公开(公告)号：US08510939B2

公开(公告)日：2013-08-20

申请号：US11924696

申请日：2007-10-26

Applicant: Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

Inventor： Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

IPC: H01K3/22

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以引起曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

公开(公告)号：US08412339B2

公开(公告)日：2013-04-02

申请号：US11924709

申请日：2007-10-26

Applicant: Jerry Ok ,  Robert J. Greenberg ,  Neil Hamilton Talbot ,  James Singleton Little ,  Rongqing Dai ,  Jordan Matthew Neysmith ,  Kelly H. McClure

Inventor： Jerry Ok ,  Robert J. Greenberg ,  Neil Hamilton Talbot ,  James Singleton Little ,  Rongqing Dai ,  Jordan Matthew Neysmith ,  Kelly H. McClure

IPC: A61N1/18

CPC classification number: A61N1/36046 ,  A61F15/001 ,  A61N1/0529 ,  A61N1/0543 ,  A61N1/36125 ,  A61N1/375 ,  H01L23/055 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L24/16 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.

Abstract translation: 本发明是用于植入人体的改进的密封包装。 可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。

公开(公告)号：US20120309134A1

公开(公告)日：2012-12-06

申请号：US13567366

申请日：2012-08-06

Applicant: Robert J Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

Inventor： Robert J Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC: H01L21/56

CPC classification number: A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

Abstract translation: 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（IBAD）形成的氧化铝之类的绝缘体中，并且具有从器件上的接触焊盘延伸到密封层中的孔的生物相容性导电层的堆叠。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

公开(公告)号：US08258635B2

公开(公告)日：2012-09-04

申请号：US12726274

申请日：2010-03-17

Applicant: Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

Inventor： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC: H01L23/29

CPC classification number: A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

Abstract translation: 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔 层。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

公开(公告)号：US08145322B1

公开(公告)日：2012-03-27

申请号：US12177038

申请日：2008-07-21

Applicant: Qingfang Yao ,  Jordan Matthew Neysmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

Inventor： Qingfang Yao ,  Jordan Matthew Neysmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

IPC: A61N1/04

CPC classification number: A61N1/05 ,  A61N1/0541 ,  A61N1/0543 ,  B23K26/361 ,  B23K26/362

Abstract: The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

Abstract translation: 本发明涉及一种柔性电路电极阵列器件，包括：聚合物层; 其中所述聚合物层包括一个或多个金属迹线，电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。

公开(公告)号：US20090143848A1

公开(公告)日：2009-06-04

申请号：US12267489

申请日：2008-11-07

Applicant: Robert J. Greenberg ,  David Daomin Zhou ,  Jordan Matthew Neysmith ,  Kelly H. McClure ,  Jianing Wei ,  Neil Hamilton Talbot ,  James Singleton Little

Inventor： Robert J. Greenberg ,  David Daomin Zhou ,  Jordan Matthew Neysmith ,  Kelly H. McClure ,  Jianing Wei ,  Neil Hamilton Talbot ,  James Singleton Little

IPC: A61N1/05

CPC classification number: A61N1/0541 ,  A61N1/0472

Abstract: A cochlear stimulation device comprising an electrode array designed to provide enhanced charge injection capacity necessary for neural stimulation. The electrode array comprises electrodes with high surface area or a fractal geometry and correspondingly high electrode capacitance and low electrical impedance. The resultant electrodes have a robust surface and sufficient mechanical strength to withstand physical stress vital for long term stability. The device further comprises wire traces having a multilayer structure which provides a reduced width for the conducting part of the electrode array. The cochlear prosthesis is attached by a grommet to the cochleostomy that is made from a single piece of biocompatible polymer. The device, designed to achieve optimum neural stimulation by appropriate electrode design, is a significant improvement over commercially available hand-built devices.

