公开(公告)号：US09414501B2

公开(公告)日：2016-08-09

申请号：US13829921

申请日：2013-03-14

Applicant: Board of Regents, The University of Texas System

Inventor： Ryan B. Wicker ,  Francisco Medina ,  Eric MacDonald ,  Danny W. Muse ,  David Espalin

IPC: H01K3/10 ,  H05K3/32 ,  H05K3/10 ,  H05K1/02 ,  H01L23/00

CPC classification number: H05K3/103 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/49175 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/85238 ,  H01L2224/85801 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/0296 ,  H05K3/321 ,  H05K3/328 ,  H05K3/34 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09681 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/049 ,  Y10T29/49155 ,  Y10T29/5193 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Abstract translation: 本发明提供用于在三维结构，结构部件或结构电子，电磁或机电部件/装置内使用细丝创建层间机械或电连接或连接的系统和方法。

公开(公告)号：US09398687B2

公开(公告)日：2016-07-19

申请号：US13942185

申请日：2013-07-15

Applicant: LG DISPLAY CO., LTD.

Inventor： Sun-Kyu Park

IPC: G09G5/00 ,  H05K1/02 ,  G06F3/00

CPC classification number: H05K1/0289 ,  G06F3/00 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10136

Abstract: A display device according to an embodiment of the invention includes a first PCB including first PCB lines to transmit powers and second PCB lines to transmit an image data, gate control signals and data control signals; a second PCB including third PCB lines to transmit the powers and fourth PCB lines to transmit the image data, the gate control signals and the data control signals; a first COF including first COF lines connected to the first PCB lines and second COF lines connected to the second PCB lines; a second COF including third COF lines connected to the third PCB lines and fourth COF lines connected to the fourth PCB lines; and a display panel including first LOGs connected to the first COF lines and the third COF lines and second LOGs connected to the second COF lines and the fourth COF lines.

Abstract translation: 根据本发明的实施例的显示装置包括：第一PCB，其包括用于传输功率的第一PCB线和用于传输图像数据的第二PCB线，门控制信号和数据控制信号; 第二PCB，其包括用于传输功率的第三PCB线路和第四PCB线路以发送图像数据，门控制信号和数据控制信号; 第一COF，包括连接到第一PCB线的第一COF线和连接到第二PCB线的第二COF线; 第二COF，包括连接到第三PCB线路的第三COF线路和连接到第四PCB线路的第四COF线路; 以及显示面板，包括连接到第一COF线和第三COF线的第一LOG和连接到第二COF线和第四COF线的第二LOG。

公开(公告)号：US09392700B2

公开(公告)日：2016-07-12

申请号：US14000112

申请日：2013-07-06

Applicant: NANCHANG O-FILM TECH. CO., LTD.

Inventor： Yulong Gao ,  Sheng Zhang ,  Shengbo Guo ,  Chunming Chen

IPC: H05K1/00 ,  H05K3/10 ,  G06F3/041 ,  H05K3/12 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K3/107 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/036 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/1216 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/0108 ,  Y10T29/49155

Abstract: A transparent conductive film includes a transparent substrate and a polymer layer formed on the transparent substrate, a surface of the polymer layer is patterned to define a meshed trench, the meshed trench is filled with a conductive material to form a sending area, a periphery of the sensing area is printed with a lead, the lead is electrically connected to the conductive material in the meshed trench. Besides, a method of manufacturing the transparent conductive film is provided. In the transparent conductive film and the method, the trench is filled with a conductive material to form a sending area, and the lead is formed by printing and electrically connected to the conductive material, the yield of the lead of the transparent conductive film is relatively high.

