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    Process for assembling a double-sided circuit component
    21.
    发明授权
    Process for assembling a double-sided circuit component 有权
    组装双面电路元件的工艺

    公开(公告)号：US07229855B2

    公开(公告)日：2007-06-12

    申请号：US10906518

    申请日：2005-02-23

    Applicant: Ze Etta E. Murphy

    Inventor： Ze Etta E. Murphy

    IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/495 ,  H01L23/48 ,  H01L29/70

    CPC classification number: H05K3/3405 ,  H01L21/6835 ,  H01L23/49531 ,  H01L23/49861 ,  H01L2221/68313 ,  H01L2924/0002 ,  H05K1/145 ,  H05K3/368 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/0165 ,  H01L2924/00

    Abstract: A process for producing a circuit component having a double-sided circuit device between a pair of substrates. The process entails depositing a solder material on contact areas on surfaces of the substrates, placing a first of the substrates within a cavity in a receptacle, and then placing a lead member on the substrate so that the lead member is supported by the receptacle and a portion of the lead member is aligned with a portion of the contact area of the substrate. A fixture is then placed on the lead member and over the substrate so that the fixture is supported by the receptacle. After aligning the circuit device with the contact area of the remaining substrate, the substrate-device assembly is placed in an aperture in the fixture so that a surface of the device electrically contacts the contact area of the first substrate and the opposite surface of the device electrically contacts the contact area of the second substrate. The resulting fixtured assembly then undergoes reflow.

    Abstract translation: 一种用于制造在一对基板之间具有双面电路器件的电路部件的工艺。 该过程需要将焊料材料沉积在基板的表面上的接触区域上，将第一基板放置在容器内的空腔内，然后将引线部件放置在基板上，使得引线部件由插座支撑， 引线构件的一部分与衬底的接触区域的一部分对准。 然后将夹具放置在引导构件上并在基板上方，使得固定装置由插座支撑。 在将电路装置与剩余基板的接触区域对准之后，将基板装置组件放置在固定装置中的孔中，使得装置的表面电接触第一基板的接触区域和装置的相对表面 电接触第二基板的接触区域。 所得到的夹具组件然后经受回流。

    Printed circuit board assembly with integrated connector
    22.
    发明授权
    Printed circuit board assembly with integrated connector 有权
    带集成连接器的印刷电路板组件

    公开(公告)号：US07227758B2

    公开(公告)日：2007-06-05

    申请号：US10624063

    申请日：2003-07-21

    Applicant: Scott D. Brandenburg ,  Thomas A. Degenkolb

    Inventor： Scott D. Brandenburg ,  Thomas A. Degenkolb

    IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

    CPC classification number: H05K3/4092 ,  H01R13/6658 ,  H01R31/065 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/184 ,  H05K3/284 ,  H05K2201/086 ,  H05K2201/09163 ,  H05K2201/09754 ,  H05K2201/10924

    Abstract: A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components and includes a plurality of conductive layers, each separated by a non-conductive layer. The first integrated conductive bus structure includes a first portion that extends from the first edge of the PCB and which forms a plurality of electrically separate contacts of a connector. A second portion of the bus structure is integrated within the PCB and couples each of the contacts to at least one conductive trace of the PCB through plated holes.

    Abstract translation: 印刷电路板（PCB）组件包括PCB和从PCB的第一边缘延伸的第一集成导电总线结构。 PCB连接多个电子部件，并且包括多个导电层，每个导体层由非导电层隔开。 第一集成导电总线结构包括从PCB的第一边缘延伸并且形成连接器的多个电分离触点的第一部分。 总线结构的第二部分集成在PCB内，并且通过电镀孔将每个触点耦合到PCB的至少一个导电迹线。

    Optical transceiver module having a dual segment molded lead frame connector
    24.
    发明授权
    Optical transceiver module having a dual segment molded lead frame connector 有权
    光收发器模块具有双段模制引线框连接器

    公开(公告)号：US07144259B2

    公开(公告)日：2006-12-05

    申请号：US11236123

    申请日：2005-09-26

    Applicant: Donald A. Ice ,  Stephen T. Nelson ,  Darin J. Douma

    Inventor： Donald A. Ice ,  Stephen T. Nelson ,  Darin J. Douma

    IPC: H05K1/00

    CPC classification number: H05K3/3405 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4255 ,  G02B6/4292 ,  H01R13/6315 ,  H05K1/0278 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2203/302

    Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

    Abstract translation: 公开了一种具有多个光学子组件和印刷电路板的光收发器模块。 收发器模块包括用于将光学子组件连接到印刷电路板的引线框架连接器。 引线框架连接器包括被封装并弯曲的导电引线结构，其被封装在插入式注塑塑料外壳中。 塑料外壳为引线框架中的导体提供电绝缘以及成品部件的机械支撑。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以建立光学子组件和印刷电路板之间的连接。 引线框架组件通常比使用柔性印刷电路板结构来建立光学子组件和收发器印刷电路板之间的电连接更可靠和更便宜。

    Metal-core substrate and apparatus utilizing the same
    25.
    发明申请
    Metal-core substrate and apparatus utilizing the same 有权
    金属芯基板及利用其的装置

    公开(公告)号：US20060203455A1

    公开(公告)日：2006-09-14

    申请号：US11372104

    申请日：2006-03-10

    Applicant: Masataka Suzuki ,  Kenji Hayakawa

    Inventor： Masataka Suzuki ,  Kenji Hayakawa

    IPC: H05K7/20

    CPC classification number: H05K3/4092 ,  H05K1/056 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924

    Abstract: The present invention is to provide a metal-core substrate without mounting large size terminals and connectors. Hence, the metal-core substrate can be smaller and thinner. A metal-core substrate includes a metal plate, an insulating layer formed on a surface of the metal plate and a circuit pattern formed on a surface of the insulating layer, wherein a part of said metal plate is exposed to outside of the insulating layer and is utilized as connector terminals. The metal plate has a heat sink plate to heat sink a heat-generating device mounted on the metal-core substrate and connector terminal plates disposed separately from the heat sink plate and utilized for the connector terminals. The heat-generating device and a driving part thereof each are disposed on a different surface of the metal-core substrate.

    Abstract translation: 本发明提供一种不安装大尺寸端子和连接器的金属芯基板。 因此，金属芯基板可以更小更薄。 金属芯基板包括金属板，形成在金属板的表面上的绝缘层和形成在绝缘层的表面上的电路图案，其中所述金属板的一部分暴露于绝缘层的外部， 被用作连接器端子。 金属板具有散热板，用于将安装在金属芯基板上的发热装置和与散热板分开设置的连接器端子板散热，用于连接器端子。 发热元件及其驱动部分分别设置在金属芯基板的不同表面上。

    Dual segment molded lead frame connector for optical transceiver modules
    27.
    发明申请
    Dual segment molded lead frame connector for optical transceiver modules 有权
    用于光收发器模块的双段模制引线框连接器

    公开(公告)号：US20050221637A1

    公开(公告)日：2005-10-06

    申请号：US11066079

    申请日：2005-02-25

    Applicant: Donald Ice ,  Darin Douma

    Inventor： Donald Ice ,  Darin Douma

    IPC: G02B6/42 ,  H01R12/00 ,  H05K1/14 ,  H05K3/20 ,  H05K3/34

    CPC classification number: H05K3/3405 ,  G02B6/4292 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924

    Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in a plurality of insert injection molded plastic casings. The plastic casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

    Abstract translation: 本发明的示例性实施例示出了用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。 引线框架连接器包括被封装并弯曲的导电引线结构，其被封装在多个插入注塑塑料外壳中。 塑料外壳为引线框架中的导体提供电绝缘以及成品部件的机械支撑。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以在光学子组件和印刷电路板之间建立连接。

    Electronic module having canopy-type carriers
    28.
    发明申请
    Electronic module having canopy-type carriers 审中-公开

