公开(公告)号：US10132003B2

公开(公告)日：2018-11-20

申请号：US15656457

申请日：2017-07-21

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan Lau ,  Surajit Kumar ,  Joseph M. Ranish ,  Zhiyuan Ye ,  Kartik Shah ,  Mehmet Tugrul Samir ,  Errol Antonio C. Sanchez

IPC: C30B25/16 ,  C30B33/02 ,  C23C16/44 ,  C30B25/10 ,  C23C16/46

Abstract: Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.

公开(公告)号：US10119192B2

公开(公告)日：2018-11-06

申请号：US15136119

申请日：2016-04-22

Applicant: Applied Materials, Inc.

Inventor： Steve Aboagye ,  Paul Brillhart ,  Surajit Kumar ,  Anzhong Chang ,  Satheesh Kuppurao ,  Mehmet Tugrul Samir ,  David K. Carlson

IPC: C23C16/455 ,  C23C16/44 ,  C23C16/458 ,  C23C16/48

Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.

公开(公告)号：US09322097B2

公开(公告)日：2016-04-26

申请号：US13846355

申请日：2013-03-18

Applicant: Applied Materials, Inc.

Inventor： Steve Aboagye ,  Paul Brillhart ,  Surajit Kumar ,  Anzhong Chang ,  Satheesh Kuppurao ,  Mehmet Tugrul Samir ,  David K. Carlson

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/48

CPC classification number: C23C16/45502 ,  C23C16/4411 ,  C23C16/45504 ,  C23C16/45563 ,  C23C16/458 ,  C23C16/4584 ,  C23C16/481

Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.

Abstract translation: 本文所述的实施例涉及用于衬底处理室中的基座环组件。 在一个实施例中，基环组件包括尺寸适于容纳在基板处理室的内圆周内的环体，环体包括用于通过基板的装载口，气体入口和气体出口，其中， 气体入口和气体出口设置在环体的相对端，并且配置成设置在环体的顶表面上的上环和被配置为设置在环体的底表面上的下环，其中， 一旦组装，上环，下环和环体大致同心或同轴。

公开(公告)号：US20240157504A1

公开(公告)日：2024-05-16

申请号：US18417304

申请日：2024-01-19

Applicant: Applied Materials, Inc.

Inventor： Surajit Kumar ,  Hari Soundararajan ,  Hui Chen ,  Shou-Sung Chang

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/26

CPC classification number: B24B37/015 ,  B24B37/107 ,  B24B37/26 ,  B24B41/047

Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.

公开(公告)号：US20210080431A1

公开(公告)日：2021-03-18

申请号：US16597615

申请日：2019-10-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Chuang-Chia Lin ,  Surajit Kumar ,  Upendra Ummethala

IPC: G01N29/12 ,  H03H9/02 ,  H01L21/67 ,  H01L21/66

Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using such substrates. In an embodiment, a diagnostic substrate comprises a substrate, and a device layer over the substrate. In an embodiment, the diagnostic substrate further comprises a resonator in the device layer. In an embodiment, the resonator comprises a cavity, a cover layer over the cavity, and electrodes within the cavity for driving and sensing resonance of the cover layer. In an embodiment, the diagnostic substrate further comprises a reflector surrounding a perimeter of the resonator.

公开(公告)号：US09768043B2

公开(公告)日：2017-09-19

申请号：US14132215

申请日：2013-12-18

Applicant: Applied Materials, Inc.

Inventor： Anzhong Chang ,  Paul Brillhart ,  Surajit Kumar ,  Satheesh Kuppurao ,  Mehmet Tugrul Samir ,  David K. Carlson ,  Steve Aboagye ,  Anh N. Nguyen ,  Kailash Kiran Patalay ,  Joseph M. Ranish ,  Oleg Serebryanov ,  Dongming Iu ,  Shu-Kwan Lau ,  Zuoming Zhu ,  Herman Diniz

IPC: A21B2/00 ,  H01L21/67 ,  C23C16/455

CPC classification number: H01L21/67115 ,  C23C16/45504

Abstract: Embodiments of the present disclosure relate to a dome assembly. The dome assembly includes an upper dome including a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.

公开(公告)号：US11769684B2

公开(公告)日：2023-09-26

申请号：US18080421

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67 ,  C23C16/458 ,  C23C16/455

CPC classification number: H01L21/6833 ,  C23C16/4585 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/67248 ,  C23C16/45544

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

公开(公告)号：US20230182259A1

公开(公告)日：2023-06-15

申请号：US18107220

申请日：2023-02-08

Applicant: Applied Materials, Inc.

Inventor： Surajit Kumar ,  Hui Chen ,  Chih Chung Chou ,  Shou-Sung Chang

IPC: B24B37/015 ,  B24B37/34

CPC classification number: B24B37/015 ,  B24B37/34

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

公开(公告)号：US20230113057A1

公开(公告)日：2023-04-13

申请号：US18080421

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01L21/683 ,  H01L21/67 ,  C23C16/458

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

公开(公告)号：US20210111059A1

公开(公告)日：2021-04-15

申请号：US17066974

申请日：2020-10-09

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01L21/683 ,  C23C16/458 ,  H01L21/67 ,  C23C16/455

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.