公开(公告)号：US20040046236A1

公开(公告)日：2004-03-11

申请号：US10655869

申请日：2003-09-04

Inventor： Terence Quintin Collier

IPC: H01L023/495

CPC classification number: H01L24/83 ,  H01L23/49541 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512

Abstract: Disclosed are semiconductor packages and methods incorporating the use of vias in layers of leaded and nonleaded multilayer packages. The vias provide fluid communication between layers such that bonding material flows among layers for the formation of a 3D bond. As disclosed, the layers may comprise leads, dice, bond pads, or other substantially planar semiconductor package surfaces.

Abstract translation: 公开了半导体封装和方法，其结合在含铅和非铅性多层封装的层中使用通孔。 通孔提供层之间的流体连通，使得结合材料在用于形成3D结合的层之间流动。 如所公开的，这些层可以包括引线，裸片，接合焊盘或其它基本上平面的半导体封装表面。

公开(公告)号：US20040011857A1

公开(公告)日：2004-01-22

申请号：US10197395

申请日：2002-07-16

Inventor： John W. Abouchar

IPC: B23K031/02 ,  B23K035/12

CPC classification number: C23C2/08 ,  B23K1/08 ,  B23K3/0646 ,  B23K35/224 ,  B23K35/262 ,  B23K2101/38 ,  B23K2103/14 ,  C23C2/02 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10818 ,  H05K2201/1084 ,  H05K2201/2081 ,  Y10T29/49139

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

Abstract translation: 本文公开了通过热焊料浸渍来镀覆一个或多个电端子的方法。 该方法通常包括将阻焊​​材料放置在形成在电端子中的通孔中，然后将端子的至少一部分浸入热焊料中。 耐焊材料可以包括例如钛或不锈钢丝，并且焊料可以是诸如Sn63的锡铅焊料。

公开(公告)号：US20020191379A1

公开(公告)日：2002-12-19

申请号：US09964130

申请日：2001-09-25

Inventor： Carl Milton Wildrick ,  Gordon K.Y. Lee

IPC: H05K001/14

CPC classification number: H01R12/7088 ,  H05K1/165 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10257 ,  H05K2201/1084 ,  Y02P70/613

Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.

Abstract translation: 这种改进的表面贴装电源可以承受制造过程的严格性，并且仍然可以创建与用户电路卡的坚固和牢固的连接。 开放式框架功率模块使用U形或T形互连，而不是球形互连。 在一个实施例中，U形互连可以具有穿过一个表面的孔，以允许焊料芯吸。 恶臭的焊料提供更坚固的连接，更有可能在后续回流工艺中生存。 电源模块也建在较厚的FR4板上。 较厚的板在随后的加热期间不太可能翘曲。

公开(公告)号：US5805427A

公开(公告)日：1998-09-08

申请号：US601415

申请日：1996-02-14

Applicant: Paul R. Hoffman

Inventor： Paul R. Hoffman

IPC: H01L23/13 ,  H01L23/498 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/305 ,  H01L23/13 ,  H01L23/49816 ,  H05K3/341 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H05K2201/0969 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/167 ,  H05K3/303 ,  Y02P70/613

Abstract: A surface mount package to encapsulate one or more semiconductor devices has a standoff that maintains the thickness of solder columns bonding the package to an external circuit. The standoff either extends over or circumscribes a central portion of the package base. To enhance the thermal performance of the standoff, a solderable layer enhances soldering of the standoff to the external circuit. In alternative embodiments, the standoff contains a flange having a plurality of apertures useful for either mechanically locking an adhesive or for enabling irradiation of an adhesive by a light source. The standoff may contain protrusions for alignment, strength or circuit routing.