    公开(公告)号：US20030137808A1

    公开(公告)日：2003-07-24

    申请号：US10341522

    申请日：2003-01-13

    Inventor： Kenneth J. Kledzik ,  Jason C. Engle

    IPC: H05K007/20

    CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

    Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A second primary embodiment of the invention utilizes a carrier substrate, which has a pair of recesses for back-to-back surface mounting of the IC package pair. The two IC packages may be in contact with opposite sides of a heat sink layer embedded within the carrier substrate. Each resulting IC package unit is surface mounted to the main circuit board. A third primary embodiment of the invention incorporates features of both the first and second primary embodiments. One of the packages is mounted on a planar surface of the carrier right side up, while the other package is mounted on the carrier in a recess upside down. Several variants of this embodiment are possible. Either the IC package that is mounted on the planar surface of the carrier, or the IC package that is mounted within the recess, may be mounted adjacent to the main circuit board. In the former case, the adjacent package of the package unit fits within a recess on the main circuit board. In the latter case, the adjacent package of the package unit mounts on a planar surface of the main circuit board. For any of the three primary main embodiments, the carrier may be equipped with its own set of interconnection leads which interface with the interconnection pads on the main circuit board or connection may be made directly between the leads of one package and the interconnection pads of the circuit board.

    Operating mechanism
    29.
    发明授权
    Operating mechanism 失效
    操作机制

    公开(公告)号：US06590780B2

    公开(公告)日：2003-07-08

    申请号：US10223023

    申请日：2002-08-16

    Applicant: Jayesh Jayantilal Modi

    Inventor： Jayesh Jayantilal Modi

    IPC: H05K502

    CPC classification number: H05K1/0263 ,  H01R9/226 ,  H05K3/326 ,  H05K7/026 ,  H05K2201/0999 ,  H05K2201/10924 ,  H05K2201/10962

    Abstract: An operating mechanism (1) includes a housing and a printed circuit board (6) having an electronic switch part disposed in the housing. A punched grid (7) has at least one punched grid plane (8) running parallel to the circuit board (6). The punched grid is electrically connected to the circuit board (6) by means of contact sections (18) bent off from the punched grid plane (8) and connected to electric components (10, 11) that are connected to the circuit board and/or punched grid. The housing has a first housing part (2) with a housing wall (21) running parallel to the circuit board (6) and the punched grid plane (8). First connecting elements (12) are electrically connectable with second contact sections (19) of the punched grid (7), and the second connecting elements (14) are electrically connectable with discrete contact elements arranged on the circuit board (6).

    Abstract translation: 操作机构（1）包括壳体和布置在壳体中的电子开关部件的印刷电路板（6）。 冲孔网格（7）具有平行于电路板（6）延伸的至少一个穿孔网格平面（8）。 穿孔格栅通过从冲压网格平面（8）弯曲的接触部分（18）与电路板（6）电连接并连接到电气部件（10,11），电气部件（10,11）连接到电路板和/ 或打孔网格。 壳体具有第一壳体部分（2），其具有平行于电路板（6）和冲压的格栅平面（8）延伸的壳体壁（21）。 第一连接元件（12）可与冲压格栅（7）的第二接触部分（19）电连接，并且第二连接元件（14）可与布置在电路板（6）上的分立接触元件电连接。

    Electronic module having canopy-type carriers
    30.
    发明授权
    Electronic module having canopy-type carriers 有权

    公开(公告)号：US06545868B1

    公开(公告)日：2003-04-08

    申请号：US09688499

    申请日：2000-10-16

    Applicant: Kenneth J. Kledzik ,  Jason C. Engle

    Inventor： Kenneth J. Kledzik ,  Jason C. Engle

    IPC: H05K720

    CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

    Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A second primary embodiment of the invention utilizes a carrier substrate which has a pair of recesses for back-to-back surface mounting of the IC package pair. The two IC packages may be in contact with opposite sides of a heat sink layer embedded within the carrier substrate. Each resulting IC package unit is surface mounted to the main circuit board. A third primary embodiment of the invention incorporates features of both the first and second primary embodiments. One of the packages is mounted on a planar surface of the carrier right-side up, while the other package is mounted on the carrier in a recess upside down. Several variants of this embodiment are possible. Either the IC package that is mounted on the planar surface of the carrier, or the IC package that is mounted within the recess, may be mounted adjacent to the main circuit board. In the former case, the adjacent package of the package unit fits within a recess on the main circuit board. In the latter case, the adjacent package of the package unit mounts on a planar surface of the main circuit board. For any of the three primary main embodiments, the carrier may be equipped with its own set of interconnection leads which interface with the interconnection pads on the main circuit board or connection may be made directly between the leads of one package and the interconnection pads of the circuit board.

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