Abstract:
An emissivity compensating non-contact system for measuring the temperature of a semiconductor wafer. The system includes a semiconductor wafer emissivity compensation station for measuring the reflectivity of the wafer at discrete wavelengths to yield wafer emissivity in specific wavelength bands. The system further includes a measurement probe which is optically coupled to a semiconductor process chamber. The probe senses wafer self emission using one or more optical detectors and a light modulator. A background temperature determining mechanism independently senses the temperature of a source of background radiation. Finally, a mechanism calculates the temperature of the semiconductor wafer based on the reflectivity, self-emission and background temperature.
Abstract:
An optical data transducer system is described which comprises a cryogenic dewar for containing an infrared focal plane array at low temperature and an optical spatial light modulator, collimated laser beam and associated optical train and detector for efficient extraction of information from the array.
Abstract:
A thermal or infrared imaging system having an optical barrel, an external stop formed by a mirror, a dewar, a cold shield, a focal plane array, and multiple retroreflectors. The cold shield and focal plane array are located inside the dewar. The mirror directs desired light bundles at the focal plane array. The retroreflectors are attached to the inside of the optical barrel. The retroreflectors are arranged such that the retroreflectors exist in all lines of sight of the focal plane array, except those lines of sight associated with the external stop. Consequently, the retroreflectors do not interfere with the desired light bundles which are focused onto the focal plane array. However, all light outside of that which is focused is prevented from reaching the focal plane array by the retroreflectors. The retroreflectors are infrared retroreflectors arranged in a matrix. Each of the retroreflectors is a "concave" corner cube having low emissivity reflecting facets. The corner cubes reflect incoming rays by 180 degrees relative to input angles of the incoming rays. Thus, the focal plane array sees only cold outside of the desired light bundles.
Abstract:
A radiation detector assembly (20) includes a radiation detector (2), a silicon readout device (3) coupled to the radiation detector, and a platform 13 for supporting from a first major surface (13a) the readout device and the radiation detector. A second major surface (13b) includes a boss (14) for coupling, via an active brazing operation, to a cryogenic cooler. The platform is monolithic structure comprised of aluminum nitride (AlN) and eliminates at least one adhesive joint found in the prior art. AlN is selected because of its inherent material properties including a higher thermal diffusivity, relative to typical ceramic materials, for providing a reduced cooldown time of the detector to cryogenic temperatures. AlN also has a 300K- 77K thermal contraction characteristic that closely matches that of the silicon readout device and a high modulus of elasticity, thereby reducing distortion of the readout device thus minimizing stresses on indium bump interconnects. AlN also has dielectric characteristics that permit thin film metalization of the surface (13a) for providing electrical signal distribution.
Abstract:
A totally integrated thermal imaging system has a dewar housing including imaging optics, a scanning mirror and a curved detector array. The imaging optics constitute a meniscus lens and a spherical focusing mirror. The scanning mirror scans the image, and the spherical mirror focuses the scanned image onto the detector array. The meniscus lens advantageously corrects aberrations. A detector support provides access for cryogenic cooling of the detector, and individual cold shielding of the detector elements is made possible by the telecentricity of the optics. Processing electronics, at least a portion of which may also be disposed on the detector support, process the detector signals to display an image. The integrated structure advantageously eliminates any need for separate scanner, imager, detector dewar and electronics modules.
Abstract:
A thermal imager including a cryogenically cooled detector element array and a scanning element has an optical system with a field of view limited by a field stop (2). A retroreflective region (6) is provided on part of the field stop to act as a temperature reference by allowing the detector array to "look at" itself. A second, different temperature reference (5) is provided on another part of the field stop and the two references are used to equalize and adjust the output characteristics of the elements in the detector array.
Abstract:
A precision temperature sensor is set forth. The sensor is a photosensitive device. Variations in temperature of the light sensitive device cause changes in the voltage across the light sensitive device. The voltage can be measured in microvolts corresponding to fractions of a degree change, and is linear with change in temperature.
Abstract:
An infrared (IR) simulator is disclosed in which an array of pixels is defined on an insulative substrate by resistor bridges which contact the substrate at spaced locations and are separated from the substrate, and thereby thermally insulated therefrom, between the contact locations. Semiconductor drive circuits on the substrate enable desired current flows through the resistor bridges in response to input control signals, thereby establishing the appropriate IR radiation from each of the pixels. The drive circuits and also at least some of the electrical lead lines are preferably located under the resistor bridges. A thermal reflector below each bridge shields the drive circuit and reflects radiation to enhance the IR output. The drive circuits employ sample and hold circuits which produce a substantially flicker-free operation, with the resistor bridges being impedance matched with their respective drive circuits. The resistor bridges may be formed by coating insulative base bridges with a resistive layer having the desired properties, and overcoating the resistive layers with a thermally emissive material. The array is preferably formed on a silicon-on-sapphire (SOS) wafer. Arrays of electromagnetic radiation bridge detectors may also be formed, with the bridges having either resistor, thermocouple or Schottky junction constructions.
Abstract:
The invention relates to a multiple channel readout circuit optimized for a cryogenically operated IR sensor head. The circuit is applicable to the individual channel preamplifiers of a charge injection device (CID) IR sensor. Since the thermal leakage must be minimized, the voltages on the principal current supply path to the individual preamplifiers will vary when a strong signal is present on any channel. Crosstalk is avoided by using a four transistor cascode preamplifier circuit having a source follower output, in which the gate of the transistor, which acts as a load to the two cascoded transistors, is isolated from the drain of the load transistor, connected to a gate load node common to the other channels, and the node connected via a single connection of high thermal impedance to a terminal external to the cryogenic environment, at which filtering may be provided as needed.
Abstract:
An infrared imager includes an array of imager elements. Infrared radiation is focussed onto the array by a lens assembly including a plurality of lens elements. The imager array and the lens are within a cold box which includes an infrared-transparent window. For low noise, a spectrum-limiting filter is also located within the cold box, between the lens assembly and the window, at or within the pupil relief distance of the lens assembly. The pupil relief distance is extended by the use of at least one aspheric surface for one of the lens elements of the lens assembly. The mounting structure of the filter is the aperture stop for the infrared imager. The field of view may be reduced, if desired, without significant effect on the noise performance by use of a telescope including a second lens assembly optically identical to the first lens assembly, operated in conjunction with a confocal large-diameter lens assembly.