公开(公告)号：US20130206351A1

公开(公告)日：2013-08-15

申请号：US13371430

申请日：2012-02-11

Applicant: PETER A. GRUBER ,  PAUL A. LAURO ,  JAE-WOONG NAH

Inventor： PETER A. GRUBER ,  PAUL A. LAURO ,  JAE-WOONG NAH

IPC: B22D23/00 ,  B22D29/02 ,  B22D25/02

CPC classification number: B22D29/02 ,  B22C9/061 ,  B22D21/027 ,  B22D23/00 ,  B22D25/02

Abstract: A process and tools for forming and/or releasing metal preforms, metal shapes and solder balls is described incorporating flexible molds or sheets, injection molded metal such as solder and in the case of solder balls, a liquid or gaseous environment to reduce or remove metal oxides prior to or during metal (solder) reflow to increase surface tension to form spherical or substantially spherical solder-balls.

Abstract translation: 描述了用于形成和/或释放金属预成型件，金属形状和焊球的工艺和工具，其包括柔性模具或片材，注射成型金属如焊料，以及在焊球的情况下，液体或气体环境以减少或去除金属 金属（焊料）回流之前或期间的氧化物，以增加表面张力以形成球形或基本上球形的焊球。

公开(公告)号：US20120273155A1

公开(公告)日：2012-11-01

申请号：US13438505

申请日：2012-04-03

Applicant: Peter A. Gruber ,  Jae-Woong Nah

Inventor： Peter A. Gruber ,  Jae-Woong Nah

IPC: B22D25/02

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/3841 ,  H05K3/3478 ,  H05K2203/041 ,  H01L2924/01082 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/0105 ,  H01L2924/00

Abstract: The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls.

Abstract translation: 本公开涉及制造具有均匀尺寸的焊球的方法。 更具体地说，本公开涉及改进的焊球形成过程，其防止或减少回流期间两个或更多个焊球的桥接/合并。 本公开的方法是期望的，因为它们不需要筛选步骤来获得均匀尺寸的焊球。

公开(公告)号：US08162200B2

公开(公告)日：2012-04-24

申请号：US13156736

申请日：2011-06-09

Applicant: Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

Inventor： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: B23K31/02 ,  B26D3/00 ,  B29C65/64

CPC classification number: B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09472 ,  H05K2203/0126 ,  Y10T29/49826 ,  Y10T156/1062 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

Abstract translation: 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。

公开(公告)号：US08053283B2

公开(公告)日：2011-11-08

申请号：US12731802

申请日：2010-03-25

Applicant: Peter A. Gruber ,  Jae-Woong Nah

Inventor： Peter A. Gruber ,  Jae-Woong Nah

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/29 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/27 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05557 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2732 ,  H01L2224/29006 ,  H01L2224/29015 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/3207 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T29/41 ,  Y10T29/5313 ,  Y10T29/53178 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: A die level integrated interconnect decal manufacturing method and apparatus for implementing the method. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming and utilization, in the present instance there are employed underfills which consist of a solid film material and which are applied between a semiconductor chip and the substrate in order to enhance the reliability of a flip chip package. In particular, the underfill material increases the resistance to fatigue of controlled collapse chip connect (C4) bumps.

Abstract translation: 一种用于实现该方法的芯片级集成互连贴花制造方法和装置。 根据关于集成电路和基板的焊接的技术，特别是提供焊接贴花方法的形成和利用，在本实例中，使用由固体膜材料构成的底部填充材料，其被施加在半导体芯片和 衬底，以提高倒装芯片封装的可靠性。 特别地，底部填充材料增加了受控的崩溃芯片连接（C4）凸点的耐疲劳性。

公开(公告)号：US07955966B2

公开(公告)日：2011-06-07

申请号：US12543811

申请日：2009-08-19

Applicant: Peter A. Gruber ,  Barry A. Hochlowski ,  David T. Naugle

Inventor： Peter A. Gruber ,  Barry A. Hochlowski ,  David T. Naugle

IPC: H01L23/498

CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/013

Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.

Abstract translation: 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。

公开(公告)号：US07810702B2

公开(公告)日：2010-10-12

申请号：US12166523

申请日：2008-07-02

Applicant: Steven A. Cordes ,  Peter A. Gruber

Inventor： Steven A. Cordes ,  Peter A. Gruber

IPC: H05K3/34 ,  H01L21/00 ,  B23K31/00

CPC classification number: B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043

Abstract: A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs.

Abstract translation: 在注射成型焊料（IMS）模具中制造支座的方法，其具有空腔，其中使用诸如筛选或IMS的标准技术填充焊膏。 该焊膏被加热至回流温度，焊料熔化并形成球或球。 由于已知焊膏由于其中含有有机材料燃烧而体积减小，所以剩余的焊球体积将明显低于空腔。 然后将具有较低熔点的焊料材料填充到围绕焊料球的空腔中。 然后允许模具和焊料金属冷却，导致在由熔点较低的焊料材料包围的空腔中形成金属固体球，其在转移到晶片时形成支座。

公开(公告)号：US20100230143A1

公开(公告)日：2010-09-16

申请号：US12787485

申请日：2010-05-26

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H05K1/03

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电结构，包括包括第一导电焊盘的第一基板，包括第二导电焊盘的第二基板和将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US20100224670A1

公开(公告)日：2010-09-09

申请号：US12399244

申请日：2009-03-06

Applicant: Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

Inventor： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: B23K3/06 ,  B32B38/10

CPC classification number: B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09472 ,  H05K2203/0126 ,  Y10T29/49826 ,  Y10T156/1062 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

Abstract translation: 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。

公开(公告)号：US07786001B2

公开(公告)日：2010-08-31

申请号：US11733840

申请日：2007-04-11

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H01L21/44

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电气结构和成型方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US07506794B1

公开(公告)日：2009-03-24

申请号：US12166505

申请日：2008-07-02

Applicant: Steven A. Cordes ,  Peter A. Gruber

Inventor： Steven A. Cordes ,  Peter A. Gruber

IPC: H05K3/34 ,  H01L21/00 ,  H01L23/488

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06505 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/14505 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/09781 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method in forming high-temperature alloy solder standoff in a solder bumping process, such as in injection molded solder molds. The standoffs are formed in an injection molded solder mold, by means of pre-depositing a layer of a metal at select sites, such as some of the cavities which are formed in the surface of the mold, and thereafter, filling the mold cavities with solder, utilizing standard techniques as known in the technology. The particular metal, which is deposited in at least some of the mold cavities, will alloy with the solder during or after transfer, and will result in the formation of a higher temperature alloy solder at select locations in the mold cavities.

Abstract translation: 在焊接凸块工艺中形成高温合金焊料支架的方法，例如在注塑模具中。 通过在选定位置预先沉积金属层，例如形成在模具表面中的一些空腔，然后在模具腔中填充模具腔，在注塑模具中形成支座 焊料，利用技术中已知的标准技术。 沉积在至少一些模腔中的特定金属将在转移期间或转移后与焊料合金，并且将导致在模腔中的选定位置形成更高温度的合金焊料。