Abstract translation: 透明导电膜包括透明基板和形成在透明基板上的聚合物层，将聚合物层的表面图案化以限定网状沟槽，网状沟槽填充导电材料以形成发送区域， 感测区域用引线印刷，引线电连接到网状沟槽中的导电材料。 此外，提供了制造透明导电膜的方法。 在透明导电膜和方法中，沟槽填充有导电材料以形成发送区域，并且引线通过印刷形成并电连接到导电材料，透明导电膜的引线的产量相对 高。

公开(公告)号：US20160174368A1

公开(公告)日：2016-06-16

申请号：US14567929

申请日：2014-12-11

Applicant: Igor A Levitsky

Inventor： Igor A Levitsky

IPC: H05K1/02

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K2201/0108 ,  H05K2201/09681

Abstract: Disclosed is a new class of transparent conductive coatings based on conductive grids and percolative pattern therefore.

Abstract translation: 公开了一类基于导电网格和渗透图案的新型透明导电涂层。

公开(公告)号：US20160165728A1

公开(公告)日：2016-06-09

申请号：US14565360

申请日：2014-12-09

Applicant: Scott Francis Fullam ,  Patrick Timothy Codd ,  Agustya Ruchir Mehta

Inventor： Scott Francis Fullam ,  Patrick Timothy Codd ,  Agustya Ruchir Mehta

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K1/0243 ,  H05K2201/0391 ,  H05K2201/09272 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/09736

Abstract: Embodiments are disclosed for a printed circuit board. An example printed circuit board includes a ground plane comprising a pattern of an electrically conductive material. The example printed circuit board further includes a circuit trace disposed adjacent to the ground plane, where one or more characteristics of one of more of the pattern of the electrically conductive material in the ground plane and the circuit trace vary based upon a directional change of the circuit trace.

Abstract translation: 公开了印刷电路板的实施例。 示例性印刷电路板包括包括导电材料图案的接地平面。 示例性印刷电路板还包括邻近接地平面布置的电路迹线，其中接地平面中的导电材料的图案中的一个或多个特征中的一个或多个特性和电路迹线基于 电路痕迹。

公开(公告)号：US20160155711A1

公开(公告)日：2016-06-02

申请号：US15014160

申请日：2016-02-03

Applicant: Lockheed Martin Corporation

Inventor： Stephen GONYA ,  Jesse IANNON

IPC: H01L23/00 ,  H01L23/552

CPC classification number: G21F3/00 ,  H01L23/552 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0209 ,  H05K1/0275 ,  H05K2201/0715 ,  H05K2201/09681 ,  H01L2924/00

Abstract: An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

公开(公告)号：US09320136B2

公开(公告)日：2016-04-19

申请号：US13979722

申请日：2012-02-01

Applicant: Matthew H. Frey ,  Stephen P. Maki

Inventor： Matthew H. Frey ,  Stephen P. Maki

IPC: H05K1/09 ,  H05K1/00 ,  H05K1/11 ,  G06F3/041 ,  G06F3/045 ,  H05K1/02 ,  H05K9/00 ,  H05K3/06 ,  H05K3/46 ,  B82Y99/00

CPC classification number: H05K1/0274 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y99/00 ,  G02B1/116 ,  G02B27/142 ,  G06F3/041 ,  H03K17/962 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/061 ,  H05K3/4644 ,  H05K9/0086 ,  H05K9/0096 ,  H05K2201/0108 ,  H05K2201/09681 ,  Y10S977/755

Abstract: The present disclosure provides an article having a substrate having opposing first and second surfaces. A conductor micropattern disposed on the first surface of the substrate. The conductor micropattern has a plurality of traces defining a plurality of cells. The conductor micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. Each of the traces has a trace width from 0.5 to 10 micrometer. The conductor micropattern is a tri-layer material comprising in sequence a semi-reflective metal, a transparent layer, and a reflective layer disposed on the transparent layer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields.

