公开(公告)号：US08187479B2

公开(公告)日：2012-05-29

申请号：US12273961

申请日：2008-11-19

Applicant: Myung-Sam Kang

Inventor： Myung-Sam Kang

IPC: B44C1/22

CPC classification number: H05K3/421 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/0341 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/1388

Abstract: Disclosed is a manufacturing method of a printed circuit board. The method in accordance with an embodiment of the present invention includes: providing a laminated substrate having an insulator as well as a first metal layer and a second metal layer, which are sequentially laminated on one side of the insulator; processing a via hole in the laminated substrate; forming a seed layer on an inner wall of the via hole and on a surface of the second metal layer; plating an inside of the via hole and the surface of the second metal layer with a conductive material that is different from a material of the second metal layer; etching the seed layer and the conductive material, formed on the second metal layer; etching the second metal layer; and forming a first circuit pattern by selectively etching the first metal layer.

Abstract translation: 公开了一种印刷电路板的制造方法。 根据本发明的实施例的方法包括：提供具有绝缘体的层叠基板以及依次层压在绝缘体的一侧上的第一金属层和第二金属层; 处理层压基板中的通孔; 在所述通孔的内壁上和所述第二金属层的表面上形成种子层; 用与第二金属层的材料不同的导电材料电镀通孔内表面和第二金属层表面; 蚀刻形成在第二金属层上的种子层和导电材料; 蚀刻第二金属层; 以及通过选择性地蚀刻所述第一金属层来形成第一电路图案。

公开(公告)号：US20120115263A1

公开(公告)日：2012-05-10

申请号：US13353014

申请日：2012-01-18

Applicant: Makoto MATSUDA

Inventor： Makoto MATSUDA

IPC: H01L33/48

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/183 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.

Abstract translation: 本发明的实施例具有绝缘基板，其中形成用于安装LED芯片的第一凹孔和用于连接金属小规格金属丝的第二凹孔，其中形成用作第一布线图案的金属片 在包括第一凹孔的部分，在包括第二凹孔的部分处形成用作第二布线图案的金属片，将LED芯片安装在第一凹孔内的金属片上，LED芯片 通过金属小规格导线与第二凹孔内的金属片电连接，芯片型LED用透明树脂密封。

公开(公告)号：US20120111607A1

公开(公告)日：2012-05-10

申请号：US13354438

申请日：2012-01-20

Applicant: Shuhichi OKABE ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jeong-Woo Park ,  Ji-Eun Kim

Inventor： Shuhichi OKABE ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jeong-Woo Park ,  Ji-Eun Kim

IPC: H05K1/02

CPC classification number: H05K1/0265 ,  H05K1/116 ,  H05K3/107 ,  H05K3/108 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09736 ,  H05K2203/0361

Abstract: A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.

Abstract translation: 一种电路板，包括：具有沟槽的绝缘体; 形成为埋入沟槽的一部分的第一电路图案; 以及形成在其中形成有沟槽的绝缘体的表面上的第二电路图案。

公开(公告)号：US20120073977A1

公开(公告)日：2012-03-29

申请号：US13307906

申请日：2011-11-30

Applicant: Yasuaki TACHI ,  Shigeki Sawa ,  Toshiyuki Kasuga

Inventor： Yasuaki TACHI ,  Shigeki Sawa ,  Toshiyuki Kasuga

IPC: C25D7/06

CPC classification number: H05K3/241 ,  C25D7/0614 ,  C25D17/02 ,  C25D17/12 ,  H05K1/0393 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.