Abstract translation: 用于封装一个或多个半导体器件的表面贴装封装具有将焊料层的厚度保持为将封装结合到外部电路的间隔。 隔离物可以延伸到或限制包装基底的中心部分。 为了提高支架的热性能，可焊层增强了支架对外部电路的焊接。 在替代实施例中，间隔件包含具有多个孔的凸缘，其可用于机械地锁定粘合剂或用于通过光源照射粘合剂。 对接可能包含用于对准，强度或电路布线的突起。

公开(公告)号：US5773313A

公开(公告)日：1998-06-30

申请号：US547616

申请日：1995-10-24

Applicant: Mitsutaka Sato ,  Junichi Kasai

Inventor： Mitsutaka Sato ,  Junichi Kasai

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L21/60

CPC classification number: H01L24/06 ,  H01L21/4835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L24/05 ,  H05K3/3426 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/18165 ,  H01L2924/19107 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T29/49121

Abstract: A semiconductor device includes a semiconductor chip (11) having a top surface and a bottom surface, a plurality of leads (14) arranged under the bottom surface of the semiconductor chip (11), where the leads (14) have first ends (14a) electrically coupled to the semiconductor chip (11) and second ends which form external terminals (16) and each of the external terminals have a bottom surface, and a package (17, 31) encapsulating the semiconductor chip (11) and the leads (14) so that the bottom surface of each of the external terminals (16) is exposed at a bottom surface (17a, 31a) of the package (17, 31) and remaining portions of the leads (14) are embedded within the package (17, 31), where the package (17, 31) has a size which is approximately the same as that of the semiconductor chip (11) in a plan view viewed from above the top surface of the semiconductor chip (11).

公开(公告)号：US5270492A

公开(公告)日：1993-12-14

申请号：US919892

申请日：1992-07-27

Applicant: Masaro Fukui

Inventor： Masaro Fukui

IPC: H01L23/50 ,  H01L23/495 ,  H05K3/34 ,  H01L23/02 ,  H01R9/00

CPC classification number: H05K3/3426 ,  H01L23/49541 ,  H01L2924/0002 ,  H05K2201/0979 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A small bore or a cut portion is formed in a leading end portion of a lead terminal extended from a package main body. A gas produced when the leading end portion is contacted with and soldered to a land provided on a printed wiring board is allowed to escape through the small bore or the cut portion and, therefore, solder is easy to enter between the lead terminal and the land, which improves the soldering performance of the lead terminal. Also, the provision of the small bore or cut portion increases the area of a peripheral portion of the lead terminal to be in contact with the solder to thereby increasing the strength of the soldering.

Abstract translation: 在从封装主体延伸的引线端子的前端部形成有小孔或切口部。 当前端部分接触并焊接到设置在印刷电路板上的焊盘上时产生的气体被允许通过小孔或切割部分逸出，因此焊料容易在引线端子和焊盘之间进入 ，这提高了引线端子的焊接性能。 此外，小孔或切口部的设置增加引线端子的周边部分与焊料接触的面积，从而提高焊接强度。

公开(公告)号：US4626478A

公开(公告)日：1986-12-02

申请号：US592220

申请日：1984-03-22

Applicant: Herman F. van Dyk Soerewyn

Inventor： Herman F. van Dyk Soerewyn

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/495 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/80 ,  H01L21/4853 ,  H01L21/4878 ,  H01L23/49548 ,  H05K3/3405 ,  H05K3/3426 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/1034 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K3/3421 ,  Y02P70/613 ,  Y10S428/929 ,  Y10T428/12361 ,  Y10T428/1241 ,  Y10T428/12493

Abstract: Spacing elements are integrally formed on the constituent surfaces of conductive interfaces of electronic circuit device components for providing uniform thickness solder or other bonding film between the surfaces. The interfaces may be electrically conductive interfaces such as those defined between leads and substrate contact pads as well as thermally conductive interfaces such as those defined between heat sinks and substrates. Any suitable spacers which maintain the constitutent surfaces a selected distance apart when the components are pressed together may be employed such as edge and corner flanges, convex dimples, annular protrusions, tangs, among others. A tool is disclosed for forming the annular protrusions that is advantageously employed with comparatively thick electronic circuit device components and with laminated electronic circuit device components having a comparatively hard layer.

