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    Electrical contact device and associated method of manufacture
    31.
    发明授权
    Electrical contact device and associated method of manufacture 有权
    电接点装置及相关制造方法

    公开(公告)号：US06179659B2

    公开(公告)日：2001-01-30

    申请号：US09132248

    申请日：1998-08-11

    Applicant: Walter Moden

    Inventor： Walter Moden

    IPC: H01R1340

    CPC classification number: H01R13/2435 ,  H01R13/2442 ,  H01R13/405 ,  H01R43/24 ,  Y10T29/49121 ,  Y10T29/4914 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/53178 ,  Y10T29/53183

    Abstract: The invention provides an electrical contact device, a pre-assembly for producing the electrical contact device, and a method of forming the electrical contact device. The electrical contact device includes a plurality of fine pitch electrical leads disposed in parallel spaced apart relation. An insulating member encapsulates portions of the electrical leads which extend from opposite sides of the insulating member. The insulating member retains the electrical leads in position and electrically isolated from one another. The contact device is used to facilitate connection with the leads of an IC package.

    Abstract translation: 本发明提供一种电接触装置，用于制造电接触装置的预组件以及形成电接触装置的方法。 电接触装置包括以平行隔开的关系设置的多个细间距电引线。 绝缘构件封装从绝缘构件的相对侧延伸的电引线的部分。 绝缘构件将电引线保持在适当位置并且彼此电隔离。 该接触装置用于促进与IC封装的引线的连接。

    Component module holder
    32.
    发明授权
    Component module holder 失效
    组件模块座

    公开(公告)号：US6095822A

    公开(公告)日：2000-08-01

    申请号：US6395

    申请日：1998-01-13

    Applicant: David J. Corisis ,  Larry D. Kinsman ,  Walter Moden

    Inventor： David J. Corisis ,  Larry D. Kinsman ,  Walter Moden

    IPC: H01L23/32 ,  H01L25/10 ,  H05K3/30 ,  H01R9/09

    CPC classification number: H01L23/32 ,  H01R12/7023 ,  H01R12/714 ,  H05K3/301 ,  H01L25/105 ,  H01L2924/0002 ,  H01L2924/09701

    Abstract: A component module holder is adapted to hold a plurality of integrated circuit devices in alignment with one another in a way that enables the devices to be directly plugged to a printed circuit board. In this condition, the holder is secured to said printed circuit board with the contacts on said integrated circuit devices making contacts with appropriate contacts on the printed circuit board. This direct contact between the packaged integrated circuit device leads and a board may reduce the die bond pad to board pad stub length, improving speed. This arrangement may also allow the integrated circuit devices to be replaced and upgraded as a whole as needed. The holder may be utilized, for example, to upgrade system integrated circuit devices in computer systems by providing a plurality of connected, integrated circuit dynamic random access memory elements directly pluggable onto a computer system motherboard.

    Abstract translation: 组件模块保持器适于将多个集成电路设备彼此对准，使得设备能够直接插入印刷电路板。 在这种情况下，保持器被固定到所述印刷电路板上，所述集成电路装置上的触点与印刷电路板上的适当触点接触。 封装的集成电路器件引线和电路板之间的这种直接接触可以将管芯接合焊盘减小到板焊盘短截线长度，从而提高速度。 这种安排还可以根据需要整体地替换和升级集成电路设备。 例如，可以通过提供可以直接插到计算机系统主板上的多个连接的集成电路动态随机存取存储器元件来将保持器用于例如升级计算机系统中的系统集成电路装置。

    Methods for installing a plurality of circuit devices
    33.
    发明授权
    Methods for installing a plurality of circuit devices 失效
    安装多个电路装置的方法

    公开(公告)号：US07600314B2

    公开(公告)日：2009-10-13

    申请号：US11218995

    申请日：2005-09-01

    Applicant: Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    Inventor： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    IPC: H01R9/00 ,  H05K3/00

    CPC classification number: H05K7/1415 ,  B25B27/00 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49169 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53209 ,  Y10T29/53257 ,  Y10T29/53261 ,  Y10T29/53265

    Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

    Abstract translation: 提供了一种技术，用于将诸如存储设备的电路组件安装在诸如插座的支撑件中。 要安装的设备支撑在支架或外壳中。 保持器定位在接收插座中的支撑区域上方。 将手动执行器压入保持器中以将装置从保持器中排出并将装置安装在支撑件中。 保持器可以被配置为保持单个设备，或者多个设备在由分区定义的槽中对齐。 可以提供多装置托盘用于将装置向分度装置移动到排出槽，通过这些装置通过手动驱动排放致动器来安装装置。 该技术在安装之前和安装期间为设备提供保护，并且便于手动安装这些设备，而不需要在安装之前或安装期间直接与设备接触。

    Method and apparatus for installing a circuit device
    35.
    发明申请
    Method and apparatus for installing a circuit device 失效
    用于安装电路装置的方法和装置

