公开(公告)号：US07977684B2

公开(公告)日：2011-07-12

申请号：US12860792

申请日：2010-08-20

Applicant: Jun Seok Park

Inventor： Jun Seok Park

IPC: H01L29/267

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract translation: 本发明公开了一种发光器件封装，包括：金属基底; 电路层，设置在所述金属基座的上侧，用于提供导电路径; 安装在具有比所述金属基底上的第一区域更小的厚度的第二区域中的发光器件; 绝缘层，夹在元基体和电路层之间; 设置在所述电路层的上侧的电极层; 以及用于电连接电极层和发光器件的导线。 此外，提供了一种发光器件封装，其由于将发光器件放置在金属基底的小厚度部分上而提高了发光效率。

公开(公告)号：US20240138054A1

公开(公告)日：2024-04-25

申请号：US18048155

申请日：2022-10-19

Applicant: Dell Products L.P.

Inventor： JOHN R. STUEWE ,  MICHAEL ALBERT PERKS

IPC: H05K1/02 ,  G06F11/30

CPC classification number: H05K1/0212 ,  G06F11/3058 ,  H05K2201/06

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have thermal limitations. To mitigate the impact of the thermal limitations, the data processing system may include host circuit card integrated heating assemblies. The heating assemblies may be used to warm hardware components of devices connected to the host circuit card. When connected to the host circuit card, a thermal conduction path between a device and a heating assembly may be established.

公开(公告)号：US11784115B2

公开(公告)日：2023-10-10

申请号：US17444266

申请日：2021-08-02

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Roland Wilfing

IPC: H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H05K1/0271 ,  H05K1/11 ,  H05K1/0204 ,  H05K1/0206 ,  H05K2201/041 ,  H05K2201/06 ,  H05K2201/096 ,  H05K2201/09827

Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one electrically insulating layer structure has at least partly tapering through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. In addition, different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.

公开(公告)号：US09986631B2

公开(公告)日：2018-05-29

申请号：US15081464

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Rizza ,  Agatino Minotti ,  Gaetano Montalto ,  Francesco Salamone

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07 ,  H01L23/053 ,  H01L23/08 ,  H01L23/29 ,  H01L23/31 ,  H01L23/34 ,  H01L23/367 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H05K1/11 ,  H05K3/10 ,  H05K7/14 ,  H05K13/00 ,  H01L23/24 ,  H01L23/36 ,  H01L23/473 ,  H01L23/492

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/00 ,  H05K2201/06

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

公开(公告)号：US09867292B2

公开(公告)日：2018-01-09

申请号：US15371212

申请日：2016-12-07

Applicant: HONDA MOTOR CO., LTD.

Inventor： Hironori Ujike ,  Atsushi Kurauchi

IPC: H05K7/00 ,  H05K1/18 ,  H05K5/03 ,  H05K7/20

CPC classification number: H05K1/181 ,  H05K1/0287 ,  H05K1/029 ,  H05K5/03 ,  H05K7/20409 ,  H05K7/20854 ,  H05K2201/06

Abstract: A printed wiring board includes a first outer surface, a second outer surface, and an electronic circuit. The second outer surface is opposite to the first outer surface. The electronic circuit includes at least one specific design circuit block and at least one common design circuit block. The at least one specific design circuit block is provided on the first outer surface and designed in accordance with a specification of a device to which the printed wiring board is applied. The at least one common design circuit block is for a common use regardless of the specification of the device. The at least one common design circuit block is provided on the second outer surface.

公开(公告)号：US09705059B2

公开(公告)日：2017-07-11

申请号：US15156030

申请日：2016-05-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Seok Park

IPC: H01L23/053 ,  H01L29/267 ,  H01L33/64 ,  H01L33/60 ,  H01L33/62 ,  H05K1/02 ,  H01L33/40 ,  H01L33/56 ,  H01L33/58 ,  H01L27/15 ,  H01L33/48 ,  H01L33/54 ,  F21K9/00 ,  H01L33/52 ,  H05K1/05 ,  H05K1/18 ,  H05K3/24

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.

公开(公告)号：US20170181335A1

公开(公告)日：2017-06-22

申请号：US15327107

申请日：2015-09-18

Applicant: Panasomic Intellectual Property Management Co., Ltd.

Inventor： TOMOHIKO ITOU

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H05K1/0203 ,  H05K1/181 ,  H05K9/0026 ,  H05K9/0028 ,  H05K2201/06 ,  H05K2201/10371

Abstract: A shield cover includes a cover body that is formed of a metal plate and for covering an electronic component, a leaf spring formed by cutting a part of the cover body, and a projection that is disposed on the leaf spring and projects in the thickness direction of the leaf spring.

公开(公告)号：US20170164465A1

公开(公告)日：2017-06-08

申请号：US15325550

申请日：2015-06-17

Applicant: Siemens Aktiengesellschaft

Inventor： Ruediger Knofe ,  Bernd Mueller ,  Andrey Prihodovsky

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/0212 ,  H05K1/095 ,  H05K1/11 ,  H05K1/167 ,  H05K3/30 ,  H05K3/321 ,  H05K3/325 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/06 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/1115 ,  H05K2203/165

Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

公开(公告)号：US20170094771A1

公开(公告)日：2017-03-30

申请号：US15272201

申请日：2016-09-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Koji Noguchi

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/06 ,  H05K2201/09227 ,  H05K2201/09372 ,  H05K2201/10015 ,  H05K2201/10545

Abstract: A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.

公开(公告)号：US20170064808A1

公开(公告)日：2017-03-02

申请号：US15081464

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Rizza ,  Agatino Minotti ,  Gaetano Montalto ,  Francesco Salamone

IPC: H05K1/02 ,  H05K13/00 ,  H05K3/10 ,  H05K1/11 ,  H01L23/00 ,  H01L25/18 ,  H01L23/367 ,  H01L23/492 ,  H01L23/34 ,  H01L25/00 ,  H01L23/08 ,  H01L23/053 ,  H01L23/373 ,  H01L23/31 ,  H01L23/29 ,  H05K7/14

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/00 ,  H05K2201/06

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

Abstract translation: 一种电子电源模块，包括容纳堆叠的壳体，其包括：DBC型等的第一衬底; 集成了具有一个或多个导电端子的电子部件，机电和热耦合到第一基板; 以及DBC型等的第二基板，其在第一基板上延伸并且在模具上方并且呈现面向模具的导电路径。 模具通过烧结的导热浆的第一耦合区域机械地和热耦合到第一衬底，并且电子部件的一个或多个导电端子通过机械，电和热耦合到第二衬底的导电路径，由 烧结导热浆的第二耦合区域。