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    INTEGRATED STRUCTURE OF MEMS MICROPHONE AND PRESSURE SENSOR AND MANUFACTURING METHOD FOR THE INTEGRATED STRUCTURE
    31.
    发明申请
    INTEGRATED STRUCTURE OF MEMS MICROPHONE AND PRESSURE SENSOR AND MANUFACTURING METHOD FOR THE INTEGRATED STRUCTURE 审中-公开

    公开(公告)号：US20180050902A1

    公开(公告)日：2018-02-22

    申请号：US15554653

    申请日：2015-12-14

    Applicant: Goertek.Inc

    Inventor： Yanmei SUN

    IPC: B81B7/02 ,  H04R31/00 ,  H04R19/04 ,  H04R19/00 ,  B81C1/00 ,  G01L7/08

    CPC classification number: B81B7/02 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C2201/0105 ,  B81C2201/013 ,  G01L7/08 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

    Abstract: The present invention discloses a manufacturing method of an integrated structure of a MEMS microphone and a pressure sensor, which comprises the following steps: depositing an insulating layer, a first polycrystalline silicon layer, a sacrificial layer and a second polycrystalline silicon layer in sequence on a shared substrate; etching the second polycrystalline silicon layer to form a vibrating diaphragm and an upper electrode; eroding the sacrificial layer to form a containing cavity of a microphone and a pressure sensor, and etching the sacrificial layer between the microphone and the pressure sensor; etching the first polycrystalline silicon layer to form a back electrode of the microphone and a lower electrode of the pressure sensor; etching a position of the shared substrate below a back electrode of the microphone to form a back cavity; and etching away the region of the insulating layer below the back electrode. A capacitance structure of a MEMS microphone and that of a pressure sensor are integrated on a shared substrate, improving integration of a MEMS microphone and a pressure sensor, and greatly reducing a size of a whole packaging structure; in addition, a microphone and a pressure sensor can be simultaneously manufactured on a shared substrate to improve the efficiency of production.

    DIFFERENTIAL-CAPACITANCE TYPE MEMS MICROPHONE
    32.
    发明申请
    DIFFERENTIAL-CAPACITANCE TYPE MEMS MICROPHONE 审中-公开

    公开(公告)号：US20180041840A1

    公开(公告)日：2018-02-08

    申请号：US15554633

    申请日：2015-12-10

    Applicant: GOERTEK.INC

    Inventor： Guoguang ZHENG

    IPC: H04R19/04 ,  H04R7/04 ,  H04R1/04 ,  H04R19/00

    CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R3/005 ,  H04R7/04 ,  H04R19/005 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2410/01

    Abstract: The present invention discloses a differential-capacitance type MEMS microphone, comprising a circuit board, a first MEMS chip and a second MEMS chip; wherein the first MEMS chip comprises a first substrate disposed on the circuit board, and a first capacitor disposed on the first substrate, the first capacitor comprising a first back pole plate located above, a first vibrating diaphragm located below, and a first isolating layer disposed between the first back pole plate and the first vibrating diaphragm; the second MEMS chip comprises a second substrate disposed on the circuit board, and a second capacitor disposed on the second substrate, the second capacitor comprising a second back pole plate located below, a second vibrating diaphragm located above, and a second isolating layer disposed between the second back pole plate and the second vibrating diaphragm; and the first capacitor and the second capacitor form a pair of differential capacitors.

    COMBINED STRUCTURE OF PIEZOELECTRIC RECEIVER AND ULTRASONIC GENERATOR
    33.
    发明申请
    COMBINED STRUCTURE OF PIEZOELECTRIC RECEIVER AND ULTRASONIC GENERATOR 审中-公开

    公开(公告)号：US20180031683A1

    公开(公告)日：2018-02-01

    申请号：US15551203

    申请日：2015-11-16

    Applicant: Goertek.Inc

    Inventor： Kang PING ,  Xinfeng YANG

    IPC: G01S7/521 ,  H04R17/00

    CPC classification number: G01S7/521 ,  B06B1/0644 ,  G01S7/539 ,  G01S15/88 ,  G06F3/017 ,  G06F3/043 ,  G10K9/22 ,  H04R17/00

    Abstract: The present invention discloses a combined structure of a piezoelectric receiver and an ultrasonic generator comprises a piezoelectric plate, an ultrasonic signal generator, an audio signal input circuit and a switching circuit, wherein the input end of the switching circuit is connected with the ultrasonic signal generator and the audio signal input circuit, respectively, so as to switch therebetween; and the output end of the switching circuit is connected with the piezoelectric plate. The technical effect of the present invention is that the piezoelectric receiver and the ultrasonic generator are combined, such that functions of the receiver and the ultrasonic generator can be achieved only through one piezoelectric plate, saving the cost and the space.

    SPEAKER MODULE
    35.
    发明申请
    SPEAKER MODULE 审中-公开

    公开(公告)号：US20170353783A1

    公开(公告)日：2017-12-07

    申请号：US15540194

    申请日：2015-12-09

    Applicant: Goertek.Inc

    Inventor： Jincai HOU ,  Mingjie ZHONG

    IPC: H04R1/28 ,  H04R9/02 ,  H04R9/06

    CPC classification number: H04R1/2803 ,  H04R1/2873 ,  H04R1/345 ,  H04R9/02 ,  H04R9/025 ,  H04R9/06 ,  H04R2499/11

    Abstract: A speaker module relates to the technical field of electroacoustic products, and comprises a lower module casing, an upper module casing and a steel sheet which are successively combined together. A speaker monomer is contained in a space enclosed by the lower module casing, the upper module casing and the steel sheet. The speaker monomer, the upper module casing and the steel sheet together enclose a front sound cavity of the module. The front sound cavity is in communication with a sound outlet hole of the module, and the sound outlet hole is located on a side part of the speaker monomer. A sheet is adhered inside the steel sheet, the thickness of the sheet being about 0.1 mm˜0.2 mm and the material of the sheet being a soundproof material. The present speaker module solves the technical problem of the poor intermediate and high frequency performance of the speaker module in the prior art. The speaker module has a good intermediate and high frequency performance, a high overall acoustic performance, a thin thickness, and also a good stability, and a long service life.

