公开(公告)号：US20190040529A1

公开(公告)日：2019-02-07

申请号：US16042791

申请日：2018-07-23

Applicant: ASM IP Holding B.V.

Inventor： Melvin Verbaas ,  Jereld Lee Winkler ,  John Kevin Shugrue ,  Carl Louis White

IPC: C23C16/455

Abstract: A showerhead assembly for distributing a gas within a reaction chamber is disclosed. The showerhead assembly may comprise: a chamber formed within the showerhead assembly and a gas distribution assembly adjacent to the chamber, wherein the gas distribution assembly comprises: a first gas distribution plate comprising a top surface and a bottom surface; and a second gas distribution plate comprising a top surface and a bottom surface, the second gas distribution plate being disposed over the top surface of the first gas distribution plate. The gas distribution assembly may further comprise: one or more heating structures disposed between the first gas distribution plate and the second gas distribution plate; and a plurality of apertures extending from the bottom surface of the first distribution plate to the top surface of the second gas distribution plate. Methods for controlling the temperature uniformity of a showerhead assembly utilized for distribution gas with a reaction chamber are also disclosed.

公开(公告)号：US20170256401A1

公开(公告)日：2017-09-07

申请号：US15596117

申请日：2017-05-16

Applicant: ASM IP HOLDING B.V.

Inventor： Carl Louis White ,  John Kevin Shugrue

IPC: H01L21/02 ,  C25D11/04 ,  C23C16/455 ,  C25D11/16

CPC classification number: C23C16/4404 ,  C25D11/04 ,  C25D11/16

Abstract: An apparatus and methods are provided related to a surface of a reaction chamber assembly component. The surface may be roughened and/or anodized to provide desirable emissivity and porosity to help reduce burn-in time of a reaction chamber and to help reduce particles within the chamber. The apparatus and methods may be suitable for thin film deposition on semiconductor or other substrates.

公开(公告)号：US12163225B2

公开(公告)日：2024-12-10

申请号：US16944241

申请日：2020-07-31

Applicant: ASM IP Holding B.V.

Inventor： Carl Louis White ,  Kyle Fondurulia ,  Timothy James Sullivan

IPC: C23C16/455 ,  C23C16/448 ,  C23C16/52 ,  C30B25/16 ,  H01L21/67

Abstract: A temperature control system for a chemical delivery system (e.g., comprised in a reactor system) may comprise a temperature control shell coupled to and/or enclosing at least a portion of at least one component of the chemical delivery system. A chemical delivery system may comprise a filter, an accumulator, and/or a chemical application line fluidly coupled to one another in any suitable arrangement and/or configuration. A temperature control system for such a chemical delivery system may comprise a filter temperature control shell coupled to and/or enclosing at least a portion of the filter, an accumulator temperature control shell coupled to and/or enclosing at least a portion of the accumulator, and/or an application line temperature control shell coupled to and/or enclosing at least a portion of the chemical application line.

公开(公告)号：US20230313370A1

公开(公告)日：2023-10-05

申请号：US18332627

申请日：2023-06-09

Applicant: ASM IP HOLDING B.V.

Inventor： Eric James Shero ,  Carl Louis White ,  Mohith E. Verghese ,  Kyle Fondurulia ,  Timothy James Sullivan

IPC: C23C16/448 ,  H01L21/67

CPC classification number: C23C16/4485 ,  H01L21/67098 ,  H01L21/67103 ,  H01L21/67115

Abstract: Herein disclosed are systems and methods related to solid source chemical sublimator vessels and corresponding deposition modules. The solid source chemical sublimator can include a housing configured to hold solid chemical reactant therein. A lid may be disposed on a proximal portion of the housing. The lid can include a fluid inlet and a fluid outlet and define a serpentine flow path within a distal portion of the lid. The lid can be adapted to allow gas flow within the flow path. The solid source chemical sublimator can include a filter that is disposed between the serpentine flow path and the distal portion of the housing. The filter can have a porosity configured to restrict a passage of a solid chemical reactant therethrough.

公开(公告)号：US11773486B2

公开(公告)日：2023-10-03

申请号：US18163144

申请日：2023-02-01

Applicant: ASM IP HOLDING B.V.

Inventor： Eric James Shero ,  Carl Louis White ,  Mohith E. Verghese ,  Kyle Fondurulia ,  Timothy James Sullivan

IPC: H01L21/67 ,  C23C16/448

CPC classification number: C23C16/4485 ,  H01L21/67098 ,  H01L21/67103 ,  H01L21/67115

Abstract: Herein disclosed are systems and methods related to solid source chemical sublimator vessels and corresponding deposition modules. The solid source chemical sublimator can include a housing configured to hold solid chemical reactant therein. A lid may be disposed on a proximal portion of the housing. The lid can include a fluid inlet and a fluid outlet and define a serpentine flow path within a distal portion of the lid. The lid can be adapted to allow gas flow within the flow path. The solid source chemical sublimator can include a filter that is disposed between the serpentine flow path and the distal portion of the housing. The filter can have a porosity configured to restrict a passage of a solid chemical reactant therethrough.

