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1.
公开(公告)号:US09390016B2
公开(公告)日:2016-07-12
申请号:US13665826
申请日:2012-10-31
Applicant: Oracle International Corporation
Inventor: Pranay Koka , Michael O. McCracken , Herbert D. Schwetman, Jr. , Ronald Ho
CPC classification number: G06F12/0848 , G06F12/0893
Abstract: The disclosed embodiments provide a system in which a processor chip accesses an off-chip cache via silicon photonic waveguides. The system includes a processor chip and a cache chip that are both coupled to a communications substrate. The cache chip comprises one or more cache banks that receive cache requests from a structure in the processor chip optically via a silicon photonic waveguide. More specifically, the silicon photonic waveguide is comprised of waveguides in the processor chip, the communications substrate, and the cache chip, and forms an optical channel that routes an optical signal directly from the structure to a cache bank in the cache chip via the communications substrate. Transmitting optical signals from the processor chip directly to cache banks on the cache chip facilitates reducing the wire latency of cache accesses and allowing each cache bank on the cache chip to be accessed with uniform latency.
Abstract translation: 所公开的实施例提供了一种系统,其中处理器芯片通过硅光子波导访问片外高速缓存。 该系统包括耦合到通信基板的处理器芯片和高速缓存芯片。 高速缓存芯片包括一个或多个高速缓存组,其经由硅光子波导光学地从处理器芯片中的结构接收高速缓存请求。 更具体地,硅光子波导由处理器芯片,通信基板和高速缓存芯片中的波导构成,并且形成光信道,其通过通信将光信号直接从结构路由到高速缓存芯片中的高速缓存组 基质。 将来自处理器芯片的光信号直接发送到高速缓存芯片上的高速缓存存储体,有助于减少高速缓存访问的线延迟,并允许以均匀延迟访问缓存芯片上的每个高速缓存组。
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2.
公开(公告)号:US20140122802A1
公开(公告)日:2014-05-01
申请号:US13665826
申请日:2012-10-31
Applicant: Oracle International Corporation
Inventor: Pranay Koka , Michael O. McCracken , Herbert D. Schwetman, JR. , Ronald Ho
IPC: G06F12/08
CPC classification number: G06F12/0848 , G06F12/0893
Abstract: The disclosed embodiments provide a system in which a processor chip accesses an off-chip cache via silicon photonic waveguides. The system includes a processor chip and a cache chip that are both coupled to a communications substrate. The cache chip comprises one or more cache banks that receive cache requests from a structure in the processor chip optically via a silicon photonic waveguide. More specifically, the silicon photonic waveguide is comprised of waveguides in the processor chip, the communications substrate, and the cache chip, and forms an optical channel that routes an optical signal directly from the structure to a cache bank in the cache chip via the communications substrate. Transmitting optical signals from the processor chip directly to cache banks on the cache chip facilitates reducing the wire latency of cache accesses and allowing each cache bank on the cache chip to be accessed with uniform latency.
Abstract translation: 所公开的实施例提供了一种系统,其中处理器芯片通过硅光子波导访问片外高速缓存。 该系统包括耦合到通信基板的处理器芯片和高速缓存芯片。 高速缓存芯片包括一个或多个高速缓存组,其经由硅光子波导光学地从处理器芯片中的结构接收高速缓存请求。 更具体地,硅光子波导由处理器芯片,通信基板和高速缓存芯片中的波导构成,并且形成光信道,其通过通信将光信号从结构直接路由到高速缓存芯片中的高速缓存组 基质。 将来自处理器芯片的光信号直接发送到高速缓存芯片上的高速缓存存储体,有助于减少高速缓存访问的线延迟,并允许以均匀延迟访问缓存芯片上的每个高速缓存组。
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3.
公开(公告)号:US20140321804A1
公开(公告)日:2014-10-30
申请号:US14047978
申请日:2013-10-07
Applicant: Oracle International Corporation
Inventor: Hiren D. Thacker , Ashok V. Krishnamoorthy , Robert David Hopkins, II , Jon Lexau , Xuezhe Zheng , Ronald Ho , Ivan Shubin , John E. Cunningham
IPC: G02B6/12
CPC classification number: G02B6/4274 , H01L23/49827 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L2224/0401 , H01L2224/13147 , H01L2224/1403 , H01L2224/141 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/32225 , H01L2224/72 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81815 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06589 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/37001 , H05K3/36 , H05K2201/10484 , H01L2924/00
Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.
