公开(公告)号：US20050014419A1

公开(公告)日：2005-01-20

申请号：US10918081

申请日：2004-08-12

Applicant: Tom Pearson ,  George Arrigotti ,  Christopher Combs ,  Raiyomand Aspandiar

Inventor： Tom Pearson ,  George Arrigotti ,  Christopher Combs ,  Raiyomand Aspandiar

IPC: H05K1/14 ,  H05K3/34 ,  H01R9/22

CPC classification number: H05K3/3405 ,  H05K1/142 ,  H05K2201/09127 ,  H05K2201/10204 ,  H05K2201/10446 ,  H05K2201/209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53252

Abstract: A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

Abstract translation: 提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。 印刷电路板可以包括至少一个阴构件以接收相应的阳构件。 该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。 延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

公开(公告)号：US06840425B2

公开(公告)日：2005-01-11

申请号：US10026338

申请日：2001-12-20

Applicant: Jesse L. Pedigo

Inventor： Jesse L. Pedigo

IPC: H05K3/00 ,  H05K3/12 ,  H05K3/40 ,  B23K1/00

CPC classification number: H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.

Abstract translation: 一种包括扫气叶片，印刷线路板接收部分和适于相对于彼此移动扫气叶片和印刷线路板接收部分的移动机构的系统，以及一种去除多余填充材料的方法，包括提供印刷线路板 在印刷电路板的表面上填充孔和至少一些多余的填充材料，提供包括清扫刀片的系统，将印刷线路板定位在系统中，并且使扫气刀片穿过至少一部分印刷 布线板以使清扫刀片从印刷线路板去除多余的填充材料的至少一部分的方式。

公开(公告)号：US20050003677A1

公开(公告)日：2005-01-06

申请号：US10611546

申请日：2003-07-01

Applicant: Timothy Dean ,  William Lytle

Inventor： Timothy Dean ,  William Lytle

IPC: C23C18/16 ,  C25D11/18 ,  H01L21/302 ,  H01L21/44 ,  H05K3/24

CPC classification number: H05K3/244 ,  C23C18/1651 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/94 ,  H01L2924/14 ,  H05K2201/10204 ,  H01L2224/03 ,  H01L2924/00

Abstract: The invention provides a method of plating an integrated circuit. An activation plate is positioned adjacent to at least one integrated circuit. The integrated circuit includes a plurality of bond pads comprising a bond-pad metal, and the activation plate also comprises the bond-pad metal. A layer of electroless nickel is plated on the bond pads and the activation plate, and a layer of gold is plated over the layer of electroless nickel on the bond pads and the activation plate. An integrated circuit with bond pads plated using the activation plate, and a system for plating an integrated circuit is also disclosed.

Abstract translation: 本发明提供一种电镀集成电路的方法。 激活板定位成与至少一个集成电路相邻。 集成电路包括多个键合焊盘，其包括接合焊盘金属，并且激活板还包括接合焊盘金属。 将一层无电镀镍电镀在接合焊盘和激活板上，并且在接合焊盘和激活板上的电镀镍层上镀覆一层金。 还公开了一种具有使用激活板电镀的焊盘的集成电路和用于电镀集成电路的系统。

公开(公告)号：US06801436B2

公开(公告)日：2004-10-05

申请号：US09964747

申请日：2001-09-28

Applicant: Tom E. Pearson ,  George Arrigotti ,  Christopher D. Combs ,  Raiyomand F. Aspandiar

Inventor： Tom E. Pearson ,  George Arrigotti ,  Christopher D. Combs ,  Raiyomand F. Aspandiar

IPC: H05K712

CPC classification number: H05K3/3405 ,  H05K1/142 ,  H05K2201/09127 ,  H05K2201/10204 ,  H05K2201/10446 ,  H05K2201/209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53252

Abstract: A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

Abstract translation: 提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。 印刷电路板可以包括至少一个阴构件以接收相应的阳构件。 该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。 延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

公开(公告)号：US06797224B2

公开(公告)日：2004-09-28

申请号：US10026382

申请日：2001-12-20

Applicant: Jesse Pedigo ,  Timothy Meyer

Inventor： Jesse Pedigo ,  Timothy Meyer

IPC: B29C6708

CPC classification number: H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

Abstract: A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

Abstract translation: 填充系统包括加压填充源和压力填充头，其中填充头还包括加热元件，其被定位成传递热量以填充通过填充头的材料。 使用通过压力填充头的填充材料填充孔的方法包括以下步骤：使填充材料进入填充头，在填充头内部改变填充材料的粘度，并且使改性粘度填充材料 退出填充头并进入至少一个孔。

公开(公告)号：US06740820B2

公开(公告)日：2004-05-25

申请号：US10020287

申请日：2001-12-11

Applicant: Andrew Cheng

Inventor： Andrew Cheng

IPC: H05K116

CPC classification number: H05K7/1084 ,  H01R43/0256 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2201/10204 ,  H05K2201/10325 ,  H05K2203/041 ,  H05K2203/165

Abstract: An electrical system includes a printed circuit board with conductive traces formed thereon. An electrical connector includes an insulative base with an array of cells defined therein. Each cell receives and retains a conductive contact having a tail portion corresponding to the conductive traces. Soldering pre-forms are arranged between the conductive traces and the tail portions. A heat distributor includes a thermally conductive base plate positioned on the connector base and thermally conductive pins extending from the base plate. The base plate is positioned on the connector base with the pins inserted into the cells and thermally engaging selected contacts so as to create a homogenous heat transfer to/from the soldering pre-forms thereby eliminating heat stress among the soldering pre-forms