Abstract translation: 本公开提供了一种具有基底的制品，该基底具有相对的第一和第二表面。 布置在基板的第一表面上的导体微图案。 导体微图案具有限定多个单元的多个迹线。 导体微图案具有大于80％的开口面积分数和均匀分布的迹线取向。 每个迹线的迹线宽度为0.5至10微米。 导体微图案是三层材料，其依次包括半反射金属，透明层和设置在透明层上的反射层。 这些文章在诸如显示器的设备中是有用的，特别是对于移动手持设备，平板电脑和计算机有用的触摸屏显示器。 它们也可用于天线和EMI屏蔽。

公开(公告)号：US09312216B2

公开(公告)日：2016-04-12

申请号：US14590291

申请日：2015-01-06

Applicant: Renesas Electronics Corporation

Inventor： Shuuichi Kariyazaki ,  Ryuichi Oikawa

IPC: H01L23/498 ,  H01L23/528 ,  H01L23/00 ,  H01L23/522

CPC classification number: H01L23/49822 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5225 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/16057 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0225 ,  H05K1/0253 ,  H05K2201/09336 ,  H05K2201/09681 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To improve noise immunity of a semiconductor device. A wiring substrate of a semiconductor device includes a first wiring layer where a wire is formed to which signals are sent, and a second wiring layer that is mounted adjacent to the upper layer or the lower layer of the first wiring layer. The second wiring layer includes a conductor plane where an aperture section is formed at a position overlapped with a portion of the wire 23 in the thickness direction, and a conductor pattern that is mounted within the aperture section of the conductor plane. The conductor pattern includes a main pattern section (mesh pattern section) that is isolated from the conductor plane, and plural coupling sections that couple the main pattern section and the conductor plane.

Abstract translation: 为了提高半导体器件的抗噪声性。 半导体器件的布线基板包括形成有信号发送线的第一布线层和与第一布线层的上层或下层相邻地安装的第二布线层。 第二布线层包括在厚度方向上与导线23的一部分重叠的位置处形成开口部的导体平面和安装在导体平面的开口部内的导体图案。 导体图案包括与导体平面隔离的主图案部分（网格图案部分）和耦合主图案部分和导体平面的多个耦合部分。

公开(公告)号：US09303827B2

公开(公告)日：2016-04-05

申请号：US14306337

申请日：2014-06-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

IPC: F21V19/00 ,  F21V21/002 ,  F21K99/00 ,  H05K1/11 ,  H05K1/18 ,  H01L33/60 ,  H05K1/02 ,  H05K3/22 ,  H05K3/46 ,  F21Y101/02

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

公开(公告)号：US09268446B2

公开(公告)日：2016-02-23

申请号：US14000059

申请日：2013-07-06

Applicant: NANCHANG O-FILM TECH. CO., LTD.

Inventor： Yulong Gao

IPC: G06F3/045 ,  G06F3/044 ,  H05K3/10 ,  H05K3/12 ,  H05K3/46

CPC classification number: G06F3/044 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10128 ,  Y10T29/49105

Abstract: A touchscreen sensing module includes a first baseplate, a first conductive layer, a second baseplate, a second conductive layer, and a supporting substrate. A first groove in a predetermined shape is defined on a side of the first baseplate. The first conductive layer matches with the first groove in shape, and the first conductive layer is received in the first groove. A second groove in a predetermined shape is defined on a side of the second baseplate. The second conductive layer matches with the second groove in shape, and the second conductive layer is received in the second groove. The first conductive layer and the second conductive layer respectively match with the first groove and the second groove in shape, no etching is needed to obtain electrodes when forming the conductive layers, which avoids material waste and reduces costs In addition, a monitor is also provided by the present invention.

Abstract translation: 触摸屏感测模块包括第一基板，第一导电层，第二基板，第二导电层和支撑基板。 在第一基板的一侧限定有预定形状的第一凹槽。 第一导电层的形状与第一凹槽匹配，并且第一导电层被接收在第一凹槽中。 在第二基板的一侧限定有预定形状的第二凹槽。 第二导电层的形状与第二槽匹配，第二导电层被容纳在第二槽中。 第一导电层和第二导电层分别与第一凹槽和第二凹槽的形状相配合，在形成导电层时不需要蚀刻来获得电极，这避免了材料浪费并降低了成本。另外，还提供了一种监视器 通过本发明。