公开(公告)号：US20090071698A1

公开(公告)日：2009-03-19

申请号：US11863276

申请日：2007-09-28

Applicant: CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

Inventor： CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

IPC: H01R12/04

CPC classification number: H05K1/18 ,  H05K1/0271 ,  H05K2201/09418 ,  H05K2201/10015 ,  H05K2201/10651

Abstract: A circuit board includes a capacitor having two pins disposed thereon. A line determined by the two pins of the capacitor is not perpendicular to any of main sides of the circuit board.

Abstract translation: 电路板包括一个设置在其上的两个引脚的电容器。 由电容器的两个引脚确定的线不垂直于电路板的任何主侧。

公开(公告)号：US07451466B2

公开(公告)日：2008-11-11

申请号：US11309868

申请日：2006-10-16

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: G11B7/085

CPC classification number: G11B7/08582

Abstract: An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.

Abstract translation: 一种示例性的光盘驱动装置，包括构造成可移动地支撑拾取头的引导轴和可弹性变形的构件。 弹性变形构件包括主体，并且悬臂从主体的前边缘的中间部分倾斜。 悬臂在其下部较宽，在其上部较窄，并且悬臂用于弹性地按压导向轴的相应端。 可弹性变形的构件减小了悬臂与引导轴之间的应力表面，延长了其使用寿命。

公开(公告)号：US20080151521A1

公开(公告)日：2008-06-26

申请号：US11737147

申请日：2007-04-19

Applicant: YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K7/04 ,  H01L23/12

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K2201/09681

Abstract: A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.

Abstract translation: 提供电路板用于改善信号质量，包括布置在其上的多个信号迹线的信号平面和由阵列中彼此连接的多个瓦片形成的接地平面。 每个瓷砖由地面痕迹形成。 映射在接地平面上的信号迹线的不同线段以相似的角度交叉瓦片的接地迹线，从而最小化接地迹线和信号迹线之间的相互作用，以减少信号迹线的阻抗的差异。

公开(公告)号：US20080089032A1

公开(公告)日：2008-04-17

申请号：US11309887

申请日：2006-10-17

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H05K7/20

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10598 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括电路板，第一芯片和设置在电路板上的第二芯片。 在第一芯片周围的电路板中定义了四个固定孔，用于将散热模块安装在第一芯片上。 两个固定孔确定第一条线，另外两个固定孔确定与第一条线平行的第二条线。 第二芯片的中心位于第一和第二线之间的中心线处。 如果电路板受到冲击，可以有效地最小化或防止对芯片的损坏。

公开(公告)号：US20080074836A1

公开(公告)日：2008-03-27

申请号：US11309778

申请日：2006-09-23

Applicant: CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU ,  Zhi-Ping Wu

Inventor： CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU ,  Zhi-Ping Wu

IPC: G06F1/16

CPC classification number: G06F1/187

Abstract: A bracket assembly for receiving at least one disk drive (40) includes an enclosure (10), a retaining bracket (30), and a connecting structure (312). The retaining bracket includes a pair of sidewalls (31, 32). The retaining bracket is attached to the enclosure at an edge of each sidewall. The connecting structure is defined in a first sidewall (31) of the sidewalls for attaching the first sidewall to the enclosure for altering a fixing relationship between the retaining bracket and the enclosure. The connecting structure is positioned near the disk drive, and away from the edge of the first sidewall. The method of assembling the bracket (30) to the enclosure (10) is also provided.

Abstract translation: 用于容纳至少一个盘驱动器（40）的支架组件包括外壳（10），固定支架（30）和连接结构（312）。 保持支架包括一对侧壁（31,32）。 保持支架在每个侧壁的边缘附接到外壳。 连接结构限定在侧壁的第一侧壁（31）中，用于将第一侧壁附接到外壳以改变保持支架和外壳之间的固定关系。 连接结构位于盘驱动器附近，并远离第一侧壁的边缘。 还提供了将支架（30）组装到外壳（10）的方法。

公开(公告)号：US20080073069A1

公开(公告)日：2008-03-27

申请号：US11309777

申请日：2006-09-23

Applicant: JENG-DA WU ,  CHIH-HANG CHAO ,  YU-HSU LIN

Inventor： JENG-DA WU ,  CHIH-HANG CHAO ,  YU-HSU LIN

IPC: H05K7/20

CPC classification number: H01L23/367 ,  F28D2021/0029 ,  F28F3/06 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink is provided to include a base (10) and a plurality of fins (20) mounted on the base. Each fin includes a heat dissipating portion (21). A plurality of notches (111) is defined in the base. A plurality of tabs (23) is protruded down from a bottom of each heat dissipating portion corresponding to the notches respectively.

