Abstract:
A printed circuit board is disclosed, comprising a plate body, a conductive pattern disposed on the plate body, a conductive metal plate, and a metal layer. The conductive metal plate has a first terminal and a second terminal, wherein the first terminal and the second terminal are fixed to the plate body. An accommodating space is between the conductive metal plate and the plate body. The metal layer covers the conductive metal plate and the conductive pattern, and is filled into the accommodating space. Therefore, a printed circuit board which has metal blocks with enough thickness is provided. The metal blocks can provide sufficiently low resistance to increase resistance efficiency of the printed circuit.
Abstract:
A circuit board includes a base substrate, a busbar disposed on a mounting surface-side of the base substrate; and an electronic component disposed on the mounting surface-side and including a plurality of terminals, at least one of which is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion can be inserted. A first insertion portion through which the terminal can be inserted is provided in the component connecting end portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface, on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes, positioned closer to a rear surface of the base substrate than the component mounting surface.
Abstract:
A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.
Abstract:
A power tool and a printed circuit board for use therewith. The power tool has an electric motor and a power source. The printed circuit board assembly has a main board having a conductive portion, a semiconductor power device, and a conductor attached to the conductive portion. The conductive portion electrically connects to the semiconductor power device and the conductor electrically connects to the conductive portion. When current is flowing through the printed circuit board, the heat and the voltage loss generated by the printed circuit board can be reduced.
Abstract:
Provided is a optical transceiver module. The optical transceiver module includes a printed circuit board (PCB) configured to include a plurality of dielectric layers and a plurality of metal layers stacked alternately, a photodetector disposed on the PCB to convert an optical signal into an electrical signal, a compensator disposed on one side on the PCB and including a first transmission line that delivers an electrical signal, a power supply line configured to supply power to the photodetector, and a first high frequency connector configured to connect to the first transmission line to deliver the electrical signal, wherein the PCB includes a plurality of vias that electrically connect the plurality of dielectric layers and the plurality of metal layers, and the compensator protrudes from the PCB to compensate for a height difference from the photodetector.
Abstract:
A flexible lighting assembly 100, a luminaire, a method of manufacturing a flexible layer 102 and a use of the flexible layer 102 is provided. The flexible lighting assembly 100 comprises a flexible layer 102 of a flexible polymer and comprises aC light source 108 which is thermally coupled to the flexible layer 102. The flexible layer 102 comprises boron nitride particles 106 that have a hexagonal crystal structure.
Abstract:
A multiport power transmission apparatus is provided. The multiport power transmission apparatus includes a PCB, sockets, switching modules, metal cross-lines, a neutral-line metal bar, and a live-line metal bar. The sockets and the switching modules are disposed on a component side of the PCB. The neutral-line metal bar and the live-line metal bar are disposed on a solder side of the PCB. The live-line metal bar is disposed between an orthogonal projection pattern of each socket and the neutral-line metal bar. A power input pin of each switching module is connected to the live-line metal bar through the solder side. A power-output pin of each switching module is connected to a live pin of a corresponding socket through the solder side. Two terminals of each metal cross-line are respectively connected to a neutral pin of a corresponding socket and the neutral-line metal bar through the solder side.
Abstract:
A circuit board for electric components has at least one current conductor, which is configured as a molded part, and at least one unhoused electric component affixed to the current conductor. The circuit board exhibits improved operating reliability.
Abstract:
A transparency having a bus bar system includes a non-conductive substrate having a major surface. At least one conductive coating is located over at least a portion of the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is located over at least a portion of the conductive coating. A metallic member, such as a metallic foil or metallic braid, is located over the isotropically conductive adhesive.
Abstract:
A printed wiring board (PWB) includes a substrate having first and second opposing surfaces and a busbar coupled to the substrate. The busbar includes a power input connector and a cross-sectional dimension configured and disposed to carry at least 100 amperes. At least one semiconductor device is mounted to the busbar. The at least one semiconductor device includes an input electrically coupled to the busbar and an output. One or more output conductors are electrically coupled to the output of the at least one semiconductor device. The one or more output conductors include a cross-sectional dimension configured and disposed to carry at least 50 amperes.