公开(公告)号：US20240266275A1

公开(公告)日：2024-08-08

申请号：US18440381

申请日：2024-02-13

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/49861 ,  H01L21/4846

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US20240047334A1

公开(公告)日：2024-02-08

申请号：US18316586

申请日：2023-05-12

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, JR. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838 ,  H01L21/486 ,  H01L21/56 ,  H01L21/485 ,  H01L21/4857 ,  H01L23/3157

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US11882653B2

公开(公告)日：2024-01-23

申请号：US17663764

申请日：2022-05-17

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/036 ,  H05K1/181 ,  H05K3/303 ,  H05K3/42

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20230290717A1

公开(公告)日：2023-09-14

申请号：US18114420

申请日：2023-02-27

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/49861 ,  H01L21/4846

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US11682615B2

公开(公告)日：2023-06-20

申请号：US16885854

申请日：2020-05-28

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H01L21/485 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US11619554B2

公开(公告)日：2023-04-04

申请号：US16893427

申请日：2020-06-04

Applicant: Liquid Wire Inc.

Inventor： Mark Ronay ,  Jorge E. Carbo

IPC: G01L1/04 ,  G01L1/22 ,  G01L1/26

Abstract: A sensor may include a deformable sensing element having a deformable conductor arranged to deform in response to deformation of the sensing element, wherein the deformation of the sensing element is selectively controlled. The sensing element may be selectively controlled by a restraining element. The restraining element may control the deformation of the sensing element by distributing forces applied to the sensing element. The sensing element may include a deformable body with the deformable conductor arranged to respond to elongation of the deformable body. The deformable conductor may include a conductive gel. A sensor may include a deformable body, a deformable conductor arranged to deform in response to deformation of the deformable body, and a restraining element arranged to selectively control the deformation of the deformable body.

公开(公告)号：US11607863B1

公开(公告)日：2023-03-21

申请号：US16831762

申请日：2020-03-26

Applicant: Liquid Wire Inc.

Inventor： Mark Ronay

IPC: B32B5/26 ,  B32B5/02 ,  B32B7/12

Abstract: A deformable assembly may include a first structural layer, a first bonding layer bonded to the structural layer, and a pattern of functional material entrapped between the first structural layer and first the bonding layer. The functional material has a viscous characteristic, an elastic characteristic and/or a viscoelastic characteristic. The assembly may further include a second structural layer bonded to the first bonding layer. The first structural layer may include a first piece of fabric, the second structural layer may include a second piece of fabric, and the functional material may be electrically conductive. The functional material may include a conductive gel. The assembly may further include a second bonding layer bonded to the first bonding layer and the first structural layer, and the pattern of functional material may be entrapped between the first and second bonding layers.

公开(公告)号：US11088063B2

公开(公告)日：2021-08-10

申请号：US16548379

申请日：2019-08-22

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US20190056277A1

公开(公告)日：2019-02-21

申请号：US16157102

申请日：2018-10-11

Applicant: Liquid Wire Inc.

Inventor： Mark Ronay

IPC: G01L1/22 ,  H01B1/02 ,  H01B1/16 ,  H01Q9/26

Abstract: A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.

公开(公告)号：US12298128B2

公开(公告)日：2025-05-13

申请号：US18001443

申请日：2021-06-11

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Jorge E. Carbo, Jr. ,  Michael Adventure Hopkins

IPC: G01B7/16

Abstract: A flexible differential strain sensor, system, and method includes a deformable substrate having a first axis and a second axis different than the first axis and a first sensing element and a second sensing element. The first and second sensing elements are comprised of conductive gel. The first sensing element is arranged to sense strain in the deformable substrate along the first axis. The second sensing element has a first portion arranged to sense strain in the deformable substrate along the first axis and a second portion arranged to sense strain in the deformable substrate along the second axis. The second sensing element is arranged to cancel at least a portion of the stimulus sensed by the first sensing element in the along the first axis.