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公开(公告)号：US20230406694A1
公开(公告)日：2023-12-21
申请号：US18334468
申请日：2023-06-14
Applicant: Infineon Technologies AG
Inventor： Christian Bretthauer , Marco Haubold , Hans-Jörg Timme , Dominik Mayrhofer
CPC classification number: B81B3/0021 , B81B3/007 , H04R19/02 , H04R2201/003 , B81B2203/06 , B81B2201/0257 , B81B2201/036 , B81B2203/0127
Abstract: A MEMS device includes a substrate having a cavity and a membrane structure mechanically connected to the substrate and configured for deflecting out-of-plane with regard to a substrate plane and with a frequency in an ultrasonic frequency range to cause a fluid motion of the fluid in the cavity. The MEMS device includes a valve structure sandwiching the cavity together with the membrane structure, wherein the valve structure includes a planar perforated structure and a shutter structure opposing the perforated structure and arranged movably in-plane and with a frequency in the ultrasonic frequency range and with regard to the substrate plane and between a first position and a second position. The shutter structure is arranged to provide a first fluidic resistance for the fluid in the first position and a second, higher fluidic resistance for the fluid in the second position.
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32.发明公开公开(公告)号：US20230188899A1
公开(公告)日：2023-06-15
申请号：US18165014
申请日：2023-02-06
Applicant: Infineon Technologies AG
Inventor： Christian Bretthauer , David Tumpold , Pradyumna Mishra , Daniel Neumaier
IPC: H04R17/02 , B81B7/04 , G01P15/08 , G01P15/09 , G01P15/18 , H04R1/28 , G01H11/08 , H10N30/87 , H10N30/30
CPC classification number: H04R17/02 , B81B7/04 , G01P15/0802 , G01P15/09 , G01P15/18 , H04R1/28 , G01H11/08 , H10N30/87 , H10N30/302 , H10N30/308 , B81B2201/0235 , B81B2201/0257 , B81B2203/0127 , H04R2201/003 , G01P1/023
Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
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公开(公告)号：US11353431B2
公开(公告)日：2022-06-07
申请号：US16706134
申请日：2019-12-06
Applicant: Infineon Technologies AG
Inventor： Christian Bretthauer
Abstract: A photoacoustic sensor comprises an emitter for emitting electromagnetic radiation at a first wavelength and electromagnetic radiation at a second wavelength, wherein the first wavelength is for photoacoustically detecting particulate matter in a measurement cavity and the second wavelength is for photoacoustically detecting the particulate matter and at least one target gas in the measurement cavity. The photoacoustic sensor further comprises an acoustic transducer for transducing a first acoustic signal into a first sensor signal depending on an interaction of the electromagnetic radiation at the first wavelength and the particulate matter, and for transducing a second acoustic signal into a second sensor signal depending on an interaction of the electromagnetic radiation at the second wavelength with the particulate matter and the at least one target gas.
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34.发明申请公开(公告)号：US20210382085A1
公开(公告)日：2021-12-09
申请号：US16896665
申请日：2020-06-09
Applicant: Infineon Technologies AG
Inventor： Christian Bretthauer , Pradyumna Mishra , Daniel Neumaier , David Tumpold
IPC: G01P15/08 , H01L41/113 , H01L41/047 , B81B7/04 , G01P15/09 , H04R17/02
Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
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Patent Agency Ranking
公开(公告)号：US11076217B2
公开(公告)日：2021-07-27
申请号：US16879229
申请日：2020-05-20
Applicant: Infineon Technologies AG
Inventor： Daniel Neumaier , Christian Bretthauer , Dietmar Straeussnigg
Abstract: A portable device includes a microphone structure for converting a received audio signal into an electronic signal representing the received audio signal and for transceiving an ultrasonic wave by transmitting the ultrasonic wave and by receiving a reflection of the ultrasonic wave. The portable device includes a control unit for evaluating the reflection of the ultrasonic wave to obtain an evaluation result and for controlling an operation of the portable device based on the evaluation result.
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公开(公告)号：US20210017016A1
公开(公告)日：2021-01-21
申请号：US16895366
申请日：2020-06-08
Applicant: Infineon Technologies AG
Inventor： Sebastian Anzinger , Christian Bretthauer , Marc Fueldner
IPC: B81B3/00 , B81C1/00 , H01L41/047 , H04R19/04
Abstract: A MEMS sound transducer element is operable in an audio and an ultrasonic range. The MEMS sound transducer element includes a first electrode structure, wherein a conductive material of the first electrode structure includes a plurality of electrically isolated electrode segments, and a second electrode structure spaced apart from the first electrode structure, wherein the first electrode structure and the second electrode structure are operable as an audio sound transducer. A first subset of the plurality of electrically isolated electrode segments of the first electrode structure is, in conjunction with the second electrode structure, operable as an ultrasonic or audio emitter, and a second subset of the plurality of the electrically isolated electrode segments of the first electrode structure is, in conjunction with the second electrode structure, operable as an ultrasonic or audio receiver.
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公开(公告)号：US20210014600A1
公开(公告)日：2021-01-14
申请号：US16879229
申请日：2020-05-20
Applicant: Infineon Technologies AG
Inventor： Daniel Neumaier , Christian Bretthauer , Dietmar Straeussnigg
Abstract: A portable device includes a microphone structure for converting a received audio signal into an electronic signal representing the received audio signal and for transceiving an ultrasonic wave by transmitting the ultrasonic wave and by receiving a reflection of the ultrasonic wave. The portable device includes a control unit for evaluating the reflection of the ultrasonic wave to obtain an evaluation result and for controlling an operation of the portable device based on the evaluation result.
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公开(公告)号：US10249583B1
公开(公告)日：2019-04-02
申请号：US15709102
申请日：2017-09-19
Applicant: Infineon Technologies AG
Inventor： Christian Bretthauer , Bernhard Laumer , Holger Poehle , Momtchil Stavrev
IPC: H01L23/522 , H01L23/00 , H01L23/532 , H01L23/528 , H01L23/31
Abstract: A semiconductor die includes a last metallization layer above a semiconductor substrate, a bond pad above the last metallization layer, a passivation layer covering part of the bond pad and having an opening that defines a contact area of the bond pad, an insulating region separating the bond pad from the last metallization layer at least in an area corresponding to the contact area of the bond pad, and an electrically conductive interconnection structure that extends from the bond pad to the upper metallization layer outside the contact area of the bond pad. Corresponding methods of manufacture are also provided.
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39.发明申请公开(公告)号：US20190063968A1
公开(公告)日：2019-02-28
申请号：US16106247
申请日：2018-08-21
Applicant: Infineon Technologies AG
Inventor： Christian Bretthauer , Alfons Dehe , Prashanth Makaram , Abidin Güçlü Onaran , Arnaud Walther
Abstract: In accordance with an embodiment, a MEMS sensor includes a membrane that is suspended from the substrate, a resonant frequency of said membrane being influenced by an ambient pressure that acts on the membrane; and an evaluation device configured to perform a first measurement based on the resonant frequency of the membrane to obtain a measurement result, where the evaluation device is configured to at least partly compensate an influence of the ambient pressure on the measurement result
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