Abstract translation: 一种电镀皮带基板的方法，包括：通过电镀槽输送带基板，使浸入的阴极电源装置和/或辅助阴极电源装置与输送到镀槽内部的带基板接触， 带状基板成为阴极，并且在浸没的阴极电源装置和/或辅助阴极电源装置将输送的带状基板的阴极电源保持在电镀槽的内部时，对带状基板的表面进行电镀 进入镀槽的内部。 浸没的阴极供电装置和辅助阴极供电装置位于电镀槽的内部，并通过短路布线电连接。

公开(公告)号：US20120073865A1

公开(公告)日：2012-03-29

申请号：US13311058

申请日：2011-12-05

Applicant: Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

Inventor： Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

IPC: H05K1/09 ,  H05K1/00

CPC classification number: H05K3/428 ,  H05K3/205 ,  H05K3/383 ,  H05K3/384 ,  H05K3/4602 ,  H05K3/4658 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/1536 ,  Y10T29/49155

Abstract: A carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.

Abstract translation: 用于发送电路的载体构件，其是具有嵌入其中的电路图案的无芯型印刷电路板的部件，并且其可用于通过仅在其下端形成突起来提供高密度和高可靠性的印刷电路板 电路图案，使用承载构件的无芯印刷电路板，以及制造载体构件和无芯非印刷电路板的方法。

公开(公告)号：US20120066902A1

公开(公告)日：2012-03-22

申请号：US13301063

申请日：2011-11-21

Applicant: Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

Inventor： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

IPC: H05K3/10

CPC classification number: H05K1/116 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09545 ,  Y10T29/49165

Abstract: A method of manufacturing a printed circuit board, including: preparing a double-sided substrate which comprises an insulating layer, a first copper layer formed on one side of the insulating layer and a second copper layer formed on the other side of the insulating layer; forming a via-hole through the second copper layer and the insulating layer; forming a plating layer on an inner wall of the via-hole; and forming, on the double-sided substrate, a via, a first circuit layer including a circuit pattern that is formed on a surface of the via having a minimum diameter and has a line width smaller than the minimum diameter of the via, and a second circuit layer including a lower land.

Abstract translation: 一种制造印刷电路板的方法，包括：制备双面基板，其包括绝缘层，形成在所述绝缘层的一侧上的第一铜层和形成在所述绝缘层的另一侧上的第二铜层; 通过所述第二铜层和所述绝缘层形成通孔; 在所述通孔的内壁上形成镀层; 并且在双面基板上形成通孔，包括形成在具有最小直径并且具有小于通孔的最小直径的线宽度的通孔的表面上的电路图案的第一电路层，以及 第二电路层包括较低的焊盘。

公开(公告)号：US20110220399A1

公开(公告)日：2011-09-15

申请号：US13114693

申请日：2011-05-24

Applicant: Ayao NIKI

Inventor： Ayao NIKI

IPC: H05K1/00

CPC classification number: H05K1/115 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.

Abstract translation: 多层印刷线路板包括一个或多个具有通孔的树脂层和具有通孔的芯层。 在一个或多个树脂层中形成的通孔在与芯层中形成的通路孔打开的方向相反的方向上开口。 一种制造多层印刷线路板的方法包括制备单面或双面覆铜层压板的步骤; 通过加工覆铜层压板来形成焊盘的步骤; 在覆铜层压板的上表面上形成树脂层的步骤，在树脂层中形成通孔的开口，然后形成通孔; 以及在覆铜层压板的下表面中形成用于通孔的开口，然后形成通孔的步骤。

公开(公告)号：US20110102729A1

公开(公告)日：2011-05-05

申请号：US13000615

申请日：2009-06-24

Applicant: Teruo Kawamura ,  Toshio Etoh

Inventor： Teruo Kawamura ,  Toshio Etoh

IPC: G02F1/1333 ,  H05K1/11 ,  H05K1/00

CPC classification number: H05K3/0052 ,  G02F1/13452 ,  H05K1/0268 ,  H05K1/118 ,  H05K2201/0394 ,  H05K2201/09727 ,  H05K2201/10681 ,  H05K2203/1545 ,  H05K2203/175

Abstract: Provided are a flexible printed circuit that reduces the chance of the occurrence of short-circuit failures caused by swarf generated from punching out flexible printed circuit, and an electric circuit structure having this flexible printed circuit and an electric circuit substrate to which the flexible printed circuit is connected. A flexible printed circuit (100) has a wiring pattern (2) formed on the flexible base film (1). The flexible printed circuit (100) is individually punched out to be separated in a condition where the wiring pattern (2) is disposed on the base film (1), and the wiring pattern (2) has a narrowed portion (2c) near the edge of the base film (1).

Abstract translation: 提供了一种柔性印刷电路，其减少了由冲出柔性印刷电路产生的切屑引起的短路故障的发生机会，以及具有该柔性印刷电路的电路结构和柔性印刷电路 已连接。 柔性印刷电路（100）具有形成在柔性基膜（1）上的布线图案（2）。 在布线图案（2）设置在基膜（1）上的条件下，柔性印刷电路（100）被单独冲压成分离，并且布线图案（2）具有靠近 底膜（1）的边缘。

公开(公告)号：US20110083891A1

公开(公告)日：2011-04-14

申请号：US12631555

申请日：2009-12-04

Applicant: Hong Bok WE ,  Tae Sung JEONG ,  Dae Jun KIM

Inventor： Hong Bok WE ,  Tae Sung JEONG ,  Dae Jun KIM

IPC: H05K1/18 ,  B29C65/00 ,  B23K31/02

CPC classification number: H01L23/5389 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/186 ,  H05K1/189 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/10674

Abstract: Disclosed herein is an electronic component-embedded printed circuit board, including: a flexible film; an insulation layer formed on one side of the flexible film; an electronic component mounted on the one side of the flexible film in a face-down manner such that the electronic component is buried in the insulation layer; and a circuit layer including a connecting pattern which is formed on the one side of the flexible film and is connected with a connecting terminal of the electronic component by a connecting member. The electronic component-embedded printed circuit board is advantageous in that the position alignment between the connecting patterns and the connecting terminals is easy and the connection reliability therebetween is high because the connecting patterns formed on a flexible film are directly connected to the connecting terminals of an electronic component using connecting members, and in that the production cost thereof can be reduced because additional rewiring is not required.

Abstract translation: 这里公开了一种电子部件嵌入式印刷电路板，包括：柔性膜; 形成在柔性膜的一侧上的绝缘层; 以面向下方式安装在柔性膜的一侧上的电子部件，使得电子部件埋设在绝缘层中; 以及电路层，其包括形成在柔性膜的一侧上的连接图案，并且通过连接构件与电子部件的连接端子连接。 电子元件嵌入式印刷电路板的优点在于，连接图案和连接端子之间的位置对准容易，并且其间的连接可靠性高，因为形成在柔性膜上的连接图案直接连接到柔性膜的连接端子 使用连接构件的电子部件，并且由于不需要额外的重新布线，可以减少其生产成本。

公开(公告)号：US20110067913A1

公开(公告)日：2011-03-24

申请号：US12770820

申请日：2010-04-30

Applicant: Masahiro KANEKO ,  Daiki Komatsu ,  Satoru Kose ,  Hirokazu Higashi

Inventor： Masahiro KANEKO ,  Daiki Komatsu ,  Satoru Kose ,  Hirokazu Higashi

IPC: H05K1/11 ,  H01K3/10

CPC classification number: H05K3/421 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/284 ,  H05K3/328 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/016 ,  H05K2203/0361 ,  H05K2203/049 ,  H05K2203/1316 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.

Abstract translation: 印刷电路板包括具有第一表面，第一表面相对侧的第二表面和通孔导体的穿透孔的层间树脂绝缘层，形成在层间树脂绝缘层的第一表面上的导电电路 ，形成在所述贯通孔中并连接到所述层间树脂绝缘层的第一表面上的导电电路的通孔导体，以及形成在所述通孔导体的从所述层间树脂绝缘体的第二表面露出的表面上的表面处理涂层 穿透穿孔。 通孔导体由形成在穿透孔的侧壁上的第一导电层和填充穿透孔的电镀金属制成。 通孔导体的表面从层间树脂绝缘层的第二表面凹入。