公开(公告)号：US20250003073A1

公开(公告)日：2025-01-02

申请号：US18754312

申请日：2024-06-26

Applicant: ASM IP Holding B.V.

Inventor： Anirudhan Chandrasekaran ,  Jereld Lee Winkler

IPC: C23C16/455

Abstract: Various embodiments of the present technology may provide a valve assembly that activates chemistry using UV light. The valve assembly includes a primary valve manifold connected to secondary valve manifolds. A transparent connector may be disposed between the primary valve manifold and the secondary valve manifold. A UV light may be disposed adjacent to the transparent connector.

公开(公告)号：US20240401194A1

公开(公告)日：2024-12-05

申请号：US18676023

申请日：2024-05-28

Applicant: ASM IP Holding B.V.

Inventor： Shuaidi Zhang ,  Mustafa Muhammad ,  Moataz Bellah Mousa ,  Paul Ma ,  Jonathan Bakke ,  Todd Robert Dunn ,  Eric James Shero ,  Jereld Lee Winkler ,  YoungChol Byun ,  Shubham Garg ,  Jacqueline Wrench

IPC: C23C16/448 ,  C23C16/455 ,  C23C16/52 ,  H01L21/67

Abstract: The current disclosure relates to example method, system and apparatus for coupling a delivery vessel disposed at a first location on a substrate processing platform to a remote refill vessel disposed in a second location remote from the substrate processing platform via a first chemical delivery line, storing a chemical in the remote refill vessel in a first phase, changing the chemical in the remote refill vessel to a second phase, transporting the chemical in the second phase, to the delivery vessel via the first chemical delivery line, heating the first chemical delivery line to a first temperature equal to or above a phase change temperature of the chemical, and coupling the delivery vessel to an accumulator via a second chemical delivery line.

公开(公告)号：US20240254629A1

公开(公告)日：2024-08-01

申请号：US18631858

申请日：2024-04-10

Applicant: ASM IP Holding B.V.

Inventor： Ankit Kimtee ,  Rohan Vijay Rane ,  Herbert Terhorst ,  Eric James Shero ,  Jereld Lee Winkler ,  Michael Schmotzer ,  Shuyang Zhang ,  Todd Robert Dunn ,  Shubham Garg

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4586 ,  C23C16/46

Abstract: A susceptor assembly includes a heater pedestal and a cap coupled to the heater pedestal. The cap can include one or mor through holes to facilitate purging and/or reduce dead volumes associated with the susceptor assemblies. Reactor systems including such assemblies are also disclosed.

公开(公告)号：US20230207377A1

公开(公告)日：2023-06-29

申请号：US18087871

申请日：2022-12-23

Applicant: ASM IP Holding B.V.

Inventor： Rohan Vijay Rane ,  Herbert Terhorst ,  Eric James Shero ,  Ankit Kimtee ,  Jereld Lee Winkler ,  Michael Schmotzer ,  Shuyang Zhang ,  Todd Robert Dunn ,  Shubham Garg

IPC: H01L21/687 ,  C23C16/44

CPC classification number: H01L21/68735 ,  C23C16/4408 ,  H01L21/68785

Abstract: A semiconductor processing device comprises a susceptor assembly comprising a wafer support configured to support a wafer. The wafer support comprises a wafer support body configured to support the wafer, a purge channel extending laterally from an inner portion of the wafer support body to an outer portion of the wafer support body, a first plenum channel disposed at the outer portion of the wafer support and in fluid communication with the purge channel, and an outlet to deliver purge gas to an edge of the wafer, the outlet in fluid communication with the first plenum channel, a purge gas supply hole on a surface opposite to the wafer support body. The purge gas supply hole is in fluid communication with the purge channel, and a plurality of first purge holes fluidly communicated with the first plenum channel and the purge channel.

公开(公告)号：US20230175129A1

公开(公告)日：2023-06-08

申请号：US18072764

申请日：2022-12-01

Applicant: ASM IP Holding B.V.

Inventor： Jereld Lee Winkler ,  Petri Raisanen ,  Po-Yi Su

IPC: C23C16/455 ,  C23C16/44 ,  C23C16/34 ,  C23C16/08

CPC classification number: C23C16/45534 ,  C23C16/4408 ,  C23C16/34 ,  C23C16/08

Abstract: Methods for depositing a thin film with improved film qualities on a hydrogen-terminated surface of a substrate are disclosed. The methods may comprise an atomic layer deposition (ALD) process comprising a plurality of deposition cycles comprising contacting the substrate with a first vapor phase metal halide or metalorganic reactant, contacting the substrate with the second vapor phase reactant, and contacting the substrate with a growth inhibitor. A growth inhibitor may be a non-consumable agent that is not incorporated into the deposited film during the deposition process and helps improve the properties of the deposited film. The growth inhibitor may comprise a vapor phase halide, such as HCl, or an organic molecule.

