公开(公告)号：US06800815B1

公开(公告)日：2004-10-05

申请号：US10051984

申请日：2002-01-15

Applicant: Michael Richard Ehlert ,  William Jeffrey Schaefer

Inventor： Michael Richard Ehlert ,  William Jeffrey Schaefer

IPC: H05K111

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/10126 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/248 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4061 ,  H05K2201/017 ,  H05K2201/035 ,  H05K2201/09909 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is formed on a surface of the ceramic layer. A barrier cap is formed between the via and the contact pad. A dielectric ring covers a peripheral portion of the contact pad and an adjacent portion of the dielectric material layer surface immediately surrounding the contact pad, such that any solder that is applied to the contact does not contact the peripheral portion of the contact pad or the ceramic material.

Abstract translation: 一种陶瓷电路结构，包括多个陶瓷层和至少一个嵌入在所述多个陶瓷层内的电子部件。 在第一陶瓷层之中的是通过陶瓷层的通孔。 在陶瓷层的表面上形成接触垫。 在通孔和接触垫之间形成阻挡帽。 介电环覆盖接触焊盘的周边部分和电介质材料层表面的相邻部分，其紧邻围绕接触焊盘，使得施加到接触件的任何焊料不接触接触焊盘或陶瓷的周边部分 材料。

公开(公告)号：US06452264B2

公开(公告)日：2002-09-17

申请号：US09798758

申请日：2001-03-02

Applicant: Mitsuyoshi Nishide ,  Jun Urakawa ,  Yukinobu Sato

Inventor： Mitsuyoshi Nishide ,  Jun Urakawa ,  Yukinobu Sato

IPC: H01L2310

CPC classification number: C04B35/195 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K3/3452 ,  H05K3/4629 ,  H05K2201/017

Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.

Abstract translation: 提供了一种用于形成具有高位置精度的阻焊层的绝缘厚膜组合物，其可以抑制多层陶瓷基板的翘曲和起伏，并且可以保持其优异的电气特性。 绝缘厚膜组合物主要由具有与生陶瓷片中所含的粉末状陶瓷相同组成体系的粉末陶瓷组成，绝缘厚膜组合物的粉末状陶瓷的平均粒径小于 包含在绿色陶瓷体中的粉末状陶瓷。

公开(公告)号：US4409261A

公开(公告)日：1983-10-11

申请号：US322413

申请日：1981-11-18

Applicant: Charles Y. Kuo

Inventor： Charles Y. Kuo

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/28 ,  B05D5/12

CPC classification number: H05K3/28 ,  H05K1/092 ,  H05K3/248 ,  H05K1/0306 ,  H05K2201/017 ,  Y10T428/24851 ,  Y10T428/24909 ,  Y10T428/24926 ,  Y10T428/252

Abstract: A thick film is formed initially as a paste and made up of such oxidizable conductor ingredients as copper which is then mixed with glass frit and next printed on a non-conductive inert substrate by silk screening. The silk screen printed thick film with vehicle is then dried, and a coating of boron in suitable paste or paint form having been mixed with a thixotropic organic vehicle is covered over the entirety of the substrate and silk screen printed thick film. The resulting product after a second air drying is then fired to bond the glass frit-copper as a thick film onto the substrate, with the copper particles being sintered throughout into a thick film. Superposed boron, where contiguous with the copper printing, is fused as a protective layer over the copper allowing the sintering of the copper and bonding with the substrate to occur without oxidation of the copper. Oxidized boron that covers portions of the substrate not occupied by the thick film and not superposing the copper layer is then washed away and the boron bonded to the copper remains as a protective coating.

Abstract translation: 最初形成一层厚的薄膜作为糊状物，由铜等可氧化的导电成分组成，然后与玻璃料混合，然后通过丝网印刷印在非导电的惰性基材上。 然后将具有载体的丝网印刷的厚膜干燥，并将与触变有机载体混合的合适的糊剂或油漆形式的硼涂层覆盖在整个基材和丝网印刷的厚膜上。 然后将第二次空气干燥后的所得产物烧制，将作为厚膜的玻璃料铜结合到基材上，将铜颗粒整个烧结成厚膜。 与铜印刷邻接的叠加的硼作为铜上的保护层熔合，允许铜的烧结并与基底结合发生而不会氧化铜。 然后冲洗覆盖未被厚膜占据并且不叠加铜层的衬底的氧化硼，并且与铜结合的硼保持为保护涂层。

公开(公告)号：US4312896A

公开(公告)日：1982-01-26

申请号：US126396

申请日：1980-03-03

Applicant: Harris W. Armstrong

Inventor： Harris W. Armstrong

IPC: B23K35/00 ,  C04B41/51 ,  C04B41/88 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28 ,  H05K3/40 ,  H05K3/12

CPC classification number: C04B41/88 ,  B23K35/001 ,  C04B41/009 ,  C04B41/5144 ,  H05K1/092 ,  H05K3/28 ,  H05K1/0306 ,  H05K2201/017 ,  H05K2203/1105 ,  H05K2203/125 ,  H05K3/4007 ,  Y10T29/49149 ,  Y10T29/49155

Abstract: A novel process for fastening ceramic material such as alumina or the like to metallic material such as an electrical conductor. The process is characterized by the fact that a solder wettable, oxidation-resistant barrier is used, on metal particles printed onto the ceramic. In some advantageous processes, the carbide layer allows metallizing processes to be carried out in non-hydrogen atmospheres. The process requires no expensive noble metal; and it utilizes a barrier material which is sufficiently stable to tolerate conductive film formation at high temperatures. Nickel-carbide coated nickel is a particularly favorable material for use in the invention because it is conductive, in the ohmic sense, and is readily wetted by common solders.Also disclosed are novel articles and compositions useful in practice of the process of the invention, and novel articles produced by the process of the invention.

