公开(公告)号：US20170191866A1

公开(公告)日：2017-07-06

申请号：US15398397

申请日：2017-01-04

Applicant: L'ORÉAL

Inventor： Guive BALOOCH ,  Rafal Pielak ,  Yunzhou Shi

IPC: G01J1/02 ,  G01J1/42 ,  G01J1/50

CPC classification number: G01J1/0233 ,  G01J1/0219 ,  G01J1/0238 ,  G01J1/0266 ,  G01J1/0271 ,  G01J1/029 ,  G01J1/4228 ,  G01J1/429 ,  G01J1/50 ,  G01J2001/0257 ,  G01J2001/0276 ,  G01J2001/428 ,  G01J2003/466

Abstract: A system is provided for determining personal ultra-violet (UV) radiation measurements, comprising: a measurement device configured to measure UV irradiation; and a terminal device configured to receive or capture an output of the measured UV irradiation from the measurement device and to determine a specific user's personal UV exposure risk level based on at least the measured sun irradiation and information of a skin type of the specific user. The measurement device configured to measure UV radiation exposure includes a surface that includes a plurality of different sections that each have a different sensitivity to UV radiation exposure, and each of the plurality of different sections are configured to display a different color in response to the UV radiation exposure.

公开(公告)号：US09696199B2

公开(公告)日：2017-07-04

申请号：US14997281

申请日：2016-01-15

Applicant: Taiwan Biophotonic Corporation

Inventor： Chang-Sheng Chu ,  Yu-Tang Li ,  Yeh-Wen Lee ,  Chih-Hsun Fan ,  Lung-Pin Chung ,  Jyh-Chern Chen ,  Shuang-Chao Chung

IPC: G01J1/04 ,  G01J1/44 ,  A61B5/1455 ,  A61B5/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  H04B10/071 ,  G01J1/42 ,  G01J1/02 ,  G01J1/08 ,  H01L31/12 ,  H01L33/54 ,  H01L33/58

CPC classification number: G01J1/0459 ,  A61B5/14552 ,  A61B5/681 ,  A61B2560/0443 ,  A61B2562/0233 ,  A61B2562/164 ,  A61B2562/227 ,  G01J1/0271 ,  G01J1/0437 ,  G01J1/08 ,  G01J1/4228 ,  G01J1/44 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/125 ,  H01L31/173 ,  H01L33/54 ,  H01L33/58 ,  H04B10/071

Abstract: The present disclosure relates to an optical sensor module, an optical sensing accessory, and an optical sensing device. An optical sensor module comprises a light source, a photodetector, and a substrate. The light source is configured to convert electric power into radiant energy and emit light to an object surface. The photodetector is configured to receive the light from an object surface and convert radiant energy into electrical current or voltage. An optical sensing accessory and an optical sensing device comprise the optical sensor module and other electronic modules to have further applications.

公开(公告)号：US20170186886A1

公开(公告)日：2017-06-29

申请号：US15222926

申请日：2016-07-28

Applicant: SensorTek technology Corp.

Inventor： Huan-Hsiang Weng ,  Feng-Jung Hsu ,  Chu-Yuan Yang ,  Chih-Wei Chen ,  Yi-Hua Chang

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/14 ,  G01J1/42 ,  G01V8/20

CPC classification number: G01V8/20 ,  G01J1/0266 ,  G01J1/0271 ,  G01J1/4204 ,  G01S7/481 ,  G01S7/497 ,  G01S17/026 ,  H01L31/16

Abstract: A sensor includes a first reception unit configured for sensing a first signal of a first frequency band and a second reception unit configured for sensing a second signal of a second frequency band. There is a height difference between the first reception unit and the second reception unit.

公开(公告)号：US20170176246A1

公开(公告)日：2017-06-22

申请号：US15293204

申请日：2016-10-13

Applicant: Apple Inc.

Inventor： Zhang Jia ,  Naoto Matsuyuki ,  Matthew S. Rogers

IPC: G01J1/04 ,  G02B1/115 ,  G01J1/42

CPC classification number: G01J1/0418 ,  G01J1/0219 ,  G01J1/0233 ,  G01J1/0247 ,  G01J1/0271 ,  G01J1/0407 ,  G01J1/0422 ,  G01J1/0459 ,  G01J1/4204 ,  G01J3/0205 ,  G01J3/0213 ,  G01J3/0216 ,  G01J3/0264 ,  G01J3/0272 ,  G01J3/0283 ,  G01J3/50 ,  G02B1/115 ,  G02B1/116 ,  G09F9/00

Abstract: An electronic device may have a display with a cover layer. An ambient light sensor may be aligned with an ambient light sensor window formed from an opening in a masking layer on the cover layer in an inactive portion of the display. To help mask the ambient light sensor window from view, the ambient light sensor window may be provided with a black coating that matches the appearance of surrounding masking layer material while allowing light to reach the ambient light sensor. The black coating may be formed from a black physical vapor deposition thin-film inorganic layer with a high index of refraction. An antireflection layer formed from a stack of dielectric layers may be interposed between the black thin-film inorganic layer and the display cover layer.

公开(公告)号：US20170160128A1

公开(公告)日：2017-06-08

申请号：US14956409

申请日：2015-12-02

Applicant: Fraunhofer Institute for Silicate Research ISC ,  King Abdulaziz City for Science and Technology

Inventor： Mohammed I Alhussaini ,  Mohammed A Bahattab ,  Mark Mirza ,  Walther Glaubitt ,  Ibrahim A Alhomoudi

IPC: G01J1/42 ,  G01J1/04 ,  G01J1/44

CPC classification number: G01J1/4204 ,  G01J1/0271 ,  G01J1/0474 ,  G01J1/44 ,  G01J2001/4266

Abstract: The invention provides an illumination measuring module which includes a housing and a photo detector. The housing is molded with a plurality of surfaces. Each surface of the housing is affixed with respective side edges of the plurality of the surfaces to form a predetermined shape. Each surface includes an external surface and an inner surface. One surface of the plurality of surfaces is a glass surface. The glass surface transmits illumination collected from an external ambience of the housing to one or more inner surfaces corresponding to the plurality of surfaces. On an inner surface of the glass surface, a plane white sheet is positioned which homogenously scatters illumination collected from the external ambience into the one or more inner surfaces in the housing. The photo detector measures scattered illumination diffused from the one or more inner surfaces corresponding to the plurality of surfaces.

公开(公告)号：US20170141241A1

公开(公告)日：2017-05-18

申请号：US15353397

申请日：2016-11-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/0216 ,  G01J1/02 ,  H01L31/12

CPC classification number: G01J1/0295 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US09651365B2

公开(公告)日：2017-05-16

申请号：US15005411

申请日：2016-01-25

Applicant: Rememdia LC

Inventor： Fraser M. Smith

IPC: H04N5/00 ,  G01B11/14 ,  H01L27/146 ,  G01J1/02 ,  G01B11/00 ,  G01B11/16 ,  G01D5/26 ,  G01P3/36 ,  G01P15/093 ,  G01L1/24

CPC classification number: G01B11/002 ,  G01B11/14 ,  G01B11/16 ,  G01D5/26 ,  G01D5/262 ,  G01J1/0266 ,  G01J1/0271 ,  G01L1/24 ,  G01P3/36 ,  G01P15/093 ,  H01L27/146 ,  H01L27/14643

Abstract: A sensor is disclosed that can include a light component in support of a first light source operable to direct a first beam of light, and a second light source operable to direct a second beam of light. The sensor can also include an imaging device positioned proximate the light component and operable to directly receive the first beam of light and the second beam of light, and convert these into electric signals. The imaging device and the light component can be movable relative to one another. The sensor can further include a light location module configured to receive the electric signals and determine locations of the first beam of light and the second. beam of light on the imaging device. In addition, the sensor can include a position. module configured to determine a relative position of the imaging device and the light component based on the locations of the first beam of light and the second beam of light on the imaging device.

公开(公告)号：US20170131140A1

公开(公告)日：2017-05-11

申请号：US15413745

申请日：2017-01-24

Applicant: Corning Optical Communications LLC

Inventor： Adam Joseph Fusco ,  Daniel Ohen Ricketts ,  James Scott Sutherland ,  Neil David Vance ,  Elvis Alberto Zambrano

IPC: G01J1/30 ,  H04B10/079 ,  G01J1/02 ,  G02B6/38 ,  G01M11/00 ,  G01J1/04

CPC classification number: G01J1/30 ,  G01J1/0271 ,  G01J1/0425 ,  G01M11/30 ,  G01M11/33 ,  G02B6/3829 ,  G02B6/385 ,  G02B6/3874 ,  G02B6/4225 ,  H04B10/0795

Abstract: A non-contact method of measuring an insertion loss of a DUT connector is disclosed. The DUT connector has a first ferrule with a first optical fiber and a first end face. The method utilizes a reference connector having a second ferrule with a second optical fiber and a second end face. The method includes: axially aligning the first and second ferrules so that the first and second end faces are confronting and spaced apart to define a gap with an axial gap distance d; measuring values of the insertion loss between the first and second optical fibers for different gap distances d>0; and estimating a value for the insertion loss for a gap distance of d=0 based on the measured values of the insertion loss when d>0.

公开(公告)号：US09645238B1

公开(公告)日：2017-05-09

申请号：US14981196

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: G01J1/42 ,  G01S17/02 ,  G01J1/04

CPC classification number: G01S17/026 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/0271 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/42 ,  G01S7/4813 ,  H01L31/167 ,  H01L2224/73265

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

公开(公告)号：US20170123064A1

公开(公告)日：2017-05-04

申请号：US14981196

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: G01S17/02 ,  G01J1/04 ,  G01J1/42

CPC classification number: G01S17/026 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/0271 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/42 ,  G01S7/4813 ,  H01L31/167 ,  H01L2224/73265

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.