Abstract translation: 芯片封装包括在芯片封装中彼此靠近的光学集成电路(例如混合集成电路)和集成电路。 集成电路包括诸如存储器或处理器的电路,并且光学集成电路传送具有非常高带宽的光信号。 此外,集成电路的前表面电耦合到插入件的顶表面,并且该顶表面又电耦合到面向顶表面的输入/输出(I / O)集成电路的前表面 。 此外,I / O集成电路的前表面电耦合到光集成电路的顶表面,其中光集成电路的顶表面面向I / O集成电路的前表面。
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公开(公告)号:US20140119738A1
公开(公告)日:2014-05-01
申请号:US13666548
申请日:2012-11-01
Applicant: ORACLE INTERNATIONAL CORPORATION
Inventor: Xuezhe Zheng , Pranay Koka , Herbert D. Schwetman, JR. , Ronald Ho , Ashok V. Krishnamoorthy
IPC: H04B10/02
CPC classification number: H04B10/801
Abstract: In a multi-chip module (MCM), first and second optical waveguides convey optical signals among integrated circuits. The first and second optical waveguides may be implemented in a first layer or plane on a substrate. Moreover, bridge chips in a second plane may be used to couple the optical signals between the first or second optical waveguides and the integrated circuits. By using a single layer for optical routing, the MCM may provide a point-to-point network among the integrated circuits without optical-waveguide crossing.
Abstract translation: 在多芯片模块(MCM)中,第一和第二光波导在集成电路之间传送光信号。 第一和第二光波导可以在衬底上的第一层或平面中实现。 此外,第二平面中的桥芯片可用于耦合第一或第二光波导与集成电路之间的光信号。 通过使用单层光路由,MCM可以在集成电路之间提供无光波导交叉的点对点网络。
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5.
公开(公告)号:US09297971B2
公开(公告)日:2016-03-29
申请号:US14047978
申请日:2013-10-07
Applicant: Oracle International Corporation
Inventor: Hiren D. Thacker , Ashok V. Krishnamoorthy , Robert David Hopkins, II , Jon Lexau , Xuezhe Zheng , Ronald Ho , Ivan Shubin , John E. Cunningham
IPC: G02B6/42 , H01L25/065 , H01L23/00 , H01L23/498 , H05K3/36
CPC classification number: G02B6/4274 , H01L23/49827 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L2224/0401 , H01L2224/13147 , H01L2224/1403 , H01L2224/141 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/32225 , H01L2224/72 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81815 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06589 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/37001 , H05K3/36 , H05K2201/10484 , H01L2924/00
Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.
Abstract translation: 芯片封装包括在芯片封装中彼此靠近的光学集成电路(例如混合集成电路)和集成电路。 集成电路包括诸如存储器或处理器的电路,并且光学集成电路传送具有非常高带宽的光信号。 此外,集成电路的前表面电耦合到插入件的顶表面,并且该顶表面又电耦合到面向顶表面的输入/输出(I / O)集成电路的前表面 。 此外,I / O集成电路的前表面电耦合到光集成电路的顶表面,其中光集成电路的顶表面面向I / O集成电路的前表面。
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公开(公告)号:US09256026B2
公开(公告)日:2016-02-09
申请号:US14540651
申请日:2014-11-13
Applicant: Oracle International Corporation
Inventor: Hiren D. Thacker , Ashok V. Krishnamoorthy , Robert David Hopkins, II , Jon Lexau , Ronald Ho , John E. Cunningham
CPC classification number: G02B6/12 , G02B6/42 , G02B6/4274 , G02B6/428 , H01L24/16 , H01L24/17 , H01L25/0652 , H01L2224/0401 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/1703 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06548 , H01L2225/06565 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H05K1/141 , H05K2201/046 , H05K2201/10121
Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.
Abstract translation: 芯片封装包括在芯片封装中的基板的相同侧上彼此相邻的光学集成电路(例如混合集成电路)和集成电路。 集成电路包括诸如存储器或处理器的电路,并且光学集成电路传送具有非常高带宽的光信号。 此外,输入/输出(I / O)集成电路耦合到基板和光学集成电路之间的光学集成电路。 该I / O集成电路包括高速I / O电路和节能驱动器和接收器电路,并与光学集成电路上的光学器件进行通信。 通过将集成电路,集成电路和I / O集成电路集成在一起,与具有电互连的芯片封装相比,芯片封装可以有助于提高性能。
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公开(公告)号:US20150098677A1
公开(公告)日:2015-04-09
申请号:US14540651
申请日:2014-11-13
Applicant: Oracle International Corporation
Inventor: Hiren D. Thacker , Ashok V. Krishnamoorthy , Robert David Hopkins, II , Jon Lexau , Ronald Ho , John E. Cunningham
CPC classification number: G02B6/12 , G02B6/42 , G02B6/4274 , G02B6/428 , H01L24/16 , H01L24/17 , H01L25/0652 , H01L2224/0401 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/1703 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06548 , H01L2225/06565 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H05K1/141 , H05K2201/046 , H05K2201/10121
Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.
