公开(公告)号：US20240132767A1

公开(公告)日：2024-04-25

申请号：US18548316

申请日：2022-03-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Keiichi KOMATSU ,  Asahi KASUE ,  Atsushi YAMAGUCHI

IPC: C09K5/14 ,  C08K3/22 ,  C08L63/00

CPC classification number: C09K5/14 ,  C08K3/22 ,  C08L63/00 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L2207/02

Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.

公开(公告)号：US20240132766A1

公开(公告)日：2024-04-25

申请号：US18273131

申请日：2022-01-20

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Tatsuya IWAMOTO ,  Gaku KITADA

IPC: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  H01M10/653 ,  H01M50/211

CPC classification number: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  H01M10/653 ,  H01M50/211 ,  C08K2003/2227 ,  C08K2201/001

Abstract: The present invention provides a thermally conductive composition comprising: (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a polysiloxane compound containing at least one alkyl group having 4 or more carbon atoms. According to the present invention, it is possible to provide the thermally conductive composition capable of forming a thermally conductive member having an excellent thermally conductive property and high adhesive force to polypropylene.

公开(公告)号：US11945931B1

公开(公告)日：2024-04-02

申请号：US18280250

申请日：2021-12-01

Applicant: SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCES

Inventor： Weibang Lv ,  Shuxuan Qu ,  Jiaqi Xi

IPC: C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K7/06 ,  C08K9/00

CPC classification number: C08K3/041 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K7/06 ,  C08K9/00 ,  C08K2003/0806 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/011 ,  Y02W30/62

Abstract: A recyclable nano composite, a preparation method, and an application thereof are provided. The preparation method includes providing a reinforcement material including a conductive material, or, a combination of the conductive material and an insulating material; directly mixing the reinforcement material with a matrix material, or, molding the reinforcement material to form a film, fiber or three-dimensional network structure formed by the reinforcement material, and then compounding the film, fiber or three-dimensional network structure with the matrix material to obtain the recyclable nano composite. The present disclosure further discloses a recycling method of a reinforcement material. The recyclable nano composite provided by the present disclosure has high strength, high toughness, conductivity, electromagnetic shielding and other properties; furthermore, by simple treatment, the reinforcement material can be recycled.

公开(公告)号：US11940403B2

公开(公告)日：2024-03-26

申请号：US16609943

申请日：2018-05-01

Applicant: Amulet, Inc.

Inventor： Srikanth Rao Agnihotra ,  Madanodaya Sundhoro ,  Brent Amberger ,  Abigail Barnes ,  Joseph Belbruno ,  Seung Hyuk Noh ,  Jeanette Numbers ,  Elizabeth Soucy

IPC: G01N27/12 ,  G01N27/04 ,  G01N33/02 ,  G01N33/68 ,  C08K3/04

CPC classification number: G01N27/126 ,  G01N27/045 ,  C08K3/041 ,  C08K2201/001 ,  G01N33/02 ,  G01N33/68 ,  G01N2600/00

Abstract: A device for the detection of a food allergen includes a sensor having a printed circuit board and a chip comprising a molecularly imprinted polymer (MIP) and a non-imprinted polymer (NIP); a reservoir comprising a liquid; and a chamber for mixing the liquid with a food.

公开(公告)号：US11936106B2

公开(公告)日：2024-03-19

申请号：US18137427

申请日：2023-04-20

Applicant: Alexander Socransky

Inventor： Alexander Socransky

IPC: H01Q15/14 ,  B29B7/90 ,  B29C41/00 ,  B29C41/08 ,  B29C41/12 ,  B29D11/00 ,  B29K105/16 ,  B29K507/04 ,  B29L11/00 ,  B29L31/30 ,  C08J3/20 ,  C08K3/04 ,  C08K7/06 ,  H01Q15/16

CPC classification number: H01Q15/141 ,  B29B7/90 ,  B29C41/003 ,  B29C41/08 ,  B29C41/12 ,  B29D11/0074 ,  C08J3/203 ,  C08K3/04 ,  C08K3/041 ,  C08K3/046 ,  C08K7/06 ,  H01Q15/16 ,  B29K2105/167 ,  B29K2507/04 ,  B29L2011/0083 ,  B29L2031/3067 ,  B29L2031/3076 ,  B29L2031/3097 ,  C08K2201/001 ,  C08K2201/011 ,  C08K2201/014

Abstract: The present invention is directed to the production of shipping containers, computer server farm containers, and other forms of physical storage containers from a carbon nanotube-based fiber material with the potential application of other, non-carbon, nano-based materials containing various structures. Current materials used for shipping containers, computer server farm containers, and other forms of physical storage containers are heavier than the present invention and lack the ability to withstand high-intensity shock vibrations and other disturbances and are vulnerable to radiofrequency (“RF”) radiation. Instead of using metal, which is the currently preferred material used in the development of shipping containers, computer server farm containers, and other forms of physical storage containers, the present invention provides the use of a carbon nanotube-based material.

公开(公告)号：US20240076468A1

公开(公告)日：2024-03-07

申请号：US18154991

申请日：2023-01-16

Applicant: Hyundai Motor Company ,  Kia Corporation ,  Kyungshin Cable ,  Korea Kumho Petrochemical Co., Ltd.

Inventor： Seung-Woo Choi ,  Dong-Bum Seo ,  Kyun Oh ,  Yu-Hyun Song ,  Yang-Jin Kwon ,  Joo-Han Lee

IPC: C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08L101/12 ,  H01B1/24

CPC classification number: C08K3/041 ,  C08K3/042 ,  C08K3/08 ,  C08K3/22 ,  C08L101/12 ,  H01B1/24 ,  C08K2003/085 ,  C08K2003/2231 ,  C08K2003/2237 ,  C08K2201/001 ,  C08L2203/202

Abstract: An embodiment resin composition for shielding electromagnetic waves, based on a total weight of the resin composition, includes 20 to 80 wt % of thermoplastic resin, 1 to 50 wt % of a conductive filler, and 0.1 to 30 wt % of an additive. The conductive filler includes carbon fiber, carbon nanotube, carbon black, or combinations thereof

公开(公告)号：US20240067772A1

公开(公告)日：2024-02-29

申请号：US18383072

申请日：2023-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changho NOH ,  Insu LEE ,  Songwon HYUN ,  Yoonseok KO ,  Mijeong KIM ,  Keechang LEE ,  Sangsoo JEE

IPC: C08G59/24 ,  C08K3/013 ,  C08G59/62 ,  C08L63/00

CPC classification number: C08G59/245 ,  C08K3/013 ,  C08G59/621 ,  C08L63/00 ,  C08G2170/00 ,  C08G2190/00 ,  C08K2201/001 ,  C08L2203/206

Abstract: An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:


E1-(M1)a1-(L1)b1-(M2)a2-L2-A1-L3-(M3)a3-(L4)b2-(M4)a4-E2  Formula 1



E3-(A2)c1-(L5)b3-(M5)a5-L6-(M6)a6-L7-(M7)a7-(L8)b4-(A3)c2-E4  Formula 2

In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

公开(公告)号：US11912869B2

公开(公告)日：2024-02-27

申请号：US17431363

申请日：2020-02-04

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Keita Kitazawa ,  Wataru Toya

IPC: C08L83/04 ,  C08K3/28

CPC classification number: C08L83/04 ,  C08K3/28 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/005 ,  C08L2205/025 ,  C08L83/04 ,  C08K3/22 ,  C08L83/00 ,  C08L83/04 ,  C08K3/28 ,  C08L83/00 ,  C08L83/04 ,  C08K2003/2227 ,  C08L83/00 ,  C08L83/04 ,  C08K2003/2296 ,  C08L83/00

Abstract: A non-curable thermal-conductive silicone composition contains essential components of: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 1,000,000 mm2/s or more in an amount of 5 to 20 mass % relative to a sum of the component (A) and a component (B); (B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) in an amount of 80 to 95 mass % relative to the sum of the components (A) and (B); and (C) a heat conductive filler in an amount of 10 to 95 mass % relative to a total amount of the composition. A mixture of the components (A) and (B) has a molecular weight distribution Mw/Mn of 10 or more. R1 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent. “m” represents an integer of 5 to 100.

公开(公告)号：US20240059843A1

公开(公告)日：2024-02-22

申请号：US18278437

申请日：2022-03-04

Applicant: Momentive Performance Materials Inc.

Inventor： Pranabesh DUTTA ,  Debarshi DASGUPTA ,  Anjitha MS ,  Tetsuo FUJIMOTO ,  Chisato HOSHINO

IPC: C08G77/20 ,  C08K3/22 ,  C08J3/075

CPC classification number: C08G77/20 ,  C08K3/22 ,  C08J3/075 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2003/385

Abstract: A one-component thermal gel composition comprising a crosslinked silicone gel, a hydrolyzable siloxane, a thermal conductivity enhancing agent, and optionally one or more additives is described.

公开(公告)号：US11908595B2

公开(公告)日：2024-02-20

申请号：US16929758

申请日：2020-07-15

Applicant: Momentive Performance Materials GmbH

Inventor： Beatrice Grau ,  Lada Bemert ,  Harry Zumaque ,  Oliver Safarowsky

IPC: C08L83/04 ,  H01B3/46 ,  C08K3/04 ,  H01B3/00 ,  C08K3/36 ,  C08K5/14 ,  C08L83/00 ,  C08K5/56 ,  C08J3/24 ,  G01N27/14 ,  H02G15/04 ,  H02G15/103 ,  H02G15/184 ,  H02G15/064

CPC classification number: H01B3/46 ,  C08J3/24 ,  C08K3/04 ,  C08K3/36 ,  C08K5/14 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  G01N27/14 ,  H01B3/004 ,  H01B3/006 ,  H02G15/04 ,  C08J2383/07 ,  C08K2201/001 ,  C08K2201/006 ,  C08L2203/202 ,  H02G15/064 ,  H02G15/103 ,  H02G15/184 ,  C08K5/14 ,  C08L83/04 ,  C08K3/04 ,  C08L83/04 ,  C08K3/36 ,  C08L83/04 ,  C08L83/04 ,  C08K3/04 ,  C08K3/36 ,  C08K5/56 ,  C08L83/00

Abstract: The invention relates to a silicone rubber composition having specific dielectric properties which can be used as insulator material in high voltage direct current applications and a method for the manufacture of cable accessories like cable joints. The invention comprises as well a method for the determination of the optimum dielectric properties and the related amount of dielectric active additives.