Abstract translation: 耳蜗刺激装置包括设计成提供神经刺激所需的增强的电荷注入能力的电极阵列。 电极阵列包括具有高表面积或分形几何形状的电极以及相当高的电极电容和低的电阻抗。 所得电极具有坚固的表面和足够的机械强度以抵抗对于长期稳定性至关重要的物理应力。 该装置还包括具有多层结构的导线迹线，其为电极阵列的导电部分提供减小的宽度。 耳蜗假体通过索环连接到由单一生物相容性聚合物制成的耳蜗切开术。 该设备旨在通过适当的电极设计实现最佳神经刺激，这是相对于市售的手工设备的显着改进。

公开(公告)号：US20080288036A1

公开(公告)日：2008-11-20

申请号：US12032627

申请日：2008-02-15

Applicant: Robert J. Greenberg ,  Eugene de Juan ,  Mark S. Humayun ,  Kelly H. McClure ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Brian V. Mech ,  James Singleton Little ,  Mohamed Khaldi

Inventor： Robert J. Greenberg ,  Eugene de Juan ,  Mark S. Humayun ,  Kelly H. McClure ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Brian V. Mech ,  James Singleton Little ,  Mohamed Khaldi

IPC: A61N1/04

CPC classification number: A61N1/0543 ,  A61N1/05 ,  A61N1/0541 ,  H05K1/0393 ,  H05K1/118

Abstract: The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.

Abstract translation: 本发明涉及柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及嵌入在所述阵列中的至少一个支撑。 本发明还涉及一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及将电极阵列与互连衬垫连接的折叠柔性电路电缆。 本公开还涉及一种制造柔性电路电极阵列的方法，包括：沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 将所述柔性电路电极阵列加热到模具中以在所述柔性电路电极阵列中形成三维形状，至少在基层，顶层或基底与顶层之间嵌入支撑件，和/或折叠柔性电路电缆 至少一次将电极阵列与互连衬垫连接在一起。

公开(公告)号：US20070287784A1

公开(公告)日：2007-12-13

申请号：US11595516

申请日：2006-11-10

Applicant: Lucien D. Laude ,  Neil Hamilton Talbot ,  Robert J. Greenberg

Inventor： Lucien D. Laude ,  Neil Hamilton Talbot ,  Robert J. Greenberg

IPC: C08K3/22 ,  B60C1/00

CPC classification number: H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/204 ,  H05K1/0289 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/007 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2203/016 ,  H05K2203/1105

Abstract: The present invention relates to a process for embedding at least one layer of at least one metal trace in a silicone containing polymer, comprising: a) applying a non adhering on a substrate; b) applying a polymer layer on the non adhering agent; c) irradiation at least one surface area of said polymer with a light beam emitted by an excimer laser; d) immersing said irradiated polymer in at least one autocatalytic bath containing metal ions of at least one metal and metallizing the polymer; e) thermally treating said metallized polymer; f) applying a polymer layer on said thermally treated metallized polymer; and g) thermally treating said metallized polymer.

Abstract translation: 本发明涉及一种在含硅氧烷聚合物中嵌入至少一层至少一种金属迹线的方法，包括：a）将不粘附在基底上; b）在非粘合剂上施加聚合物层; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将所述照射的聚合物浸入至少一种含有至少一种金属的金属离子并使聚合物金属化的自催化浴; e）热处理所述金属化聚合物; f）将聚合物层施加在所述热处理的金属化聚合物上; 和g）热处理所述金属化聚合物。

公开(公告)号：US10137303B2

公开(公告)日：2018-11-27

申请号：US13473470

申请日：2012-05-16

Applicant: Robert J Greenberg ,  David Daomin Zhou ,  Brian V Mech ,  Neil Hamilton Talbot ,  Rongqing Dai ,  Richard Agustin Castro ,  Kelly H. McClure

Inventor： Robert J Greenberg ,  David Daomin Zhou ,  Brian V Mech ,  Neil Hamilton Talbot ,  Rongqing Dai ,  Richard Agustin Castro ,  Kelly H. McClure

IPC: A61B5/04 ,  A61N1/00 ,  A61N1/36 ,  A61B5/00 ,  A61N1/05 ,  A61N1/375 ,  H05K1/11 ,  H05K1/18

Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to the at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. The output signals provide control for a motor prosthesis and the inputs signals provide sensory feedback for the motor prosthesis. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

公开(公告)号：US09643002B2

公开(公告)日：2017-05-09

申请号：US13167074

申请日：2011-06-23

Applicant: Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  James Singleton Little ,  Brian V. Mech

Inventor： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  James Singleton Little ,  Brian V. Mech

IPC: A61N1/05 ,  A61N1/36 ,  H05K1/11 ,  H05K3/00

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/05 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09409 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49174 ,  Y10T29/49176

Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening.