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公开(公告)号：US09728668B2
公开(公告)日：2017-08-08
申请号：US14172352
申请日：2014-02-04
Applicant: Raytheon Company
Inventor： Michael H. Robson , Michael T. Pace
IPC: G09G3/3208 , H01L31/18 , H05K1/02
CPC classification number: H01L31/18 , H05K1/0286 , H05K2201/0112 , H05K2201/0209 , H05K2201/10106 , Y02B20/346 , Y02P70/521
Abstract: A system to configure a conductive pathway and a method of forming a system of configurable conductivity pathways are described. The system includes a photosensitive layer that becomes conductive based on photoexcitation, and a light source layer deposited over the photosensitive layer, the light source layer selectively providing the photoexcitation to the photosensitive layer. The system further includes a controller to control the light source layer, the controller illuminating a portion of the light source layer corresponding with a user input image to photoexcite the photosentive layer and configure the conductive pathway in the photosensitive layer according to the image.
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公开(公告)号：US20170218150A1
公开(公告)日：2017-08-03
申请号：US15502514
申请日：2015-08-21
Inventor： MASAAKI MATSUMOTO , TAKATOSHI MITO , TATUO YONEMOTO
IPC: C08J5/24 , C09D163/00 , H05K1/03 , B32B15/08
CPC classification number: C08J5/24 , B32B15/08 , B32B2457/08 , C08J2363/00 , C08J2433/14 , C08K3/36 , C08L63/00 , C09D163/00 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/0129 , H05K2201/0209 , H05K2201/029
Abstract: A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×104 or more and less than 45×104. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.
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公开(公告)号：US20170174915A1
公开(公告)日：2017-06-22
申请号：US14971595
申请日：2015-12-16
Applicant: US of America as Represented by the Administrator of the National Aeronautics and Space Administrati
Inventor： Terry D. Rolin , Curtis W. Hill
IPC: C09D11/033 , H01G13/04 , C09D11/14
CPC classification number: C09D11/033 , C08K3/22 , C08K3/24 , C08K3/40 , C08K9/02 , C08K2003/2206 , C08K2003/2237 , C08K2201/003 , C08K2201/011 , C09D11/037 , C09D11/14 , C09D11/322 , C09D11/36 , H01G4/12 , H01G4/129 , H01G4/30 , H01G4/33 , H01G13/04 , H05K1/162 , H05K2201/0179 , H05K2201/0209 , H05K2203/0776
Abstract: The present invention is a dielectric ink and means for printing using said ink. Approximately 10-20% of the ink is a custom organic vehicle made of a polar solvent and a binder. Approximately 30-70% of the ink is a dielectric powder having an average particle diameter of approximately 10-750 nm. Approximately 5-15% of the ink is a dielectric constant glass. Approximately 10-35% of the ink is an additional amount of solvent. The ink is deposited on a printing substrate to form at least one printed product, which is then dried and cured to remove the solvent and binder, respectively. The printed product then undergoes sintering in an inert gas atmosphere.
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公开(公告)号：US09680078B2
公开(公告)日：2017-06-13
申请号：US14950136
申请日：2015-11-24
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Hiroto Tamaki
IPC: H01L33/60 , H01L33/62 , H05K1/18 , H01L33/48 , H05K1/03 , H05K1/09 , H05K1/02 , H05K3/28 , H05K1/11 , H01L25/16
CPC classification number: H01L33/62 , H01L25/167 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/0002 , H01L2924/181 , H05K1/0274 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/282 , H05K2201/0209 , H05K2201/0326 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.
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35.发明授权公开(公告)号：US09670340B2
公开(公告)日：2017-06-06
申请号：US15351151
申请日：2016-11-14
Applicant: LG Innotek Co., Ltd.
Inventor： Sang A Ju , Hyun Gu Im , Jae Man Park
CPC classification number: C08K9/06 , B05D3/0254 , C08K3/22 , C08K3/38 , C08K9/02 , C08K9/08 , C08K2003/2227 , C08K2003/385 , H01L33/641 , H05K1/0373 , H05K2201/0209 , H05K2201/0227 , C08L63/00
Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
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Patent Agency Ranking
公开(公告)号：US20170073485A1
公开(公告)日：2017-03-16
申请号：US15363395
申请日：2016-11-29
Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
Inventor： Yoshihiro KATO , Takaaki OGASHIWA , Hiroshi TAKAHASHI , Tetsuro MIYAHIRA
IPC: C08J5/24 , H05K1/03 , B32B15/14 , C08K3/26 , B32B15/092
CPC classification number: C08J5/24 , B32B5/26 , B32B15/092 , B32B15/14 , B32B2262/10 , B32B2307/3065 , B32B2307/58 , B32B2307/734 , B32B2457/08 , C08J2363/00 , C08J2363/04 , C08K3/105 , C08K3/26 , C08K2003/267 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , Y10T428/31529 , C08L63/00
Abstract: A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO3.yMg(OH)2.zH2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet.