Abstract translation: 提供散热器以包括安装在基座上的基座（10）和多个散热片（20）。 每个散热片包括散热部分（21）。 多个凹口（111）被限定在底座中。 多个突片（23）分别从对应于凹口的每个散热部分的底部向下突出。

公开(公告)号：US06972489B2

公开(公告)日：2005-12-06

申请号：US10639579

申请日：2003-08-13

Applicant: Jeng Da Wu ,  Ching Hsu Yang

Inventor： Jeng Da Wu ,  Ching Hsu Yang

IPC: H01L21/56 ,  H01L23/34 ,  H01L29/40

CPC classification number: H01L24/17 ,  H01L21/563 ,  H01L23/34 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/17515 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/01014 ,  H01L2224/0401

Abstract: A flip chip package with a thermometer comprises a chip, a substrate, and a thermocouple. The chip has an active surface and a plurality of bumps disposed on the active surface. The substrate defines a region for disposing the chip, and comprises a plurality of bump pads disposed on the region, corresponding to the bumps, and electrically connected to the bumps. Each of the thermocouples comprises a thermal contact which is disposed between the substrate and one of the bumps of the chip.

Abstract translation: 具有温度计的倒装芯片封装包括芯片，基板和热电偶。 芯片具有活性表面和设置在活性表面上的多个凸起。 衬底限定用于布置芯片的区域，并且包括布置在该区域上的多个凸块，其对应于凸块并电连接到凸块。 每个热电偶包括设置在基板和芯片的凸块中的一个之间的热接触。

公开(公告)号：US06891274B2

公开(公告)日：2005-05-10

申请号：US10604794

申请日：2003-08-18

Applicant: William Tze-You Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Jeng-Da Wu ,  Chih-Huang Chang ,  Po-Jen Cheng

Inventor： William Tze-You Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Jeng-Da Wu ,  Chih-Huang Chang ,  Po-Jen Cheng

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/05 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05572 ,  H01L2224/13109 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The under-bump-metallurgy layer comprises an adhesion layer, a barrier layer and a wettable layer. The adhesion layer is directly formed over the contact pad. The barrier layer made from a material such as nickel-vanadium alloy is formed over the adhesion layer. The wettable layer made from a material such as copper is formed over the barrier layer. The wettable layer has an overall thickness that ranges from about 3 μm to about 8 μm.

Abstract translation: 提供了凸块下的冶金层。 凸块下金属层形成在芯片的接触焊盘上，并且焊接块形成在球下冶金层之上。 凸块下冶金层包括粘合层，阻挡层和可润湿层。 粘合层直接形成在接触垫上。 在粘合层上形成由诸如镍 - 钒合金的材料制成的阻挡层。 由诸如铜的材料制成的可湿性层形成在阻挡层上。 可湿性层的总厚度范围为约3μm至约8μm。

公开(公告)号：US07864536B2

公开(公告)日：2011-01-04

申请号：US12464560

申请日：2009-05-12

Applicant: Qin Li ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Qin Li ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K7/20 ,  H01L23/36

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/0064 ,  H05K7/205 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009

Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.

Abstract translation: 电路板组件包括其上安装有两个散热组件的电路板和附接到电路板的下侧的L形背板。 每个散热组件在其相对的角部处包括至少一对固定构件。 背板包括第一部分和第二部分，每个部分限定与散热组件的固定部件相对应的至少一对圆形突起。

公开(公告)号：US07763817B2

公开(公告)日：2010-07-27

申请号：US12102019

申请日：2008-04-14

Applicant: Zhi-Ping Wu ,  Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Zhi-Ping Wu ,  Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H01H3/20

CPC classification number: H01H3/46 ,  G06F1/181

Abstract: A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch.

Abstract translation: 用于按压计算机挡板中的开关的按钮组件包括连接到臂的按钮。 计算机挡板中定义了一个切口。 按钮插入切口，臂可枢转地安装在计算机挡板上。 按压部从臂的一侧向外延伸。 在按压部上形成有倾斜的按压面。 按下按钮可移动手臂，使倾斜按压平面远离手臂的一端接触开关。 开关抵抗按压部，使臂旋转，使得倾斜按压面的另一端向前移动，由此倾斜的按压面完全接触并启动开关。