Abstract translation: 电气系统包括其上形成有导电迹线的印刷电路板。 电连接器包括其中限定有单元阵列的绝缘基座。 每个单元接收并保持具有对应于导电迹线的尾部的导电接触。 焊接预制件布置在导电迹线和尾部之间。 热分配器包括位于连接器基座上的导热基板和从基板延伸的导热销。 底板位于连接器基座上，插销插入电池中并与选定的触点热接合，以便产生与焊接预成型体的均匀热传递，从而消除了焊接预成型件之间的热应力

公开(公告)号：US20040001327A1

公开(公告)日：2004-01-01

申请号：US10452455

申请日：2003-06-03

Inventor： Kazuyuki Nagata

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC classification number: H05K1/0266 ,  H05K1/0295 ,  H05K1/18 ,  H05K2201/09936 ,  H05K2201/09954 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2203/168

Abstract: Disclosed is a foolproof polarity indication of poled electronics parts or devices to be given to a printed circuit board to assure that poled electronics parts and/or devices be correctly mounted in respect of their polarities to meet occasional requirements dependent on different specifications. Each pair of terminal holes are allotted to a given poled electronics part or device. Two symbols representative of such electronics part or device are arranged side by side on either side of the line drawn from one to the other terminal hole. The poled electronics part or device symbols are of reversed polarities. This dual symbol arrangement is effective to draw workers' attention in mounting electrode components in terms of their polarities. When extra components or dummy ones are combined with such a poled component, they are encircled by a boundary line, thereby showing the correct polarity direction of the poled component in respect of whether it is enclosed or not.

Abstract translation: 公开了一种给予印刷电路板的极化电子部件或装置的绝对极性指示，以确保极化的电子部件和/或设备在其极性方面被正确地安装，以满足取决于不同规格的偶尔要求。 每对端子孔分配给给定的极化电子部件或器件。 代表这种电子部件或装置的两个符号被并排地布置在从一个端子孔到另一个端子孔的线的任一侧上。 极化的电子部件或器件符号具有相反的极性。 这种双重符号排列是有效的吸引工作人员注意安装电极组件的极性方面。 当额外的元件或虚拟元件与这种极化元件组合时，它们被边界线包围，从而显示极限元件的正确极性方向是否被封闭。

公开(公告)号：US20030183948A1

公开(公告)日：2003-10-02

申请号：US10402555

申请日：2003-03-27

Inventor： Yew Fei Tham ,  Vijay Kumar Dharmadhikari

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L22/34 ,  G01N21/278 ,  G01N21/95684 ,  G01N2021/95669 ,  G01R1/0483 ,  H05K3/3436 ,  H05K2201/10204 ,  H05K2201/10234 ,  Y02P70/613

Abstract: A ball grid array unit suitable for calibrating an inspection system, comprising a substrate and an array of balls mounted on a surface of the substrate, the balls having a melting point greater than 400 degrees centigrade or a Britnell hardness number greater than 150.

Abstract translation: 一种适用于校准检查系统的球栅阵列单元，包括基底和安装在基底表面上的球阵列，所述球的熔点大于400摄氏度或Britnell硬度大于150。

公开(公告)号：US20030111262A1

公开(公告)日：2003-06-19

申请号：US10195547

申请日：2002-07-16

Inventor： Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

IPC: H05K003/30 ,  H05K003/34

CPC classification number: H05K1/0209 ,  H05K1/0201 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10204 ,  H05K2203/1121 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.

Abstract translation: 印刷电路板装置包括安装在布线板上并构成印刷线路板装置中的电路的一部分的电路部分。 在电路部分的圆周上的布线板上设置有焊盘，并且焊盘与电路电隔离。 吸热虚拟部件安装在焊盘上，并且虚拟部件在回流焊接期间通过焊盘吸收来自电路部件的热量。

公开(公告)号：US20030043552A1

公开(公告)日：2003-03-06

申请号：US10231322

申请日：2002-08-30

Applicant: NEC CORPORATION

Inventor： Takashi Abe

IPC: H05K001/00 ,  H05K001/18 ,  H05K007/02 ,  H05K007/06 ,  H05K007/08

CPC classification number: H05K1/0266 ,  H05K1/029 ,  H05K1/18 ,  H05K2201/09127 ,  H05K2201/09927 ,  H05K2201/10204

Abstract: A circuit board permits common use of the same circuit board without separately manufacturing the circuit board per providing destinations when similar circuit boards are manufactured for a plurality of providing destinations in the same factory. The circuit board has at least a first providing destination indicating region on which a first providing destination is indicated and a second providing destination indicating region located adjacent the first providing destination indicating region, on which second providing destination region, a second providing destination is indicated, the providing destination indicating regions other than that indicating an intended providing destination being hidden by mounting parts thereon.

Abstract translation: 电路板允许在同一工厂中为多个提供目的地制造类似的电路板时，不需要在提供目的地的情况下单独制造电路板，因此可以通用同一电路板。 电路板至少具有指示第一提供目的地的第一提供目的地指示区域和位于第一提供目的地指示区域附近的第二提供目的地指示区域，第二提供目的地区域指示第二提供目的地区域， 提供目的地指示除了通过在其上安装部件来指示预期提供目的地被隐藏的区域之外的区域。