公开(公告)号：US20110083885A1

公开(公告)日：2011-04-14

申请号：US12630478

申请日：2009-12-03

Applicant: Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

Inventor： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H05K3/38 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/32 ,  C25D5/10 ,  H01L23/142 ,  H01L23/498 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/053 ,  H05K3/24 ,  H05K3/244 ,  H05K3/282 ,  H05K2201/09436 ,  H05K2203/072 ,  H01L2924/00

Abstract: Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated.

Abstract translation: 这里公开了一种金属布线结构，包括：形成在绝缘层上的无电镀镍层; 以及形成在无电镀镍层上的表面处理层及其制造方法。 金属布线结构具有优异的粘附性，而不考虑基板的种类并且可以容易地制造。

公开(公告)号：US07868469B2

公开(公告)日：2011-01-11

申请号：US12320261

申请日：2009-01-22

Applicant: Osamu Mizoguchi

Inventor： Osamu Mizoguchi

IPC: H01L23/48 ,  H01L23/14

CPC classification number: H05K1/113 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/244 ,  H05K2201/09436 ,  H05K2201/096 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An adapter board includes a package substrate having a first surface and a second surface and further including a board having wirings formed therein, pads disposed in the device side, and the pads disposed in the bump side, an insulating resin layer joined to the first surface, through holes formed in the positions corresponding to the pads in the insulating resin layer, vias formed in the through holes, and pads covering the through holes, wherein the pads are electrically coupled to the pads through the wirings, and the pads are electrically coupled to the pads through the vias.

Abstract translation: 适配器板包括具有第一表面和第二表面的封装基板，并且还包括其中形成有布线的板，设置在器件侧的焊盘和设置在凸块侧的焊盘，与第一表面接合的绝缘树脂层 ，形成在与绝缘树脂层中的焊盘相对应的位置的通孔，形成在通孔中的通孔和覆盖通孔的焊盘，其中焊盘通过布线电耦合到焊盘，并且焊盘电耦合 通过通孔到垫。

公开(公告)号：US20100307801A1

公开(公告)日：2010-12-09

申请号：US12458958

申请日：2009-07-28

Applicant: Yong Suk Kim ,  Yong Soo Oh ,  Byeung Gyu Chang

Inventor： Yong Suk Kim ,  Yong Soo Oh ,  Byeung Gyu Chang

IPC: H05K1/09 ,  H01B13/00 ,  B05D5/12 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K3/381 ,  H05K1/0306 ,  H05K1/112 ,  H05K3/108 ,  H05K3/388 ,  H05K3/4629 ,  H05K2201/09436 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/102 ,  H05K2203/107

Abstract: The present invention relates to a multilayer ceramic substrate including: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias provided in respective ceramic layers, the ceramic stacked structure having surface reforming layers 111a formed by removal of glass component on the surfaces of upper and lower parts of the ceramic layers; and contact pads formed on a top surface and a bottom surface of the ceramic stacked structure so as to be electrically connected to the vias.

Abstract translation: 多层陶瓷基板技术领域本发明涉及一种多层陶瓷基板，其特征在于，具有陶瓷层叠结构体，其中多个陶瓷层通过设置在各陶瓷层中的通孔彼此堆叠而互相连接，所述陶瓷层叠结构具有通过除去玻璃成分而形成的表面重整层111a 在陶瓷层的上部和下部的表面上; 以及形成在陶瓷层叠结构的顶表面和底表面上的接触焊盘，以便电连接到通孔。

公开(公告)号：US20100207847A1

公开(公告)日：2010-08-19

申请号：US12707556

申请日：2010-02-17

Applicant: Yong-Jin KIM

Inventor： Yong-Jin KIM

IPC: G09G3/28

CPC classification number: H01J11/12 ,  H01J2211/46 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/0949 ,  H05K2201/09709

Abstract: A plasma display device is disclosed. The plasma display device includes a plasma display panel (PDP), a printed circuit board assembly (PBA), and a flexible printed circuit (FPC) electrically connecting electrodes of the PBA and the PDP. In some embodiments, the FPC is formed of two films with signal lines therebetween and electrodes on opposite sides.

