classification number: H01R24/64 , H01R12/53 , H01R13/6466 , H01R13/6469 , H01R13/665 , H01R13/6658 , H01R23/005 , H01R24/28 , H01R2107/00 , H01R2201/04 , H05K1/0245 , H05K1/115 , H05K1/117 , H05K2201/04 , H05K2201/0949 , H05K2201/09845 , H05K2201/1034 , H05K2201/10356 , Y10T29/49124
Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.
Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。
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24.发明授权公开(公告)号：US09288907B2
公开(公告)日：2016-03-15
申请号：US14217621
申请日：2014-03-18
Inventor： Shao-Chung Hu , Kuo-Yang Horng , Ling-Yueh Yang , Wei-Ching Liu , Pen-Shan Chao , Kun-Feng Chen , Louis Lu-Chen Hsu
CPC classification number: H05K1/14 , H05K1/0209 , H05K1/0216 , H05K1/11 , H05K1/141 , H05K1/148 , H05K1/181 , H05K3/32 , H05K3/366 , H05K2201/04 , H05K2201/046 , H05K2201/047 , H05K2201/10515 , Y02P70/611 , Y10T29/49126
Abstract: A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.
Abstract translation: 介绍了微电子3D封装结构及其制造方法。 微电子3D封装结构包括具有多个第一边缘并且布置有第一电子器件的第一板; 具有多个第二边缘并且设置有第二电子设备的第二板，其中所述第二板的至少一个第二边缘连接到所述第一板的至少一个第一边缘以形成接合线; 以及设置在两个相邻板的接合线处并且适于用作传输信号的连接路径的接合连接部分。
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25.发明申请SMALL FORM-FACTOR MODULAR PLUGS WITH LOW-PROFILE SURFACE MOUNTED PRINTED CIRCUIT BOARD PLUG BLADES 有权低表面贴装印刷电路板插头片的小型模块式插头公开(公告)号：US20150244120A1
公开(公告)日：2015-08-27
申请号：US14708366
申请日：2015-05-11
Applicant: CommScope, Inc. of North Carolina
Inventor： Richard A. Schumacher , Scott Lynn Michaelis
IPC: H01R24/64 , H01R13/6463 , H01R13/627 , H01R13/42
CPC classification number: H01R24/64 , H01R12/53 , H01R13/6466 , H01R13/6469 , H01R13/665 , H01R13/6658 , H01R23/005 , H01R24/28 , H01R2107/00 , H01R2201/04 , H05K1/0245 , H05K1/115 , H05K1/117 , H05K2201/04 , H05K2201/0949 , H05K2201/09845 , H05K2201/1034 , H05K2201/10356 , Y10T29/49124
Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.
Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。
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Patent Agency Ranking
26.发明申请公开(公告)号：US20150055306A1
公开(公告)日：2015-02-26
申请号：US14528346
申请日：2014-10-30
Inventor： Robert Christopher BURNS , Wolfgang TUSLER , Bernd HAEGELE
CPC classification number: H05K1/05 , H01L23/492 , H01L25/072 , H01L25/18 , H01L2924/0002 , H02M7/003 , H05K1/021 , H05K1/0263 , H05K1/053 , H05K1/056 , H05K1/09 , H05K3/4644 , H05K7/023 , H05K7/04 , H05K2201/0326 , H05K2201/04 , H05K2201/06 , H05K2201/10166 , H01L2924/00
Abstract: The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate.
Abstract translation: 本发明涉及一种电路板，特别是用于电力电子模块的电路板，其包括至少部分且优选完全由铝和/或铝合金组成的导电基底。 在导电基板的至少一个表面上，优选使用印刷方法，更优选使用丝网印刷方法，以导电层的形式布置至少一个导体表面，所述导体表面是直接的 与导电基板电接触。
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公开(公告)号：US20240276652A1
公开(公告)日：2024-08-15
申请号：US18134482
申请日：2023-04-13
Applicant: LEOTEK CORPORATION
Inventor： Cheng-Ta TSAI
CPC classification number: H05K3/361 , H05K3/4611 , H05K1/147 , H05K2201/04 , H05K2203/06
Abstract: A circuit board module includes a first circuit board, a second circuit board and a connection layer. The first circuit board includes two first conductive layers, a first dielectric core layer and a first conductive via, the first dielectric core layer is formed between the two first conductive layers, and the first conductive via connects the two first conductive layers. The second circuit board includes two second conductive layers, a second dielectric core layer and a second conductive via, the second dielectric core layer is formed between the two second conductive layers, and the second conductive via connect the two second conductive layers. The connection layer is formed between the first circuit board and the second circuit board and combines the first circuit board with the second circuit board. The second circuit board is disposed on a side of the first circuit board.
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公开(公告)号：US20180065538A1
公开(公告)日：2018-03-08
申请号：US15808542
申请日：2017-11-09
Applicant: UUSI, LLC
Inventor： David W. Shank
CPC classification number: B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
Abstract: A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.
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公开(公告)号：US09840185B2
公开(公告)日：2017-12-12
申请号：US15362703
申请日：2016-11-28
Applicant: UUSI, LLC
Inventor： David W. Shank
CPC classification number: B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.
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公开(公告)号：US09807893B2
公开(公告)日：2017-10-31
申请号：US15030589
申请日：2015-12-10
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhao Li , Dawei Wang
CPC classification number: H05K5/0017 , G04B37/1486 , G04G17/045 , G06F1/163 , G06F1/1652 , G09F9/301 , H04M1/0268 , H05K1/14 , H05K5/0086 , H05K5/0217 , H05K7/1427 , H05K2201/04
Abstract: The present application discloses a mount for mounting a flexible display panel, comprising a flexible frame comprising a first end, a second end, and a mounting surface for receiving the flexible display panel, a first flexible arm attached to the first end of the flexible frame. The first flexible arm is movable between a first position such that the first flexible arm is substantially retracted into the flexible frame and a second position such that the first flexible arm is substantially extended from the flexible frame. When the first flexible arm is substantially extended from the flexible frame, the first flexible arm is capable of connecting to the second end of the flexible frame directly or indirectly and forming a ring comprising the first flexible arm and the flexible frame.
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