    公开(公告)号：US20060048382A1

    公开(公告)日：2006-03-09

    申请号：US11218995

    申请日：2005-09-01

    Applicant: Larry Kinsman ,  Mike Brooks ,  Warren Farnworth ,  Walter Moden ,  Terry Lee

    Inventor： Larry Kinsman ,  Mike Brooks ,  Warren Farnworth ,  Walter Moden ,  Terry Lee

    IPC: H01R43/20

    CPC classification number: H05K7/1415 ,  B25B27/00 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49169 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53209 ,  Y10T29/53257 ,  Y10T29/53261 ,  Y10T29/53265

    Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

    Abstract translation: 提供了一种技术，用于将诸如存储设备的电路组件安装在诸如插座的支撑件中。 要安装的设备支撑在支架或外壳中。 保持器定位在接收插座中的支撑区域上方。 将手动执行器压入保持器中以将装置从保持器中排出并将装置安装在支撑件中。 保持器可以被配置为保持单个设备，或者多个设备在由分区定义的槽中对齐。 可以提供多装置托盘用于将装置向分度装置移动到排出槽，通过这些装置通过手动驱动排放致动器来安装装置。 该技术在安装之前和安装期间为设备提供保护，并且便于手动安装这些设备，而不需要在安装之前或安装期间直接与设备接触。

    Apparatus and method for mounting microelectronic devices on a mirrored board assembly
    37.
    发明申请
    Apparatus and method for mounting microelectronic devices on a mirrored board assembly 有权
    将微电子器件安装在镜像板组件上的装置和方法

    公开(公告)号：US20050007806A1

    公开(公告)日：2005-01-13

    申请号：US10910979

    申请日：2004-08-03

    Applicant: Chris Martin ,  Brent Keeth ,  Brian Johnson ,  Walter Moden

    Inventor： Chris Martin ,  Brent Keeth ,  Brian Johnson ,  Walter Moden

    IPC: G11C5/00 ,  H05K1/18 ,  G11C7/00

    CPC classification number: H05K1/181 ,  G11C5/04 ,  G11C5/06 ,  H05K1/112 ,  H05K2201/09409 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10689 ,  Y02P70/611

    Abstract: The present invention is directed to a system, a module, and an apparatus and method for forming a microelectronic memory device. In one embodiment, a system includes a processor and a controller coupled to the processor with at least one memory module coupled to the controller, the module including a pair of memory devices oppositely positioned on respective surfaces of a substrate and interconnected by members extending through the substrate that couple terminals of the devices, the terminals being selected to include a group of terminals that are configured to communicate functionally compatible signals.

    Abstract translation: 本发明涉及一种用于形成微电子存储器件的系统，模块以及装置和方法。 在一个实施例中，系统包括处理器和耦合到处理器的控制器，其中至少一个存储器模块耦合到控制器，该模块包括一对存储器件，其相对地定位在衬底的相应表面上并且通过延伸穿过 耦合器件的端子的基板，所述端子被选择为包括被配置为传送功能兼容的信号的一组端子。

    Reduced-sized memory card package, length-extending, adaptor and method of forming adaptor
    38.
    发明申请
    Reduced-sized memory card package, length-extending, adaptor and method of forming adaptor 失效
    减小尺寸的存储卡封装，长度延长，适配器和形成适配器的方法

    公开(公告)号：US20050007745A1

    公开(公告)日：2005-01-13

    申请号：US10911847

    申请日：2004-08-03

    Applicant: Derek Gochnour ,  Walter Moden ,  Michael Morrison

    Inventor： Derek Gochnour ,  Walter Moden ,  Michael Morrison

    IPC: H01R31/06 ,  H05K1/00

    CPC classification number: G06K19/07739 ,  H01R12/721 ,  H01R31/06

    Abstract: An apparatus and method of removably interconnecting a reduced-sized memory card with an extension member. A locking mechanism may be formed in a peripheral end portion of the reduced-sized memory card that may include an entry surface and a ledge. The extension member may include a biasing portion that slidably engages the entry surface and removable interconnects with the ledge. With this arrangement, the extension member may easily be secured and removed from the reduced-sized memory card, allowing easy interchangeability between a standard-sized socket of one electronic device and a reduced-sized socket of another electronic device.

    Abstract translation: 一种可拆卸地将小型存储卡与扩展构件互连的装置和方法。 可以在缩小尺寸的存储卡的外围端部中形成锁定机构，该外围端部可以包括入口表面和突出部。 延伸构件可以包括可滑动地接合进入表面的偏置部分和与凸缘的可移除的互连。 通过这种布置，扩展构件可以容易地从减小尺寸的存储卡中被固定和移除，从而允许一个电子设备的标准尺寸的插座与另一个电子设备的小型插座之间的容易的互换性。

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