公开(公告)号：US07038144B2

公开(公告)日：2006-05-02

申请号：US10040804

申请日：2001-11-08

Applicant: Masao Yasuda ,  Masato Sumikawa

Inventor： Masao Yasuda ,  Masato Sumikawa

IPC: H05K1/16

CPC classification number: H01L24/10 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/013

Abstract: An electronic component having an electrode structure to increase an allowance positional deviation in a mounting process as well as a method and a structure for mounting a semiconductor device are provided. The semiconductor device includes, on electrodes, connection materials connecting the semiconductor device and a substrate. The connection materials include a composite connection material formed of a core and a conductor covering the core, the core having an a low modulus of elasticity at room temperature smaller than that of the conductor at room temperature, and a single-layer connection material formed of a conductor.

公开(公告)号：US20060043603A1

公开(公告)日：2006-03-02

申请号：US10932174

申请日：2004-08-31

Applicant: Yogendra Ranade ,  Rajagopalan Parthasarathy ,  Jeffrey Hall

Inventor： Yogendra Ranade ,  Rajagopalan Parthasarathy ,  Jeffrey Hall

IPC: H01L21/44 ,  H01L23/48

CPC classification number: H01L24/81 ,  H01L23/49816 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10378 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2224/0401

Abstract: Techniques for utilizing a bonding agent that allows a solder reflow process to occur at a lower reflow temperature. One area of use includes semiconductor device manufacturing processes. The bonding agent is placed between a solder ball and a contact surface. The bonding agent has a melting temperature that is lower than that of the solder ball. Reflow is then performed at a relative low temperature that is high enough for reflowing the bonding agent, yet at the same time, lower than what would be necessary to reflow the solder material. Since, the electrical system is not subjected to the high temperatures necessary for reflowing the solder material, the electronic system experiences less high-temperature related damage.

Abstract translation: 用于利用允许焊料回流工艺在较低回流温度下发生的粘结剂的技术。 一个使用领域包括半导体器件制造工艺。 粘结剂置于焊球和接触表面之间。 粘合剂的熔融温度低于焊球的熔融温度。 然后在足够高的回流焊接剂的相对低温下进行回流，同时低于回流焊料材料所需的回流。 由于电气系统没有经受回流焊料所需的高温，所以电子系统的高温相关损害较少。

公开(公告)号：US06973717B2

公开(公告)日：2005-12-13

申请号：US10937418

申请日：2004-09-09

Applicant: Hans-Jürgen Hacke ,  Klaus-Peter Galuschki

Inventor： Hans-Jürgen Hacke ,  Klaus-Peter Galuschki

IPC: H01L23/485 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

Abstract: A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating layer, interconnects run from the electrical connection pads to base regions of external connection elements. A further applied insulating layer is provided with openings leading from the outside to the base regions of the external connection elements. In the openings there is a conductive adhesive, onto which small balls which are metallic at least on the outside are placed. The semiconductor element can also contain a solder paste instead of a conductive adhesive in the openings, and metallized small plastic balls are placed onto the solder paste. The invention furthermore relates to methods for producing the semiconductor device described.

Abstract translation: 描述了具有芯片的半导体器件，其芯片具有至少一个第一绝缘层和不含绝缘层的电连接焊盘。 在第一绝缘层上，互连从电连接焊盘延伸到外部连接元件的基极区域。 进一步施加的绝缘层设置有从外部连接到外部连接元件的基部区域的开口。 在开口中有导电粘合剂，至少在外部放置金属的小球。 半导体元件还可以在开口中包含焊膏代替导电粘合剂，并且将金属化的小塑料球放置在焊膏上。 本发明还涉及所述半导体器件的制造方法。

公开(公告)号：US20050024839A1

公开(公告)日：2005-02-03

申请号：US10631569

申请日：2003-07-31

Applicant: Terry Bloom

Inventor： Terry Bloom

IPC: H01C13/02 ,  H01C1/144 ,  H01G4/232 ,  H01L21/48 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K7/14 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01C1/144 ,  H01G4/232 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16237 ,  H01L2924/01019 ,  H01L2924/19041 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

