公开(公告)号：US20110013340A1

公开(公告)日：2011-01-20

申请号：US12833185

申请日：2010-07-09

Applicant: Michio HORIUCHI ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio HORIUCHI ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01G4/06 ,  H05K3/30

CPC classification number: H05K1/162 ,  H01G4/012 ,  H01G4/232 ,  H01G4/302 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09263 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09945

Abstract: A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.

Abstract translation: 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。

公开(公告)号：US20110012266A1

公开(公告)日：2011-01-20

申请号：US12832177

申请日：2010-07-08

Applicant: Michio HORIUCHI ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio HORIUCHI ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01L23/538 ,  H01L21/50

CPC classification number: H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/4605 ,  H05K2201/0116 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10674 ,  H05K2203/0315 ,  H05K2203/1142 ,  H01L2924/00

Abstract: In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole.

Abstract translation: 在半导体器件中，衬底包括从衬底的顶表面到底表面穿透衬底的多个线导体。 半导体芯片固定在基板的孔中。 在衬底和半导体芯片的顶表面上形成第一绝缘层。 第一布线层形成在第一绝缘层上，并且经由第一绝缘层的通孔与半导体芯片电连接，一些线导体暴露于一个通孔。 在基板和半导体芯片的底面上形成第二绝缘层。 第二布线层形成在第二绝缘层上，并且经由第二绝缘层的通孔与暴露于通孔的一些线导体电连接。

公开(公告)号：US20090310500A1

公开(公告)日：2009-12-17

申请号：US12410138

申请日：2009-03-24

Applicant: Yuichi Matsuda ,  Yuji Nomura

Inventor： Yuichi Matsuda ,  Yuji Nomura

IPC: H04L12/26

CPC classification number: H04L43/0864 ,  H04L43/106

Abstract: In a delay time measuring apparatus a sequence number, data length, and receiving time of a data packet transmitted from a source unit to a destination unit are stored in a storage section. In addition, an ACK number and receiving time of an ACK packet returned from the destination unit to the source unit are stored in the storage section. After that, a calculation section obtains an ACK packet an ACK number of which is equal to a value obtained by adding data length of a second data packet of two successive data packets transmitted without waiting for the ACK packet to a sequence number of the second data packet of the two successive data packets from the storage section. Then the calculation section calculates round trip time from receiving time of the second data packet of the two successive data packets and receiving time of the ACK packet obtained.

Abstract translation: 在延迟时间测量装置中，从源单元发送到目的地单元的数据分组的序列号，数据长度和接收时间被存储在存储部分中。 此外，从目的地单元返回到源单元的ACK分组的ACK号码和接收时间被存储在存储部分中。 之后，计算部分获得ACK分组的ACK数量，该ACK分组的数量等于通过将不等待ACK分组发送的两个连续的数据分组的第二数据分组的数据长度与第二数据的序列号相加而获得的值 来自存储部分的两个连续数据分组的分组。 然后，计算部分计算两个连续数据分组的第二数据分组的接收时间和获得的ACK分组的接收时间的往返时间。

公开(公告)号：US07482063B2

公开(公告)日：2009-01-27

申请号：US10525383

申请日：2003-08-21

Applicant: Takeshi Minoda ,  Yuichi Matsuda ,  Kaoru Yorita ,  Kenji Yonemochi ,  Kenji Oota ,  Etsuo Okahara ,  Toshio Arai

Inventor： Takeshi Minoda ,  Yuichi Matsuda ,  Kaoru Yorita ,  Kenji Yonemochi ,  Kenji Oota ,  Etsuo Okahara ,  Toshio Arai

IPC: B32B25/04 ,  B32B27/26 ,  B32B27/30 ,  B32B27/32 ,  B32B37/10

CPC classification number: B29C37/0028 ,  B29C45/1679 ,  C08J5/00 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31913 ,  Y10T428/31928 ,  Y10T428/31935 ,  Y10T428/31938

Abstract: An in-mold coating molded article is obtained by coating the surface of a resin molded product comprising a hydroxyl group-containing polypropylene resin composition (A) with a paint composition for in-mold coating, wherein the composition (A) comprises a polypropylene resin (i), an additive rubber (ii) and optionally a polymer compound (iii) other than the polypropylene resin (i) and the additive rubber (ii), the total hydroxyl value of the polypropylene resin (i), the additive rubber (ii) and the optional polymer compound (iii) is from 1 to 40, the composition (A) has a rubber component content (total of the amount of the additive rubber (ii) and the amount of components soluble in n-decane at 23° C. of the polypropylene resin (i) and the optional polymer compound (iii)) of from 15 to 80% by mass based on 100% by mass of the total amount of the rubber component and the resin component other than the rubber component, the paint composition comprises a vehicle component comprising 10 to 70% by mass of an oligomer having at least two (meth)acrylate groups and 90 to 30% by mass of an ethylenically unsaturated monomer copolymerizable with the oligomer, a (meth)acryl modified chlorinated polyolefin having a chlorine content of from 2 to 40% by mass, an organic peroxide polymerization initiator, and a polyisocyanate compound.