公开(公告)号：US20230042784A1

公开(公告)日：2023-02-09

申请号：US17880090

申请日：2022-08-03

Applicant: ASM IP Holding B.V.

Inventor： Jereld Lee Winkler ,  Eric James Shero

IPC: C23C16/52 ,  C23C16/455 ,  H01L21/67

Abstract: A semiconductor processing system for delivering large capacity vaporized precursor from solid or liquid precursor source is disclosed. The system utilizes a carrier gas to feed the vaporized precursor to a remotely located process zone where multiple process modules are disposed. The system comprises a first and second buffer volumes configured to reduce pressure drop and increase delivery rates. A method for delivering a large capacity vaporized precursor to the remotely located process zone are also disclosed.

公开(公告)号：US20220349051A1

公开(公告)日：2022-11-03

申请号：US17729645

申请日：2022-04-26

Applicant: ASM IP Holding B.V.

Inventor： Amit Mishra ,  Jereld Lee Winkler ,  Moataz Bellah Mousa ,  Mustafa Muhammad ,  Paul Ma ,  Hichem M'Saad ,  Ying-Shen Kuo ,  Chad Lunceford ,  Shuaidi Zhang

IPC: C23C16/44 ,  B08B7/00 ,  B08B9/08 ,  B08B5/00 ,  H01J37/32

Abstract: A reaction system including a chemical storage assembly in fluid communication with both a remote plasma unit and a bypass line for providing both a plasma activated cleaning species and a non-plasma activated cleaning species to a reaction chamber.

公开(公告)号：US20210214846A1

公开(公告)日：2021-07-15

申请号：US17149023

申请日：2021-01-14

Applicant: ASM IP HOLDING B.V.

Inventor： Dinkar Nandwana ,  Carl Louis White ,  Eric James Shero ,  William George Petro ,  Herbert Terhorst ,  Gnyanesh Trivedi ,  Mark Olstad ,  Ankit Kimtee ,  Kyle Fondurulia ,  Michael Schmotzer ,  Jereld Lee Winkler

IPC: C23C16/455 ,  C23C16/458

Abstract: The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.

公开(公告)号：US09589770B2

公开(公告)日：2017-03-07

申请号：US13791246

申请日：2013-03-08

Applicant: ASM IP Holding B.V.

Inventor： Jereld Lee Winkler

IPC: C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  H01J37/32 ,  C23C16/452 ,  C23C16/455 ,  C23C16/52

CPC classification number: H01J37/32422 ,  B08B7/0035 ,  C23C16/452 ,  C23C16/45557 ,  C23C16/50 ,  C23C16/52 ,  H01J37/32357 ,  H01J37/32449 ,  H01J37/32862 ,  H01J2237/3321 ,  H01J2237/334 ,  H01J2237/335

Abstract: A system and method for providing intermediate reactive species from a remote plasma unit to a reaction chamber are disclosed. The system includes a pressure control device to control a pressure at the remote plasma unit as intermediate reactive species from the remote plasma unit are provided to the reaction chamber.

Abstract translation: 公开了一种从远程等离子体单元向反应室提供中等反应物种的系统和方法。 该系统包括用于控制远程等离子体单元处的压力的压力控制装置，因为来自远程等离子体单元的中间反应物质被提供给反应室。

公开(公告)号：US20160024656A1

公开(公告)日：2016-01-28

申请号：US14444744

申请日：2014-07-28

Applicant: ASM IP Holding B.V.

Inventor： Carl White ,  Eric Shero ,  Jereld Lee Winkler ,  David Marquardt

IPC: C23C16/455 ,  C23C16/44

CPC classification number: C23C16/45565 ,  C23C16/4401

Abstract: Showerhead assemblies, gas distribution plates, and systems including the same are disclosed. Exemplary showerhead assemblies include a gas distribution plate. Exemplary gas distribution plates include apertures designed to direct a flow of gas and to reduce stagnation of gas on surfaces of the plates.

Abstract translation: 公开了喷头组件，气体分布板和包括其的系统。 示例性的喷头组件包括气体分配板。 示例性的气体分布板包括设计成引导气流并且减少气体在板的表面上的停滞的孔。