Abstract translation: 公开了一种等离子体显示装置。 等离子体显示装置包括等离子体显示面板（PDP），印刷电路板组件（PBA）和电连接PBA和PDP的电极的柔性印刷电路（FPC）。 在一些实施例中，FPC由其间具有信号线的两个膜和相对侧上的电极形成。

公开(公告)号：US07719853B2

公开(公告)日：2010-05-18

申请号：US11781086

申请日：2007-07-20

Applicant: Chao-Wen Shih

Inventor： Chao-Wen Shih

IPC: H05K7/00

CPC classification number: H05K3/3473 ,  H05K3/244 ,  H05K2201/094 ,  H05K2201/09436 ,  H05K2201/09563 ,  H05K2201/0989 ,  H05K2203/043 ,  H05K2203/054

Abstract: An electrically connecting terminal structure of a circuit board and a manufacturing method thereof are disclosed. The method includes: providing a circuit board defined with first and second predetermined areas; forming the first electrically connecting pad in the first predetermined area and the second electrically connecting pad in a portion of the second predetermined area; forming an insulated protecting layer on the circuit board, forming openings on the insulated protecting layer for exposing the first and second electrically connecting pads and a pad-uncovered portion of the second predetermined area; forming a conductive layer on the insulated protecting layer and forming openings of the insulated protecting layer; forming a resist on the conductive layer, forming openings on the resist above the openings of the insulated protecting layer; and forming first and second metals in the openings above the first and second electrically connecting pads and the pad-uncovered portion of the second predetermined area.

Abstract translation: 公开了一种电路板的电连接端子结构及其制造方法。 该方法包括：提供限定有第一和第二预定区域的电路板; 在所述第二预定区域的一部分中形成所述第一预定区域中的所述第一电连接焊盘和所述第二电连接焊盘; 在所述电路板上形成绝缘保护层，在所述绝缘保护层上形成开口，用于暴露所述第一和第二电连接焊盘和所述第二预定区域的焊盘未覆盖部分; 在绝缘保护层上形成导电层，形成绝缘保护层的开口; 在导电层上形成抗蚀剂，在绝缘保护层的开口上方的抗蚀剂上形成开口; 以及在所述第一和第二电连接焊盘和所述第二预定区域的焊盘未覆盖部分之上的开口中形成第一和第二金属。

公开(公告)号：US20100096165A1

公开(公告)日：2010-04-22

申请号：US12575863

申请日：2009-10-08

Applicant: Chin-Wen Lo ,  Hsueh-Chih Wu

Inventor： Chin-Wen Lo ,  Hsueh-Chih Wu

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/117 ,  H05K3/0058 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979

Abstract: A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically.

Abstract translation: 用于柔性印刷电路板的金手指包括：具有尾部的框架，由加强板，底部基板，底部铜层，覆盖层和顶部铜层组成，同时能够形成底部铜层 具有至少一个第一路由和至少一个第二路由，并且使得顶部铜层能够形成有至少一个第一引脚和至少一个第二引脚; 至少一个第一通孔，每个第一通孔都填充有导电材料并且设置在其相应的第一引脚和第一布线之间的位置，用于将第一引脚电连接到第一布线; 以及至少一个第二通孔，每个第二通孔均填充有导电材料，并且设置在其对应的第二引脚和第二布线之间的位置，用于将第二引脚电连接到第二布线。

公开(公告)号：US20100009471A1

公开(公告)日：2010-01-14

申请号：US12320261

申请日：2009-01-22

Applicant: Osamu Mizoguchi

Inventor： Osamu Mizoguchi

IPC: H01L21/66 ,  H01R12/06 ,  G01R31/26 ,  H05K3/10

CPC classification number: H05K1/113 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/244 ,  H05K2201/09436 ,  H05K2201/096 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An adapter board includes a package substrate having a first surface and a second surface and further including a board having wirings formed therein, pads disposed in the device side, and the pads disposed in the bump side, an insulating resin layer joined to the first surface, through holes formed in the positions corresponding to the pads in the insulating resin layer, vias formed in the through holes, and pads covering the through holes, wherein the pads are electrically coupled to the pads through the wirings, and the pads are electrically coupled to the pads through the vias.

Abstract translation: 适配器板包括具有第一表面和第二表面的封装基板，并且还包括其中形成有布线的板，设置在器件侧的焊盘和设置在凸块侧的焊盘，与第一表面接合的绝缘树脂层 ，形成在与绝缘树脂层中的焊盘相对应的位置的通孔，形成在通孔中的通孔和覆盖通孔的焊盘，其中焊盘通过布线电耦合到焊盘，并且焊盘电耦合 通过通孔到垫。

公开(公告)号：US07636145B2

公开(公告)日：2009-12-22

申请号：US11353823

申请日：2006-02-14

Applicant: Jin-Goo Jung ,  Chun-Gi You ,  Chul-Ho Kim ,  Kyung-Min Park ,  Il-Gon Kim