Abstract translation: 通过将包含含羟基的聚丙烯树脂组合物（A）的树脂成型体的表面与用于模内涂布的涂料组合物进行涂布而获得模内涂布成型体，其中，组合物（A）含有聚丙烯树脂 （i），除了聚丙烯树脂（i）和添加剂橡胶（ii）以外的添加剂橡胶（ii）和任选的高分子化合物（iii），聚丙烯树脂（i），添加剂橡胶 ii）和任选的聚合物化合物（iii）为1至40，组合物（A）的橡胶组分含量（添加剂橡胶（ii）的总量）和可溶于正癸烷的组分的量在23 相对于橡胶成分和除了橡胶成分以外的树脂成分的总量的100质量％，聚丙烯树脂（i）和任选的高分子化合物（iii）的含量为15〜80质量％ ，所述涂料组合物包含包含10的载体组分 至70质量％的具有至少两个（甲基）丙烯酸酯基的低聚物和90〜30质量％的可与低聚物共聚的烯键式不饱和单体，具有氯含量为2〜（甲基）丙烯酸改性氯化聚烯烃 40质量％，有机过氧化物聚合引发剂和多异氰酸酯化合物。

公开(公告)号：US20050017271A1

公开(公告)日：2005-01-27

申请号：US10920270

申请日：2004-08-18

Applicant: Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

Inventor： Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

IPC: H01L23/12 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46 ,  H01L23/52

CPC classification number: H05K3/4682 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/045 ,  H05K3/108 ,  H05K3/20 ,  H05K3/205 ,  H05K3/388 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49345

Abstract: A substrate of multilayered structure having a. plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.

Abstract translation: 具有a的多层结构的衬底。 多个绝缘层和布线层组，并且具有用于安装半导体元件的一个面和要设置外部连接端子的另一个面，用于安装半导体元件的面设置有衬垫 接合到半导体元件的电极端子，另一个面设置有待连接到诸如由焊球形成的端子的外部连接端子的焊盘，并且绝缘层两侧的布线层被连接 彼此通过穿过绝缘层的通孔，其中要结合到半导体元件的电极端子的焊盘的表面是平坦的并且在同一平面中。 还公开了制造这种多层基板的方法。

公开(公告)号：US06756430B2

公开(公告)日：2004-06-29

申请号：US09878424

申请日：2001-06-12

Applicant: Yuichi Matsuda ,  Mikio Hashimoto ,  Ikunori Sakai

Inventor： Yuichi Matsuda ,  Mikio Hashimoto ,  Ikunori Sakai

IPC: C08K53492

CPC classification number: C08K5/053 ,  C08K5/0091 ,  C08K5/3492 ,  C08K5/34928 ,  C08K5/51

Abstract: A flame-retarding thermoplastic resin composition which is composed essentially of (A) a component of thermoplastic resin, (B) a component of nitrogen atom-containing phosphatic compound, (C) a component of hydroxyl group-containing compound or partly esterified product thereof and (D) a component of neutralizer for acids, with optional component (E) of triazine derivative or (F) of metal alkoxide, wherein the proportion of each component is such that the component (A) is in the range from 60 to 90 parts by weight, the sum of the components (B)+(C) is in the range from 10 to 40 parts by weight and the component (D) is in the range from 0.1 to 5 parts by weight, per 100 parts by weight of the total sum of (A)+(B)+(C), respectively, wherein the weight ratio of (B)/(C) amounts to at least 1.

Abstract translation: 一种阻燃性热塑性树脂组合物，其主要由（A）热塑性树脂组分，（B）含氮原子的磷酸酯化合物的组分，（C）含羟基化合物的组分或其部分酯化产物 和（D）酸中和剂的组分，和三嗪衍生物的任选组分（E）或金属醇盐的（F），其中每种组分的比例使得组分（A）的比例在60至90 （B）+（C）的总和为10〜40重量份，成分（D）为0.1〜5重量份，相对于100重量份 分别为（A）+（B）+（C）的总和，其中（B）/（C）的重量比达到至少1。

公开(公告)号：US06441314B2

公开(公告)日：2002-08-27

申请号：US09815047

申请日：2001-03-23

Applicant: Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

Inventor： Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

IPC: H05K116

CPC classification number: H05K3/4682 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/045 ,  H05K3/108 ,  H05K3/20 ,  H05K3/205 ,  H05K3/388 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49345

Abstract: A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.