Abstract translation: 在平面方向上具有低热膨胀系数的印刷线路板的预浸料具有优异的耐热性和钻孔加工性，并且同时可以保持高水平的阻燃性，包括基材，树脂组合物 浸渍或涂覆在基材上，并浸渍。 树脂包括（A）无机填料，其是由由xMgCO 3·y Mg（OH）2·zH 2 O表示的水镁石组成的混合物，其中x：y：z为4：1：4,4：1：5,4：1 ：6：4：1：7,3：1：3或3：1：4; （B）环氧树脂; 和（C）固化剂。 预浸料可用于制备层压片材和金属箔层压片材。
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37.发明申请公开(公告)号：US20170064825A1
公开(公告)日：2017-03-02
申请号：US15252264
申请日：2016-08-31
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Haiying MEI , Hiroyuki BAN
CPC classification number: H05K1/113 , H01L2224/16225 , H01L2224/48227 , H05K1/0298 , H05K1/0373 , H05K1/183 , H05K3/0097 , H05K3/4038 , H05K3/4602 , H05K3/4647 , H05K3/4688 , H05K2201/0209 , H05K2201/068 , H05K2201/09118 , H05K2201/09136 , H05K2201/096 , H05K2203/025 , H05K2203/1189 , H05K2203/1476 , H05K2203/1536 , H05K2203/308
Abstract: A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes a conductor layer, a first insulating layer including reinforcing material and formed on the conductor layer, and mounting via conductors formed in the first insulating layer and connected to the conductor layer such that the second substrate has a mounting area on the third surface and that the mounting via conductors have via bottoms forming pads positioned to mount an electronic component in the mounting area, and the first substrate includes an insulating layer which does not contain reinforcing material and has an opening through the insulating layer and exposing the via bottoms forming the pads in the mounting area.
Abstract translation: 印刷电路板包括具有第一和第二表面的第一电路基板和具有第三和第四表面的第二电路基板，使得第一基板层压在第三表面上，并且第一和第三表面彼此相对。 第二基板包括导体层，包括增强材料并形成在导体层上的第一绝缘层，并且经由形成在第一绝缘层中并连接到导体层的导体安装，使得第二基板在第三绝缘层上具有安装区域 并且所述安装通孔导体具有通孔底部形成用于将电子部件安装在所述安装区域中的焊盘，并且所述第一基板包括绝缘层，所述绝缘层不包含增强材料并且具有穿过所述绝缘层的开口并暴露所述通孔底部 在安装区域中形成焊盘。
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38.发明申请INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RADIATION SUBSTRATE USING THE SAME 审中-公开无机填充物，包含相同的树脂组合物和使用其的热辐射基材公开(公告)号：US20170058107A1
公开(公告)日：2017-03-02
申请号：US15351151
申请日：2016-11-14
Applicant: LG Innotek Co., Ltd.
Inventor： Sang A Ju , Hyun Gu Im , Jae Man Park
CPC classification number: C08K9/06 , B05D3/0254 , C08K3/22 , C08K3/38 , C08K9/02 , C08K9/08 , C08K2003/2227 , C08K2003/385 , H01L33/641 , H05K1/0373 , H05K2201/0209 , H05K2201/0227 , C08L63/00
Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
Abstract translation: 根据本发明的一个实施方案的无机填料包括氮化硼附聚物和形成在氮化硼附聚物上并包含-Si-R-NH 2基团的涂层，R选自具有 1至3个碳原子，具有2至3个碳原子的烯烃基和具有2至3个碳原子的炔基。
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公开(公告)号：US09578738B2
公开(公告)日：2017-02-21
申请号：US14646065
申请日：2013-11-13
Applicant: KYOCERA Corporation
Inventor： Takeshi Matsui , Katsura Hayashi
CPC classification number: H05K1/0306 , H05K1/0298 , H05K1/0373 , H05K1/115 , H05K1/181 , H05K3/4602 , H05K3/4652 , H05K3/4655 , H05K2201/0195 , H05K2201/0209 , H05K2201/0269 , H05K2201/068 , H05K2201/09036
Abstract: According to an aspect of the invention, a wiring board includes an inorganic insulating layer and a conductive layer disposed on part of one main surface of the inorganic insulating layer. The part of the one main surface of the inorganic insulating layer includes a plurality of first recessed portions each of which has at least partially circular shape in a plan view. Part of the conductive layer enters into the plurality of first recessed portions. According to the aspect of the invention, it is possible to obtain a wiring board capable of reducing disconnection of the conductive layer and therefore having superior electrical reliability.
Abstract translation: 根据本发明的一个方面，布线板包括无机绝缘层和设置在无机绝缘层的一个主表面的一部分上的导电层。 无机绝缘层的一个主表面的一部分包括在平面图中至少部分为圆形的多个第一凹部。 导电层的一部分进入多个第一凹部。 根据本发明的一个方面，可以获得能够减少导电层的断开并因此具有优异的电可靠性的布线基板。
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公开(公告)号：US09565760B2
公开(公告)日：2017-02-07
申请号：US14311451
申请日：2014-06-23
Applicant: KYOCERA SLC Technologies Corporation
Inventor： Hirofumi Ishibashi , Masanori Tada
CPC classification number: H05K1/111 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H05K3/3436 , H05K3/3452 , H05K2201/0209 , Y02P70/611 , H01L2924/00
Abstract: In a wiring board, on an insulating layer of an outermost layer, there are provided a plurality of strip-shaped wiring conductors which are partially provided with semiconductor element connection pads to which electrode terminals of a semiconductor element are connected, at positions which prevent the semiconductor element connection pads adjacent to each other from being laterally arranged, and a solder resist layer having openings for individually exposing the semiconductor element connection pads is adhered on the insulating board as the outermost layer and on the strip-shaped wiring conductors, wherein the solder resist layer internally contains an insulating filler, and the insulating filler is sunk below the upper surfaces of the strip-shaped wiring conductors.
Abstract translation: 在布线基板上，在最外层的绝缘层上设置有多个条状布线导体，其部分地设置有半导体元件的电极端子连接到半导体元件连接焊盘的位置， 相邻的半导体元件连接焊盘被横向布置，并且具有用于单独暴露半导体元件连接焊盘的开口的阻焊层粘附在绝缘板上作为最外层和条形布线导体，其中焊料 抗蚀剂层内部包含绝缘填料，并且绝缘填料沉没在条状布线导体的上表面下方。
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