Abstract: A ball grid array package includes a substrate with a top and bottom surface. A circuit component is located on the bottom surface. The circuit component has a pair of ends. A pair of conductors are located on the bottom surface. The conductors are connected to the ends of the circuit component. A conductive epoxy covers a portion of the conductors and a portion of the bottom surface. The conductive epoxy is in electrical contact with the conductors. A ball is connected to the conductive epoxy. The conductive epoxy provides an electrical connection between the conductor and the ball. The ball is preferably copper and is subsequently coated to prevent corrosion. Other embodiments of the invention are shown in which the balls are omitted and in which the conductive epoxy is used to fill vias in a substrate.

Abstract translation: 球栅阵列封装包括具有顶表面和底表面的衬底。 电路元件位于底面。 电路部件具有一对端部。 一对导体位于底面。 导体连接到电路部件的端部。 导电环氧树脂覆盖导体的一部分和底表面的一部分。 导电环氧树脂与导体电接触。 一个球连接到导电环氧树脂。 导电环氧树脂提供导体和球之间的电连接。 球优选为铜，并且随后被涂覆以防止腐蚀。 示出了本发明的其它实施例，其中省略了球，并且其中导电环氧树脂用于填充衬底中的通孔。

公开(公告)号：US20040159959A1

公开(公告)日：2004-08-19

申请号：US10777804

申请日：2004-02-12

Inventor： Masud Beroz ,  David Light

IPC: H01L023/48 ,  H01L023/52

CPC classification number: H01L24/81 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/9205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10992 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

Abstract: A microelectronic assembly includes a first microelectronic element having a contact bearing face and one or more contacts provided at the contact bearing face and a second microelectronic element juxtaposed with the first microelectronic element, the second microelectronic element having a first surface including one or more conductive pads. The microelectronic assembly also includes one or more conductive masses electrically interconnecting the contacts of the first microelectronic element and the conductive pads of the second microelectronic element, whereby each the conductive mass includes a first region comprising a first fusible material transformable from a solid to a liquid at a first melting temperature and a second region comprising a second fusible material transformable from a solid to a liquid at a second melting temperature that is less than the first melting temperature.

Abstract translation: 微电子组件包括具有接触支承面和设置在接触支承面上的一个或多个触点的第一微电子元件和与第一微电子元件并置的第二微电子元件，第二微电子元件具有包括一个或多个导电焊盘 。 微电子组件还包括电连接第一微电子元件的触点和第二微电子元件的导电焊盘的一个或多个导电块，由此每个导电块包括第一区域，该第一区域包括可从固体转变成液体的第一可熔材料 在第一熔融温度下，第二区域包括在低于第一熔融温度的第二熔融温度下可从固体转化成液体的第二可熔材料。

公开(公告)号：US20040118606A1

公开(公告)日：2004-06-24

申请号：US10326901

申请日：2002-12-20

Inventor： Carolyn R. McCormick ,  Terrance J. Dishongh

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H05K3/3436 ,  H05K3/3463 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Apparatus and methods providing for interconnecting a SMT component interconnect to a via-in-pad (VIP) interconnect is presented. In one embodiment in accordance with the invention, a first reflowable electrically conductive interconnect material is deposited on the VIP bond pad. A sphere comprising an electrically conductive material having a higher melt temperature than the reflow temperature of the first interconnect material is deposited on the first interconnect material. A first reflow process is performed to interconnect the sphere and the VIP bond pad while the sphere remains solid. A second electrically conductive interconnect material having a reflow temperature lower than the melt temperature of the sphere is deposited on the component interconnect and a second reflow process is performed to interconnect the sphere to the component interconnect while the sphere remains solid, effectively preventing the second interconnect material from migrating into the plated though hole.

