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    Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same
    22.
    发明申请
    Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same 有权
    包括剥线电路的印刷电路板及其制造方法相同

    公开(公告)号：US20130180105A1

    公开(公告)日：2013-07-18

    申请号：US13353019

    申请日：2012-01-18

    Applicant: Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

    Inventor： Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

    IPC: H05K3/10

    CPC classification number: H05K1/0253 ,  H01P11/003 ,  H05K1/0203 ,  H05K1/023 ,  H05K1/024 ,  H05K1/186 ,  H05K2201/0187 ,  H05K2201/1056 ,  Y10T29/49155

    Abstract: A method of manufacturing a printed circuit board includes the steps of providing a first layer stack including a first electrically-conductive layer and a first electrically-insulating layer and providing a second layer stack including a second electrically-insulating layer. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second electrically-insulating layer includes one or more electrically-conductive traces disposed on a first surface thereof. The method also includes mounting a device on the first surface of the second electrically-insulating layer such that the device is electrically-coupled to at least one of the one or more electrically-conductive traces, and providing the first layer stack with a cut-out area defining a void that extends from the second surface of the first electrically-insulating layer to the first surface of the first electrically-conductive layer. The cut-out area is configured to receive at least a portion of the device therein.

    Abstract translation: 制造印刷电路板的方法包括以下步骤：提供包括第一导电层和第一电绝缘层的第一层堆叠，并提供包括第二电绝缘层的第二层堆叠。 第一导电层设置在第一电绝缘层的第一表面上。 第二电绝缘层包括设置在其第一表面上的一个或多个导电迹线。 该方法还包括将装置安装在第二电绝缘层的第一表面上，使得该装置与一个或多个导电迹线中的至少一个电耦合，并且提供第一层叠层， 该区域限定从第一电绝缘层的第二表面延伸到第一导电层的第一表面的空隙。 切除区域被配置为在其中接收设备的至少一部分。

    USB APPLICATION DEVICE AND METHOD FOR ASSEMBLING USB APPLICATION DEVICE
    23.
    发明申请
    USB APPLICATION DEVICE AND METHOD FOR ASSEMBLING USB APPLICATION DEVICE 有权
    用于组装USB应用设备的USB应用设备和方法

    公开(公告)号：US20130065450A1

    公开(公告)日：2013-03-14

    申请号：US13365004

    申请日：2012-02-02

    Applicant: Chun-Nan Su ,  Chun-Ching Peng

    Inventor： Chun-Nan Su ,  Chun-Ching Peng

    IPC: H01R24/28 ,  H05K3/30

    CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

    Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

    Abstract translation: 本发明公开了一种USB应用设备，包括主体，电路板，多个第一电引脚和多个电元件。 电路板设置在体内。 多个第一电引脚设置在电路板上并消耗到主体，使得多个第一电引脚部分地暴露于主体。 在多个第一电引脚和电路板之间形成空间，使得多个电气元件可以设置在该空间上。 因此，电路板的长度变短，并且USB应用装置的体积减小。

    Thin multi-chip flex module
    26.
    再颁专利
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：USRE42252E1

    公开(公告)日：2011-03-29

    申请号：US12804381

    申请日：2010-07-20

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K1/00 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

    Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

    Modified core for circuit module system and method
    28.
    发明授权
    Modified core for circuit module system and method 有权
    电路模块系统和方法的改进核心

    公开(公告)号：US07760513B2

    公开(公告)日：2010-07-20

    申请号：US11397597

    申请日：2006-04-03

    Applicant: Julian Partridge ,  David Roper ,  Paul Goodwin

    Inventor： Julian Partridge ,  David Roper ,  Paul Goodwin

    IPC: H05K1/11

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The rigid substrate exhibits adhesion features that allow more advantageous use of thermoplastic adhesives with concomitant rework advantages and while providing flexibility in meeting dimensional specifications such as those promulgated by JEDEC, for example.

    Abstract translation: 灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。 填充的柔性电路设置在刚性衬底附近，以将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或两层集成电路。 刚性基材表现出粘合特征，其允许更有利地使用具有伴随返工优点的热塑性粘合剂，并且同时提供满足例如由JEDEC公布的尺寸规格的柔性。

    LIGHT SOURCE DEVICE
    29.
    发明申请
    LIGHT SOURCE DEVICE 有权
    光源设备

    公开(公告)号：US20090303713A1

    公开(公告)日：2009-12-10

    申请号：US12332307

    申请日：2008-12-10

    Applicant: CHUNG-MIN CHANG ,  TSE-AN LEE

    Inventor： CHUNG-MIN CHANG ,  TSE-AN LEE

    IPC: F21V29/00

    CPC classification number: H05K1/021 ,  F21K9/00 ,  F21V19/003 ,  F21V29/51 ,  F21V29/70 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10477 ,  H05K2201/1056 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A light source device includes a circuit member, a heat dissipation component, an optical component and light emitting diode assemblies. The circuit member defines spaced through holes. The light emitting diode assemblies have a first side and a second side opposite to the first side. Each light emitting diode assembly passes through a corresponding through hole and is electrically connected to the circuit member. The heat dissipation component contacts the first side, is spaced from the circuit member, and is configured to dissipate heat generated by the light emitting diode assemblies. The optical component contacts the second side, and is configured to distribute light emitted from the light emitting diode assemblies.

    Abstract translation: 光源装置包括电路部件，散热部件，光学部件和发光二极管组件。 电路构件限定间隔开的通孔。 发光二极管组件具有与第一侧相对的第一侧和第二侧。 每个发光二极管组件通过相应的通孔并与电路部件电连接。 散热部件接触第一侧，与电路部件间隔开，并且被配置为散发由发光二极管组件产生的热量。 光学部件接触第二侧，并且被配置为分配从发光二极管组件发射的光。

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