公开(公告)号：US20230235454A1

公开(公告)日：2023-07-27

申请号：US18296039

申请日：2023-04-05

Applicant: ASM IP HOLDING B.V.

Inventor： Carl Louis White ,  Eric James Shero ,  Kyle Fondurulia

IPC: C23C16/448 ,  C23C16/455

CPC classification number: C23C16/448 ,  C23C16/45561 ,  C23C16/45544 ,  C23C16/481

Abstract: Systems and methods related to temperature zone control systems can include a reactant source cabinet that is configured to be at least partially evacuated, a vessel base that is configured to hold solid source chemical reactant therein, and a lid that is coupled to a distal portion of the vessel base. The lid may include one or more lid valves. The system may further include a plurality of gas panel valves that are configured to deliver gas from a gas source to the vessel. The system may include a heating element that is configured to heat the one or more lid valves. The system may include a heat shield, a first portion of which is disposed between the one or more lid valves and the vessel base. A second portion of the heat shield may be disposed between the first heating element and the plurality of gas panel valves.

公开(公告)号：US20230183861A1

公开(公告)日：2023-06-15

申请号：US18163144

申请日：2023-02-01

Applicant: ASM IP HOLDING B.V.

Inventor： Eric James Shero ,  Carl Louis White ,  Mohith E. Verghese ,  Kyle Fondurulia ,  Timothy James Sullivan

IPC: C23C16/448 ,  H01L21/67

CPC classification number: C23C16/4485 ,  H01L21/67098 ,  H01L21/67103 ,  H01L21/67115

Abstract: Herein disclosed are systems and methods related to solid source chemical sublimator vessels and corresponding deposition modules. The solid source chemical sublimator can include a housing configured to hold solid chemical reactant therein. A lid may be disposed on a proximal portion of the housing. The lid can include a fluid inlet and a fluid outlet and define a serpentine flow path within a distal portion of the lid. The lid can be adapted to allow gas flow within the flow path. The solid source chemical sublimator can include a filter that is disposed between the serpentine flow path and the distal portion of the housing. The filter can have a porosity configured to restrict a passage of a solid chemical reactant therethrough.

公开(公告)号：US11492701B2

公开(公告)日：2022-11-08

申请号：US16813527

申请日：2020-03-09

Applicant: ASM IP HOLDING B.V.

Inventor： Dinkar Nandwana ,  Jereld Lee Winkler ,  Eric James Shero ,  Todd Robert Dunn ,  Carl Louis White

IPC: C23C16/44 ,  H01L21/67 ,  C23C16/455 ,  C23C16/54

Abstract: Herein disclosed are systems and methods related to semiconductor processing device including a manifold including a bore configured to deliver a gas to a reaction chamber, the manifold including a first block mounted to a second block, the first and second mounted blocks cooperating to at least partially define the bore. A supply channel provides fluid communication between a gas source and the bore, and the supply channel is disposed at least partially in the second block. A metallic seal is disposed about the bore at an interface between the first and second block. Advantageously, the metallic seal improves sealing between the interface between the first block and the second block.

公开(公告)号：US20210143048A1

公开(公告)日：2021-05-13

申请号：US17126812

申请日：2020-12-18

Applicant: ASM IP HOLDING B.V.

Inventor： Carl Louis White ,  Kyle Fondurulia ,  John Kevin Shugrue

IPC: H01L21/687 ,  C23C16/455 ,  C23C16/44 ,  C23C16/458 ,  H01L21/67

Abstract: The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element.

公开(公告)号：US20210118668A1

公开(公告)日：2021-04-22

申请号：US17074887

申请日：2020-10-20

Applicant: ASM IP HOLDING B.V.

Inventor： Dinkar Nandwana ,  Eric James Shero ,  Carl Louis White ,  Todd Robert Dunn ,  William George Petro ,  Jereld Lee Winkler ,  Aniket Chitale

IPC: H01L21/02 ,  C23C16/455

Abstract: The present disclosure pertains to embodiments of a semiconductor deposition reactor manifold and methods of using the semiconductor deposition reactor manifold which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The semiconductor deposition reactor manifold has a bore, a first supply channel, and a second supply channel. Advantageously, the first supply channel and the second supply channel merge with the bore in an offset fashion which leads to reduced cross-contamination within the supply channels.