公开(公告)号：US08988770B2

公开(公告)日：2015-03-24

申请号：US13831541

申请日：2013-03-14

Applicant: Oracle International Corporation

Inventor： Xuezhe Zheng ,  Ashok V. Krishnamoorthy ,  Ivan Shubin ,  John E. Cunningham ,  Guoliang Li ,  Ying L. Luo

IPC: H01S5/10 ,  H01S5/14

CPC classification number: H01S5/1028 ,  H01S5/02252 ,  H01S5/1025 ,  H01S5/141 ,  H01S5/142 ,  H01S5/18 ,  H01S5/4087

Abstract: A hybrid optical source that provides an optical signal having a wavelength is described. This hybrid optical source includes an edge-coupled optical amplifier (such as a III-V semiconductor optical amplifier) aligned to a semiconductor reflector (such as an etched silicon mirror). The semiconductor reflector efficiently couples (i.e., with low optical loss) light out of the optical amplifier in a direction approximately perpendicular to a plane of the optical amplifier. A corresponding optical coupler (such as a diffraction grating or a mirror) fabricated on a silicon-on-insulator chip efficiently couples the light into a sub-micron silicon-on-insulator optical waveguide. The silicon-on-insulator optical waveguide couples the light to additional photonic elements (including a reflector) to complete the hybrid optical source.

Abstract translation: 描述了提供具有波长的光信号的混合光源。 该混合光源包括与半导体反射器（例如蚀刻硅镜）对准的边缘耦合光放大器（例如III-V半导体光放大器）。 半导体反射器在大致垂直于光放大器的平面的方向上有效地耦合（即，具有低光损耗）的光从光放大器中出射。 制造在绝缘体上硅芯片上的对应的光耦合器（例如衍射光栅或反射镜）有效地将光耦合到亚微米上绝缘体上的光波导中。 绝缘体上的光波导将光耦合到附加的光子元件（包括反射器）以完成混合光源。

公开(公告)号：US20140321803A1

公开(公告)日：2014-10-30

申请号：US14047910

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Frankie Y. Liu ,  Robert David Hopkins, II ,  Jon Lexau ,  Xuezhe Zheng ,  Guoliang Li ,  Ivan Shubin ,  Ronald Ho ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC: G02B6/12

CPC classification number: G02B6/4274 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K3/36 ,  H05K2201/10484 ,  H01L2924/00

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括与芯片封装中的每一个相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，集成电路的前表面通过插入件的顶表面电耦合到光集成电路的前表面，其中顶表面面向集成电路的前表面和光集成电路的前表面 。 此外，集成电路和光集成电路可以在插入器的同一侧上。 通过将光集成电路和集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。