公开(公告)号：US20230008720A1

公开(公告)日：2023-01-12

申请号：US17808688

申请日：2022-06-24

Applicant: EBARA CORPORATION

Inventor： Masayoshi ITO ,  Itsuki KOBATA

IPC: B24B37/013 ,  B24B37/04

Abstract: A polishing apparatus capable of monitoring a distribution of an amount of liquid, such as a polishing liquid or a chemical liquid, on a polishing surface of a polishing pad, and capable of polishing an object, such as a wafer, under appropriate polishing conditions. The polishing apparatus includes: a polishing table configured to support a polishing pad; a polishing head configured to press the object against a polishing surface of the polishing pad; a liquid supply device configured to supply liquid onto the polishing surface; a liquid monitoring device configured to obtain optical information contained in light from a plurality of points on the polishing surface; an optical information analyzer configured to determine a distribution of amount of the liquid on the polishing surface from the optical information; and an operation controller configured to control operations of the polishing apparatus.

公开(公告)号：US20200171618A1

公开(公告)日：2020-06-04

申请号：US16787892

申请日：2020-02-11

Applicant: Ebara Corporation

Inventor： Itsuki KOBATA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yuji YAGI ,  Nobuyuki TAKAHASHI ,  Koichi TAKEDA

IPC: B24B37/013 ,  B24B37/20 ,  B24B37/04

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20190118338A1

公开(公告)日：2019-04-25

申请号：US16228525

申请日：2018-12-20

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  H01L21/67 ,  B08B3/02 ,  B08B1/04

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US20160099156A1

公开(公告)日：2016-04-07

申请号：US14872342

申请日：2015-10-01

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: H01L21/306 ,  H01L21/02

CPC classification number: H01L21/67248 ,  B24B37/105 ,  B24B37/345 ,  B24B49/14 ,  B24B53/017 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67219

Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

Abstract translation: 提供了一种抛光装置。 抛光装置包括：抛光单元，被配置为通过使抛光工具与基板接触并相对于抛光工具移动基板来抛光基板; 清洁单元; 以及第一传送机器人，其被配置为在抛光之前将所述基板转移到所述抛光单元和/或构造成在从所述抛光单元抛光到所述清洁单元之后将所述基板转移。 所述清洁单元包括：至少一个清洁模块，抛光处理模块，被配置为对所述基板执行抛光处理;以及第二传送机器人，其被配置为在所述清洁模块和所述抛光处理模块之间传送所述基板，所述第二传送机器人 不同于第一台机器人。

公开(公告)号：US20160059376A1

公开(公告)日：2016-03-03

申请号：US14834195

申请日：2015-08-24

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA

IPC: B24B37/04 ,  B24B41/00 ,  B24B37/20

CPC classification number: B24B37/04 ,  B24B37/10 ,  B24B37/20 ,  B24B41/002

Abstract: A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other.

Abstract translation: 提供了用于抛光衬底的抛光模块。 抛光模块包括用于支撑基板的抛光台，可旋转的抛光台; 以及一个抛光头，一个抛光垫被安装在该抛光头上，可以在接近抛光台的方向上旋转和移动，并且一个从抛光台移开的方向。 该抛光垫包括第一部分和第二部分，其布置成围绕第一部分的外侧上的第一部分，第一部分和第二部分具有彼此不同的特性。

公开(公告)号：US20150332943A1

公开(公告)日：2015-11-19

申请号：US14808252

申请日：2015-07-24

Applicant: EBARA CORPORATION

Inventor： Itsuki KOBATA ,  Yoichi KOBAYASHI ,  Katsutoshi ONO ,  Masaki KINOSHITA ,  Toshifumi KIMBA

IPC: H01L21/67 ,  B24B37/005 ,  B24B49/12 ,  H01L21/687

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/10 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/68721 ,  H01L22/26

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

Abstract translation: 提供了用于研磨衬底的抛光装置。 抛光装置包括：抛光台，其保持抛光垫; 顶环，构造成将衬底压靠在抛光垫上; 第一和第二光学头，每个被配置为将光施加到衬底并且接收来自衬底的反射光; 每个光谱分别被配置成在每个波长处测量接收到的反射光的强度; 以及处理器，被配置为产生指示反射光的强度和波长之间的关系的光谱。 第一光学头被布置为面对基板的中心，并且第二光学头被布置成面对基板的周边部分。