Abstract translation: 芯片封装包括在芯片封装中的基板的相同侧上彼此相邻的光学集成电路(例如混合集成电路)和集成电路。 集成电路包括诸如存储器或处理器的电路,并且光学集成电路传送具有非常高带宽的光信号。 此外,输入/输出(I / O)集成电路耦合到基板和光学集成电路之间的光学集成电路。 该I / O集成电路包括高速I / O电路和节能驱动器和接收器电路,并与光学集成电路上的光学器件进行通信。 通过将集成电路,集成电路和I / O集成电路集成在一起,与具有电互连的芯片封装相比,芯片封装可以有助于提高性能。
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8.
公开(公告)号:US20140321803A1
公开(公告)日:2014-10-30
申请号:US14047910
申请日:2013-10-07
Applicant: Oracle International Corporation
Inventor: Hiren D. Thacker , Frankie Y. Liu , Robert David Hopkins, II , Jon Lexau , Xuezhe Zheng , Guoliang Li , Ivan Shubin , Ronald Ho , John E. Cunningham , Ashok V. Krishnamoorthy
IPC: G02B6/12
CPC classification number: G02B6/4274 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L2224/0401 , H01L2224/13147 , H01L2224/1403 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/72 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81815 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06589 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/37001 , H05K3/36 , H05K2201/10484 , H01L2924/00
Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.
Abstract translation: 芯片封装包括与芯片封装中的每一个相邻的光学集成电路(例如混合集成电路)和集成电路。 集成电路包括诸如存储器或处理器的电路,并且光学集成电路传送具有非常高带宽的光信号。 此外,集成电路的前表面通过插入件的顶表面电耦合到光集成电路的前表面,其中顶表面面向集成电路的前表面和光集成电路的前表面 。 此外,集成电路和光集成电路可以在插入器的同一侧上。 通过将光集成电路和集成电路集成在一起,与具有电互连的芯片封装相比,芯片封装可以有助于提高性能。
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9.
公开(公告)号:US09250403B2
公开(公告)日:2016-02-02
申请号:US14047910
申请日:2013-10-07
Applicant: Oracle International Corporation
Inventor: Hiren D. Thacker , Frankie Y. Liu , Robert David Hopkins, II , Jon Lexau , Xuezhe Zheng , Guoliang Li , Ivan Shubin , Ronald Ho , John E. Cunningham , Ashok V. Krishnamoorthy
IPC: G02B6/12 , G02B6/42 , H01L25/065 , H01L23/00 , H05K3/36
CPC classification number: G02B6/4274 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L2224/0401 , H01L2224/13147 , H01L2224/1403 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/72 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81815 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06589 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/37001 , H05K3/36 , H05K2201/10484 , H01L2924/00
Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.
Abstract translation: 芯片封装包括与芯片封装中的每一个相邻的光学集成电路(例如混合集成电路)和集成电路。 集成电路包括诸如存储器或处理器的电路,并且光学集成电路传送具有非常高带宽的光信号。 此外,集成电路的前表面通过插入件的顶表面电耦合到光集成电路的前表面,其中顶表面面向集成电路的前表面和光集成电路的前表面 。 此外,集成电路和光集成电路可以在插入器的同一侧上。 通过将光集成电路和集成电路集成在一起,与具有电互连的芯片封装相比,芯片封装可以有助于提高性能。
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公开(公告)号:US09983420B2
公开(公告)日:2018-05-29
申请号:US14516301
申请日:2014-10-16
Applicant: Oracle International Corporation
Inventor: Philip Amberg , Eric Y. Chang , Xuezhe Zheng , Frankie Y. Liu , Ronald Ho , Ashok V. Krishnamoorthy
CPC classification number: G02F1/025 , G02F1/0147 , G02F2201/58 , G02F2203/15
Abstract: In the optical device, a ring-resonator modulator, having an adjustable resonance (center) wavelength, optically couples an optical signal that includes the carrier wavelength from an input optical waveguide to an output optical waveguide. A monitoring mechanism in the optical device, which is optically coupled to the output optical waveguide, monitors a performance metric of an output optical signal from the output waveguide. For example, the monitoring mechanism may monitor: an average optical power associated with the output optical signal, and/or an amplitude of the output optical signal. Moreover, control logic in the optical device adjusts the resonance wavelength based on the monitored performance metric so that the performance metric is optimized.
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