Abstract translation: 间隔元件整体形成在电子电路器件部件的导电界面的组成表面上，用于在表面之间提供均匀的厚度的焊料或其它接合膜。 界面可以是诸如在引线和衬底接触焊盘之间限定的那些的导电接口，以及诸如在散热器和衬底之间限定的那些导热接口。 当组件被压在一起时，任何合适的间隔件可以使组件表面保持选定的距离，例如边缘和角部凸缘，凸起凹坑，环形突起，柄脚等等。 公开了一种用于形成环形突起的工具，其有利地用于比较厚的电子电路器件部件和具有相对较硬层的层压电子电路器件部件。

公开(公告)号：US20160352215A1

公开(公告)日：2016-12-01

申请号：US15163093

申请日：2016-05-24

Applicant: Denso Corporation

Inventor： Taijirou MOMOSE

IPC: H02M1/36 ,  H05K5/02 ,  B60L11/18

CPC classification number: H05K5/0239 ,  B60L11/18 ,  H05K1/144 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1432 ,  H05K2201/042 ,  H05K2201/09127 ,  H05K2201/10318 ,  H05K2201/10833 ,  H05K2201/1084

Abstract: A power converter includes a case body provided with a device main body part having a power conversion part accommodated therein, a lid member covering an aperture of the case body, a first substrate fixed to the case body, a second substrate fixed to the lid member, the first substrate and the second substrate being fixed therein and a connection member electrically connecting the first substrate and the second substrate.

Abstract translation: 电力转换器包括壳体，该壳体设置有容纳有电力转换部分的装置主体部分，覆盖壳体的孔的盖构件，固定到壳体的第一基板，固定到盖构件的第二基板 第一基板和第二基板固定在其中，以及连接构件，电连接第一基板和第二基板。

公开(公告)号：US08426748B2

公开(公告)日：2013-04-23

申请号：US12725546

申请日：2010-03-17

Applicant: Masanori Kawade ,  Hiroyuki Tsuruga ,  Makoto Ebina

Inventor： Masanori Kawade ,  Hiroyuki Tsuruga ,  Makoto Ebina

IPC: H05K1/11

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/05599

Abstract: A lead pin comprising including a body having a shaft portion and a flange portion. The flange portion has at least one flat portion configured to face a connection pad and groove portions positioned to face toward the connection pad and extending from a peripheral portion toward a center portion of the flange portion, the flat portion includes extending portions extending from a center of the flange toward the peripheral portion of the flange and connected at the center of the flange, and the groove portions are tilted to become deeper toward the peripheral portion of the flange.

Abstract translation: 一种引导销，包括包括具有轴部分的主体和凸缘部分。 凸缘部具有至少一个平坦部分，其被构造成面对连接焊盘和定位成面向连接焊盘并从周边部分朝向凸缘部分的中心部分延伸的凹槽部分，平坦部分包括从中心延伸的延伸部分 凸缘朝向凸缘的周边部分并且连接在凸缘的中心，并且槽部倾斜以朝向凸缘的周边部分变深。

公开(公告)号：US08369095B2

公开(公告)日：2013-02-05

申请号：US12232815

申请日：2008-09-24

Applicant: Seokryun Park

Inventor： Seokryun Park

IPC: H01M10/02 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01M2/04 ,  H01M2/20 ,  H01M10/052 ,  H01M10/425 ,  H05K2201/1031 ,  H05K2201/1084 ,  Y02P70/611 ,  Y02P70/613

Abstract: A protection circuit board for a secondary battery includes: a printed circuit board; a protection circuit attached to the printed circuit board and electrically connected thereto; a conducting pad electrically connected to a conducting pad of the protection circuit; a charging/discharging terminal electrically connected to the protection circuit and the conducting pad; a lead plate electrically connected to the conducting pad, the lead plate including at least one soldering hole arranged on a surface thereof to couple the lead plate to the conducting pad.