Abstract translation: 提供了提供用于将SMT组件互连件互连到衬垫通孔（VIP）互连件的装置和方法。 在根据本发明的一个实施例中，第一可回流导电互连材料沉积在VIP接合焊盘上。 包括具有比第一互连材料的回流温度更高的熔融温度的导电材料的球体沉积在第一互连材料上。 执行第一回流处理以在球体保持固体的同时使球体和VIP结合垫相互连接。 具有低于球体的熔融温度的回流温度的第二导电互连材料沉积在部件互连件上，并且执行第二回流工艺以将球体连接到部件互连件，同时球保持固体，有效地防止第二互连 材料从迁移到电镀孔中。

公开(公告)号：US20040094842A1

公开(公告)日：2004-05-20

申请号：US10715649

申请日：2003-11-18

Inventor： Miguel A. Jimarez ,  Cynthia S. Milkovich ,  Mark V. Pierson

IPC: H01L023/48

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/10126 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81013 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/0032 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00014

Abstract: An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

Abstract translation: 一种电结构和相关制造方法，用于减少将第一衬底的第一导体与第二衬底的第二导电体（例如，芯片耦合到芯片载体;芯片载体）的结构中的热诱导应变 到电路卡）。 第一导电体的熔点超过第二导电体的熔点。 第二导电体可以包括共晶铅锡合金，而第一导电体可以包括非共晶铅锡合金。 第一导电体的一部分被不可焊接和不导电的材料涂覆或体积地包围。 通过施加位于第一和第二导电体的熔点之间的温度，第一和第二导电体通过在第一导电体的未涂覆部分处的表面粘附机械和电连接。

公开(公告)号：US20030168739A1

公开(公告)日：2003-09-11

申请号：US10291019

申请日：2002-11-08

Inventor： Chien-Ping Huang

IPC: H01L023/488

CPC classification number: H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A solder ball array type package structure is able to control collapse. The package includes a substrate, a carrier, a plurality of dies, a molding compound and a plurality of solder balls. The substrate has at least one active surface. Pads are located on the first surface of the substrate. The carrier has at least an active surface and a back surface opposite the active surface. A plurality of dies are located on the back surface and the active surface of the carrier. The dies arranged on the active surface are electrically connected to the carrier by flip chip technology. A molding compound encapsulates on the back surface of the carrier to cover the dies on the back surface of the carrier. Solder balls having a base material are provided on the active surface of the carrier in array. At least three solder balls coated with the base material having a high melting-temperature core are further provided in the periphery of the array. The carrier is arranged such that the active surface faces the first surface of the substrate to allow each solder ball correspond to the one of the pads, respectively.

公开(公告)号：US20030164247A1

公开(公告)日：2003-09-04

申请号：US10404266

申请日：2003-04-01

Inventor： Chinh Nguyen ,  Phu Hoang ,  Phan Hoang ,  Andy Le

IPC: H05K001/16

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/0367 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10992 ,  H05K2203/043 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

公开(公告)号：US20030143872A1

公开(公告)日：2003-07-31

申请号：US10059461

申请日：2002-01-29

Inventor： Rex W. Keller

IPC: H01R012/00

CPC classification number: H01R43/0256 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/15311 ,  H01R4/027 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0367 ,  H05K2201/10378 ,  H05K2201/10992 ,  H05K2203/048 ,  Y02P70/613

Abstract: The invention includes an interposer, BGA connector, or other connection device that provides electrical contact with a ball grid array connector. The inventive interposer includes a housing with contacts. The contacts have a first end and a second end. The interposer also includes a first body and a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts. The first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball gid array connector.

Abstract translation: 本发明包括插入器，BGA连接器或与球栅阵列连接器电接触的其它连接装置。 本发明的插入器包括具有触点的壳体。 触点具有第一端和第二端。 插入器还包括设置在至少一个触点的第一端上的可回流导电材料的第一主体和第二主体。 第一主体和第二主体在插入器与球形芯阵列连接器的可回流，导电材料的单体之间提供电接触。