公开(公告)号：US20240157504A1

公开(公告)日：2024-05-16

申请号：US18417304

申请日：2024-01-19

Applicant: Applied Materials, Inc.

Inventor： Surajit Kumar ,  Hari Soundararajan ,  Hui Chen ,  Shou-Sung Chang

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/26

CPC classification number: B24B37/015 ,  B24B37/107 ,  B24B37/26 ,  B24B41/047

Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.

公开(公告)号：US20240026530A1

公开(公告)日：2024-01-25

申请号：US17813829

申请日：2022-07-20

Applicant: Applied Materials, Inc.

Inventor： Kirk Allen FISHER ,  John Ford ,  James M. Amos ,  Hui Chen ,  Shawn Joseph Bonham ,  Xinning Luan ,  Philip Michael Amos ,  Aimee S. Erhardt ,  Cathryne A. Ryan ,  Michael R. Riordan

IPC: C23C16/32 ,  C23C16/02 ,  C23C16/458

CPC classification number: C23C16/325 ,  C23C16/0209 ,  C23C16/4581

Abstract: Embodiments disclosed herein include to a component support for use in coating chamber components via chemical vapor deposition (CVD). The component support includes contact rods configured to contact chamber components at fixture points located on the backside of the chamber components. The component supports are configured to support the chamber components in the processing volume with minimal contact of the chamber components. The fixture points on the backside reduce exposure of the fixture points to reactant gases when the chamber components are installed.

公开(公告)号：US20230390895A1

公开(公告)日：2023-12-07

申请号：US17967762

申请日：2022-10-17

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Jeonghoon Oh ,  Chad Pollard ,  Chih Chung Chou ,  Ningzhuo Cui ,  Hui Chen

IPC: B24B53/017 ,  B24B53/12 ,  B24B53/00 ,  B24B53/007 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B53/12 ,  B24B53/005 ,  B24B53/007 ,  B24B37/042

Abstract: A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

公开(公告)号：US20230249225A1

公开(公告)日：2023-08-10

申请号：US18301883

申请日：2023-04-17

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/00 ,  B08B3/10 ,  H01L21/02 ,  B08B1/00 ,  B24B53/017 ,  B24B37/20

CPC classification number: B08B3/00 ,  B08B3/106 ,  H01L21/02057 ,  B08B1/001 ,  B24B53/017 ,  B24B37/20 ,  B08B2203/007 ,  H01L21/30625

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, a boiler, a component that is movable between a first position spaced from the polishing pad and a second position in contact with the polishing pad, a plurality of nozzles to direct steam from the boiler onto the component of the polishing system when located at the first position, an actuator to move the component from the first position to the second position in contact with the polishing pad, and a controller configured to cause the treatment station to direct the steam onto the component to clean the component, and cause the actuator to move the cleaned component from the treatment station into contact with the polishing pad.

公开(公告)号：US11446711B2

公开(公告)日：2022-09-20

申请号：US16886571

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  H01L21/67 ,  B24B37/34

Abstract: An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US20200376523A1

公开(公告)日：2020-12-03

申请号：US16886571

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  H01L21/67 ,  B24B37/34

Abstract: An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US10229842B2

公开(公告)日：2019-03-12

申请号：US13951913

申请日：2013-07-26

Applicant: Applied Materials, Inc.

Inventor： Clinton Sakata ,  Hui Chen ,  Jim K. Atkinson ,  Tomohiko Kitajima ,  Brian J. Brown

IPC: H01L21/67

Abstract: A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.

公开(公告)号：US20240042570A1

公开(公告)日：2024-02-08

申请号：US18358563

申请日：2023-07-25

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Yasuhiro Hori ,  Sameer Deshpande ,  Chad Pollard ,  Sih-Ling Yeh ,  Priscilla Diep ,  Ningzhuo Cui ,  Brian J. Brown ,  Hui Chen

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm with an a plurality of openings positioned over the platen and separated from a polishing pad for delivering the heated gas onto the polishing pad. The controller is configured to cause the heated gas to flow from the source of heated gas through the manifold and the plurality of openings to heat the polishing pad during a polishing operation, and to cause the apparatus to perform a purging operation which alternates between flowing purge gas from the purge gas source and flowing purge liquid from the purge liquid source through the manifold and the plurality of openings.

公开(公告)号：US20210046604A1

公开(公告)日：2021-02-18

申请号：US16989734

申请日：2020-08-10

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Chih Chung Chou ,  Jianshe Tang ,  Hui Chen ,  Hari Soundararajan ,  Brian J. Brown

IPC: B24B37/015 ,  H01L21/321 ,  H01L21/67 ,  B24B57/02

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

公开(公告)号：US09508575B2

公开(公告)日：2016-11-29

申请号：US14198150

申请日：2014-03-05

Applicant: Applied Materials, Inc.

Inventor： Hui Chen ,  Sen-Hou Ko

IPC: B08B1/04 ,  B08B11/02 ,  H01L21/67 ,  H01L21/02 ,  B08B1/00

CPC classification number: H01L21/02065 ,  B08B1/002 ,  B08B1/006 ,  B08B1/04 ,  B08B3/10 ,  H01L21/02041 ,  H01L21/02087 ,  H01L21/31053 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67178 ,  H01L21/67219 ,  H01L21/68764

Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.

Abstract translation: 提供了一种用于在化学机械平面化（CMP）之后清洁衬底的方法和设备。 该装置包括壳体，可在第一轴线上旋转并被配置为将基片保持在基本垂直取向的衬底保持器，第一衬垫保持器具有以平行且间隔开的关系面对衬底保持器的衬垫保持表面，第一衬垫 保持器可在平行于第一轴线旋转的第二轴线上旋转，第一致动器可操作以相对于衬底保持器移动衬垫保持器以改变限定在第一轴线和第二轴线之间的距离，以及设置在壳体中的第二衬垫保持架 ，所述第二焊盘保持器具有以平行和间隔的关系面对所述衬底保持器的焊盘保持表面，其中所述第二焊盘保持器与旋转臂耦合。