Inventor： Jin-Goo Jung ,  Chun-Gi You ,  Chul-Ho Kim ,  Kyung-Min Park ,  Il-Gon Kim

IPC: G02F1/1345

CPC classification number: G02F1/136227 ,  G02F1/13458 ,  G02F2001/13456 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09436 ,  H05K2201/09472

Abstract: In a display apparatus and a manufacturing method of the display apparatus, the display apparatus includes a display panel having signal lines and an insulating layer, and a signal generator electrically connected to the signal lines and adhering to the display panel. The signal lines include pads formed at ends thereof, respectively. The organic insulating layer is partially removed such that the via holes are formed between the pads of the signal lines to reduce a step-difference between an area in which the pads are formed and an area in which the pads are not formed. Thus, the display apparatus may enhance the coupling force between the signal generator and the display panel.

Abstract translation: 在显示装置的显示装置和制造方法中，显示装置包括具有信号线和绝缘层的显示面板，以及电连接到信号线并附着在显示面板上的信号发生器。 信号线分别包括在其端部形成的焊盘。 有机绝缘层被部分去除，使得通孔形成在信号线的焊盘之间，以减小其中形成焊盘的区域与不形成焊盘的区域之间的阶差。 因此，显示装置可以增强信号发生器和显示面板之间的耦合力。

公开(公告)号：US20090225268A1

公开(公告)日：2009-09-10

申请号：US12351192

申请日：2009-01-09

Applicant: Tomoki YOKOTA

Inventor： Tomoki YOKOTA

IPC: G02F1/1343 ,  H01L23/52 ,  H01L33/00

CPC classification number: H05K3/361 ,  G02F1/1345 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/112 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/09427 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

Abstract: There is provided a mounting structure in which a component is mounted on a substrate. In the mounting structure, substrate-side first wirings, substrate-side first terminals formed in a mounting area where the component is mounted on the substrate, substrate-side second terminals formed in the mounting area and substrate-side second wirings are disposed over the substrate.Component-side first terminals and component-side second terminals are provided to the component. The substrate-side first wirings and the substrate-side second wirings extend in a first direction. The substrate-side first terminals are connected to corresponding substrate-side first wirings, and the substrate-side second terminals are connected to corresponding substrate-side second wirings. The substrate-side second wirings pass between corresponding adjacent two substrate-side first wirings and between corresponding adjacent two substrate-side first terminals. One of the component-side first terminals overlaps with the corresponding substrate-side first terminal in plan view and is connected electrically with the corresponding substrate-side first terminal, and one of the component-side second terminals overlaps with a corresponding substrate-side second terminal in plan view and is connected electrically with the corresponding substrate-side second terminal. Widths Wa1, Wa2, Wf1 and Wf2 satisfy all of the following relationships: Wa1 Wf2 Wa1 Wf2; wherein the width Wa1 is a dimension of the substrate-side first terminal in a second direction perpendicular to the first direction, the width Wa2 is a dimension of the substrate-side second terminal in the second direction, the width Wf1 is a dimension of the component-side first terminal in the second direction, and the width Wf2 is a dimension of the component-side second terminal in the second direction, and each of the substrate-side first wirings does not pass between corresponding adjacent two substrate-side second terminals.

公开(公告)号：US07582551B2

公开(公告)日：2009-09-01

申请号：US12062018

申请日：2008-04-03

Applicant: Kotaro Kodani ,  Kentaro Kaneko ,  Kazuhiro Kobayashi

Inventor： Kotaro Kodani ,  Kentaro Kaneko ,  Kazuhiro Kobayashi

IPC: H01L21/44

CPC classification number: H05K3/4007 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/6835 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H05K1/113 ,  H05K3/205 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4682 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0733 ,  H01L2224/0401

Abstract: A method of manufacturing a wiring substrate comprises: a first step of forming, on a support plate, an electrode pad made of metal; a second step of etching the support plate in such a manner that the support plate has a shape which includes a projection portion to be contacted with the electrode pad; a third step of forming, on the surface of the support plate, an insulating layer for covering the electrode pad; a fourth step of forming, on the surface of the insulating layer, a conductive pattern to be connected to the electrode pad; and, a fifth step of removing the support plate.

Abstract translation: 一种制造布线基板的方法包括：在支撑板上形成由金属制成的电极垫的第一步骤; 以支撑板具有包括与电极焊盘接触的突出部分的形状的方式蚀刻支撑板的第二步骤; 在支撑板的表面上形成用于覆盖电极焊盘的绝缘层的第三步骤; 在绝缘层的表面上形成要连接到电极焊盘的导电图案的第四步骤; 以及移除支撑板的第五步骤。