    ENVIRONMENTAL SENSOR AND METHOD FOR MEASURING AND PREDICTING ENVIRONMENTAL PARAMETERS
    36.
    发明申请
    ENVIRONMENTAL SENSOR AND METHOD FOR MEASURING AND PREDICTING ENVIRONMENTAL PARAMETERS 审中-公开

    公开(公告)号：US20170343499A1

    公开(公告)日：2017-11-30

    申请号：US15538226

    申请日：2015-07-23

    Applicant: Goertek.Inc

    Inventor： Kun Wang

    IPC: G01N27/12 ,  G05D23/19 ,  G01N35/00

    CPC classification number: G01N27/121 ,  G01N35/00 ,  G05B13/026 ,  G05B19/042 ,  G05D23/1917

    Abstract: An environmental sensor and an environmental parameter measurement and prediction method, the environmental sensor comprising: a sensing element configured to sense an instant sensing characteristic value, so as to apply sending; an integrated circuit used for continuously obtaining the instant sensing characteristic value and an instant clock signal and obtaining via calculation an instant environmental parameter, so as to apply storing and outputting. A physical and chemical properties function corresponding to the sensing element is provided for the integrated circuit. Under a prediction model, the integrated circuit utilizes the physical and chemical properties function to conduct prediction calculation to obtain an actual environmental parameter, so as to apply storing and sending according to a current instant environmental parameter and an instant clock signal and at least one set of pre-stored instant environmental parameter and instant clock signal.

    Package structure of MEMS microphone
    38.
    发明授权
    Package structure of MEMS microphone 有权

    公开(公告)号：US10805716B2

    公开(公告)日：2020-10-13

    申请号：US15554623

    申请日：2015-12-10

    Applicant: GOERTEK.INC

    Inventor： Guoguang Zheng

    IPC: H04R1/28 ,  H04R19/04 ,  H04R1/22 ,  H04R19/00

    Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a package substrate and a package shell, wherein the package shell is provided on the package substrate and forms a closed cavity with the package substrate. In the package structure provided by the present invention, the sound-absorbing layer is arranged on the inner wall of the Helmholtz resonant cavity. The sound-absorbing layer has a certain absorption capacity to high-frequency sound waves, but has a very low absorption to low-frequency sound waves, so it may be equivalent to a “low-pass filter”. Through the absorption of the high-frequency sound waves, a high-frequency amplitude value of sound waves can be suppressed, reducing high-frequency response of the Helmholtz resonant cavity. That is, a high-frequency cut-off frequency of the sound waves is improved, widening operation bandwidth of the MEMS microphone.

    Sound wave filtering structure and side sound generating speaker module
    39.
    发明授权
    Sound wave filtering structure and side sound generating speaker module 有权

    公开(公告)号：US10511903B2

    公开(公告)日：2019-12-17

    申请号：US15560877

    申请日：2015-12-14

    Applicant: Goertek.Inc

    Inventor： Liguo Sun ,  Lianshan Ge

    IPC: H04R1/28 ,  H04R1/34

    Abstract: The present invention discloses a sound wave filtering structure. The sound wave filtering structure comprises a cavity wall, a cavity cover and a slit. The cavity cover is mounted on the cavity wall. The cavity wall and the cavity cover are combined to form an inner cavity. The slit is formed on the cavity wall and/or the cavity cover. The cavity wall and the cavity cover seal the inner cavity. A space in the inner cavity is communicated with the outside only through the slit. On the other hand, the present invention further provides a side sound generating speaker module. The side sound generating speaker module at least comprises a side sound generating cavity and the above-described sound wave filtering structure. The side sound generating cavity is configured to guide sound waves to be transmitted from a side surface of a single speaker body. The sound wave filtering structure is arranged on the side sound generating cavity. The slit faces the interior of the side sound generating cavity. The sound wave filtering structure provided by the present invention can adjust and filter high-frequency sound waves. Especially, in the side sound generating speaker module, the sound wave filtering structure can significantly improve the sound quality of the high-frequency sound waves.

    Environmental sensor and method for measuring and predicting environmental parameters
    40.
    发明授权
    Environmental sensor and method for measuring and predicting environmental parameters 有权

    公开(公告)号：US10317355B2

    公开(公告)日：2019-06-11

    申请号：US15538226

    申请日：2015-07-23

    Applicant: Goertek.Inc

    Inventor： Kun Wang

    IPC: G01N27/12 ,  G01N35/00 ,  G05B13/02 ,  G05D23/19 ,  G05B19/042

    Abstract: An environmental sensor and an environmental parameter measurement and prediction method, the environmental sensor comprising: a sensing element configured to sense an instant sensing characteristic value, so as to apply sending; an integrated circuit used for continuously obtaining the instant sensing characteristic value and an instant clock signal and obtaining via calculation an instant environmental parameter, so as to apply storing and outputting. A physical and chemical properties function corresponding to the sensing element is provided for the integrated circuit. Under a prediction model, the integrated circuit utilizes the physical and chemical properties function to conduct prediction calculation to obtain an actual environmental parameter, so as to apply storing and sending according to a current instant environmental parameter and an instant clock signal and at least one set of pre-stored instant environmental parameter and instant clock signal.

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