公开(公告)号：US20060259109A1

公开(公告)日：2006-11-16

申请号：US11489777

申请日：2006-07-19

Applicant: Dao Zhou ,  Robert Greenberg ,  Neil Talbot

Inventor： Dao Zhou ,  Robert Greenberg ,  Neil Talbot

IPC: A61N1/05

CPC classification number: A61L31/088 ,  A61N1/05 ,  A61N1/0565 ,  C25D5/08 ,  C25D5/10 ,  C25D9/06

Abstract: An implantable electrode and method for manufacturing the electrode wherein the electrode has a strong, adherent surface coating of iridium oxide or titanium nitride on a platinum surface, which demonstrates an increase in surface area of at least five times when compared to smooth platinum of the same geometry. The iridium oxide coating may be formed on platinum by a physical deposition process, such as sputtering. The process of electroplating the iridium oxide surface coating is accomplished by voltage control processes. A gradient coating of iridium oxide ranging in composition from essentially pure platinum to essentially pure iridium oxide is produced by sputtering.

公开(公告)号：US20060247734A1

公开(公告)日：2006-11-02

申请号：US11385315

申请日：2006-03-20

Applicant: Robert Greenberg ,  Jerry Ok ,  Neil Talbot ,  Kevin Wilkin

Inventor： Robert Greenberg ,  Jerry Ok ,  Neil Talbot ,  Kevin Wilkin

IPC: A61N1/18

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

Abstract: The present invention is an improved package and configuration for an implantable retinal prosthesis. The retinal prosthesis of the present invention includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.

公开(公告)号：US20060036295A1

公开(公告)日：2006-02-16

申请号：US10918112

申请日：2004-08-13

Applicant: Robert Greenberg ,  Neil Talbot ,  Brian Mech ,  James Little

Inventor： Robert Greenberg ,  Neil Talbot ,  Brian Mech ,  James Little

IPC: A61N1/05

CPC classification number: A61N1/0543 ,  A61N1/36046

Abstract: The invention is a retinal prosthesis with an improved configuration mounting necessary components within and surrounding the eye. The present invention better allows for the implantation of electronics within the delicate eye structure. The invention further limits the necessary width of a thin film conductor passing through the sclera by use of a multiplexer external to the sclera and a demultiplexer internal to the sclera.

公开(公告)号：US08880165B2

公开(公告)日：2014-11-04

申请号：US13009769

申请日：2011-01-19

Applicant: Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61N1/00 ,  A61N1/36 ,  A61N1/05 ,  A61N1/375 ,  H01L23/498 ,  H05K3/36 ,  H05K1/03 ,  H05K3/46 ,  H05K3/32 ,  H05K3/42 ,  H01L21/56 ,  H05K3/40

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20110118808A1

公开(公告)日：2011-05-19

申请号：US13009769

申请日：2011-01-19

Applicant: Greenberg Robert J. ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

Inventor： Greenberg Robert J. ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61F9/08 ,  A61N1/36

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20100168830A1

公开(公告)日：2010-07-01

申请号：US12718864

申请日：2010-03-05

Applicant: Andy Hung ,  Robert Greenberg ,  Dau Min Zhou ,  Jack Judy ,  Neil Talbot

Inventor： Andy Hung ,  Robert Greenberg ,  Dau Min Zhou ,  Jack Judy ,  Neil Talbot

IPC: A61N1/05

CPC classification number: A61N1/05 ,  A61N1/0526 ,  A61N1/0541 ,  A61N1/0543 ,  A61N1/0551

Abstract: The present invention is a micro-machined electrode for neural-electronic interfaces which can achieve a ten times lower impedance and higher charge injection limit for a given material and planar area.

Abstract translation: 本发明是用于神经 - 电子接口的微加工电极，其可以为给定材料和平面区域实现十倍低阻抗和更高电荷注入极限。

公开(公告)号：US20080085376A1

公开(公告)日：2008-04-10

申请号：US11924363

申请日：2007-10-25

Applicant: Lucien Laude ,  Neil Talbot ,  Robert Greenberg

Inventor： Lucien Laude ,  Neil Talbot ,  Robert Greenberg

IPC: B05D3/06

CPC classification number: H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/204 ,  H05K1/0289 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/007 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2203/016 ,  H05K2203/1105

Abstract: The present invention relates to a process for embedding at least one layer of at least one metal trace in a silicone containing polymer, comprising: a) applying a non adhering on a substrate; b) applying a polymer layer on the non adhering agent; c) irradiation at least one surface area of said polymer with a light beam emitted by an excimer laser; d) immersing said irradiated polymer in at least one autocatalytic bath containing metal ions of at least one metal and metallizing the polymer; e) thermally treating said metallized polymer; f) applying a polymer layer on said thermally treated metallized polymer; and g) thermally treating said metallized polymer.

Abstract translation: 本发明涉及一种在含硅氧烷聚合物中嵌入至少一层至少一种金属迹线的方法，包括：a）将不粘附在基底上; b）在非粘合剂上施加聚合物层; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将所述照射的聚合物浸入至少一种含有至少一种金属的金属离子并使聚合物金属化的自催化浴; e）热处理所述金属化聚合物; f）将聚合物层施加在所述热处理的金属化聚合物上; 和g）热处理所述金属化聚合物。

公开(公告)号：US20070265665A1

公开(公告)日：2007-11-15

申请号：US11821328

申请日：2007-06-21

Applicant: Robert Greenberg ,  Neil Talbot ,  Jordan Neysmith ,  James Little ,  Brian Mech

Inventor： Robert Greenberg ,  Neil Talbot ,  Jordan Neysmith ,  James Little ,  Brian Mech

IPC: A61N1/18

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/05 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09409 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49174 ,  Y10T29/49176

Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.

Abstract translation: 本发明提供一种适用于神经刺激的柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基层上的聚合物顶层和所述金属迹线至少一个粘性开口; 其中所述聚合物基层，所述金属迹线和所述聚合物顶层被热成型为三维形状。 本发明还提供一种制造柔性电路电极阵列的方法，包括沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 准备至少一个开口; 并将所述柔性电路电极阵列加热到模具中，以在所述柔性电路电极阵列中形成三维形状。

公开(公告)号：US07263403B2

公开(公告)日：2007-08-28

申请号：US10918112

申请日：2004-08-13

Applicant: Robert Greenberg ,  Neil Talbot ,  Brian V. Mech ,  James Little

Inventor： Robert Greenberg ,  Neil Talbot ,  Brian V. Mech ,  James Little

IPC: A61N1/00

CPC classification number: A61N1/0543 ,  A61N1/36046

Abstract: The invention is a retinal prosthesis with an improved configuration mounting necessary components within and surrounding the eye. The present invention better allows for the implantation of electronics within the delicate eye structure. The invention further limits the necessary width of a thin film conductor passing through the sclera by use of a multiplexer external to the sclera and a demultiplexer internal to the sclera.

公开(公告)号：US20070096281A1

公开(公告)日：2007-05-03

申请号：US11592487

申请日：2006-11-02

Applicant: Robert Greenberg ,  Neil Talbot ,  Jordan Neysmith ,  Jerry Ok ,  Honggang Jiang

Inventor： Robert Greenberg ,  Neil Talbot ,  Jordan Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC: H01L23/20 ,  H01L23/10 ,  H01L23/043 ,  H01L21/00

CPC classification number: A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An implantable hermetically sealed microelectronic device, and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

Abstract translation: 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔 层。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。