Abstract translation: 用于将诸如氧化铝等的陶瓷材料紧固到诸如电导体的金属材料的新颖方法。 该方法的特征在于，在印刷在陶瓷上的金属颗粒上使用焊料可湿性，抗氧化屏障。 在一些有利的方法中，碳化物层允许金属化方法在非氢气氛中进行。 该方法不需要昂贵的贵金属; 并且使用足够稳定的耐受高温导电膜形成的阻挡材料。 镍碳化物涂覆的镍是用于本发明的特别有利的材料，因为它在欧姆意义上是导电的，并且容易被普通焊料润湿。 还公开了可用于实践本发明方法的新型制品和组合物，以及通过本发明方法制备的新型制品。

公开(公告)号：US09905928B2

公开(公告)日：2018-02-27

申请号：US14268082

申请日：2014-05-02

Applicant: L. Pierre de Rochemont

Inventor： L. Pierre de Rochemont

IPC: H01Q15/02 ,  H01Q9/04 ,  B82Y30/00 ,  H01C7/00 ,  H01C17/00 ,  H01C17/065 ,  H01G4/10 ,  H01G4/33 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q15/00 ,  H01L23/64 ,  H01L23/498 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16 ,  H05K3/20

CPC classification number: H01Q9/0414 ,  B82Y30/00 ,  C04B2235/768 ,  C04B2235/781 ,  H01C7/003 ,  H01C17/003 ,  H01C17/06533 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q15/0086 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/207 ,  H05K2201/017 ,  H05K2201/0175 ,  H05K2201/09763 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/121 ,  Y10T428/12493

Abstract: An electrical component provides a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein the ceramic element includes one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

公开(公告)号：US09711386B2

公开(公告)日：2017-07-18

申请号：US14336717

申请日：2014-07-21

Applicant: Applied Materials, Inc.

Inventor： Michael S. Cox ,  Zheng Yuan

IPC: H01L21/683 ,  H05K3/10 ,  H05K3/28 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01L21/6833 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/285 ,  H05K2201/017 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2203/0195 ,  H05K2203/1338 ,  Y10T29/49155

Abstract: Embodiments of the present invention provide a substrate support assembly including an electrostatic chuck with enhanced heat resistance. In one embodiment, an electrostatic chuck includes a support base, an electrode assembly having interleaved electrode fingers formed therein, and an encapsulating member disposed on the electrode assembly, wherein the encapsulating member is fabricated from one of a ceramic material or glass.

公开(公告)号：US20170091511A1

公开(公告)日：2017-03-30

申请号：US15271420

申请日：2016-09-21

Applicant: KYOCERA Corporation

Inventor： Kohichi OHSUMI

IPC: G06K9/00 ,  H05K1/03

CPC classification number: G06K9/0002 ,  H05K1/0366 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/017 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/10151

Abstract: A wiring board for a fingerprint sensor includes a core insulating layer having a thickness of 30 μm to 100 μm, an inner buildup insulating layer having a thickness of 17 μm to 35 μm, an outer buildup insulating layer having a thickness of 7 μm to 25 μm, a plurality of fingerprint reading outer strip-shaped electrodes, a plurality of fingerprint reading inner strip-shaped electrodes, and an upper solder resist layer covering the outer strip-shaped electrodes by a thickness of 3 μm to 15 μm.

公开(公告)号：US09544996B2

公开(公告)日：2017-01-10

申请号：US14300726

申请日：2014-06-10

Applicant: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD. ,  INNOLUX CORPORATION

Inventor： Kai Meng ,  Lien-Hsin Lee

IPC: G06F3/044 ,  H05K1/02 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12 ,  H03K17/96

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

Abstract translation: 一种制造电容触摸面板模块的方法包括：在包括沿着第一取向的触摸区域和外围区域的基板上形成多个第一导电图案，沿着第二取向的多个第二导电图案以及多个连接部分 在感人的地区; 形成多个绝缘突起，其中每个绝缘突起覆盖一个连接部分，并在周边区域上形成绝缘框架; 以及在每个绝缘突起上形成桥接构件。

公开(公告)号：US09445495B2

公开(公告)日：2016-09-13

申请号：US14560528

申请日：2014-12-04

Applicant: INNOLUX CORPORATION

Inventor： Kai Meng ,  Lien-Hsin Lee

IPC: G06F3/041 ,  H05K1/02 ,  G06F3/044 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12 ,  H03K17/96

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

公开(公告)号：US09295151B2

公开(公告)日：2016-03-22

申请号：US14000568

申请日：2012-02-01

Applicant: Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

Inventor： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L23/13 ,  H01L23/10 ,  H01L23/498 ,  C04B41/00 ,  H05K1/14 ,  H01L23/15

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

Abstract translation: 布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间 表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面 在金属化层与基板主体的各侧面的槽面之间露出。