公开(公告)号：US20240098912A1

公开(公告)日：2024-03-21

申请号：US18373776

申请日：2023-09-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhwan JEON ,  Kwangho Jung ,  Chihyun Cho ,  Sangwon Ha

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K5/0069 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/284 ,  H05K3/341 ,  H05K5/0086 ,  H05K2201/09372 ,  H05K2201/10007

Abstract: An electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. In the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.

公开(公告)号：US20240028134A1

公开(公告)日：2024-01-25

申请号：US18224606

申请日：2023-07-21

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： SHAN-HUI CHEN ,  PO-JUI LIN ,  CHANG-HUNG HSIEH ,  PO-CHENG HSU

IPC: G06F3/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F3/0202 ,  H05K1/18 ,  H05K1/111 ,  H05K2201/10083 ,  H05K2201/09372 ,  H05K2201/09909 ,  H05K2201/2054 ,  G06F2203/01 ,  H05K2201/10121

Abstract: A light emitting device and a keyboard structure are provided. The light emitting device includes a circuit board and multiple light emitting units. The circuit board includes a substrate, a first conductive pad, multiple second conductive pads, and multiple third conductive pads. The first conductive pad and the second conductive pads are disposed on a first board surface of the substrate. The first conductive pad has a symmetrical shape and a symmetrical axis. The symmetrical axis passes through the second conductive pads. The third conductive pads are disposed on a second board surface of the substrate. Each of the third conductive pads is electrically coupled to the first conductive pad and the second conductive pads by multiple conductive columns. Each of the light emitting units is connected to the first conductive pad and one of the second conductive pads.

公开(公告)号：US20160014898A1

公开(公告)日：2016-01-14

申请号：US14798550

申请日：2015-07-14

Applicant: IBIDEN CO., LTD.

Inventor： Takema Adachi ,  Wataru Nakamura ,  Tomoyoshi Hirabayashi

IPC: H05K1/14 ,  H05K1/09 ,  H01L23/498 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H05K1/09 ,  H05K1/185 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/09372 ,  H05K2201/10674 ,  H05K2203/054 ,  H05K2203/0723

Abstract: A printed wiring board includes a first circuit substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first circuit substrate and that the second pads are positioned to electrically connect the first circuit substrate to a second circuit substrate, and metal posts including plating material and formed on the second pads respectively such that the metal posts are positioned to mount the second circuit substrate on the first circuit substrate. Each of the metal posts has a height h1 and a thickness b such that the metal posts have a value h1/b which is greater than 0.1 and smaller than 1.0 where the value h1/b is obtained by dividing the height h1 by the thickness b.

Abstract translation: 印刷布线板包括具有第一焊盘和第二焊盘的第一电路基板，使得第一焊盘被定位成将电子部件安装在第一电路基板上，并且第二焊盘被定位成将第一电路基板电连接到第二电路 基板和包括电镀材料的金属柱并分别形成在第二焊盘上，使得金属柱被定位成将第二电路基板安装在第一电路基板上。 每个金属柱具有高度h1和厚度b，使得金属柱具有大于0.1且小于1.0的值h1 / b，其中通过将高度h1除以厚度b获得值h1 / b 。

公开(公告)号：US20150102835A1

公开(公告)日：2015-04-16

申请号：US14512105

申请日：2014-10-10

Applicant: OCE-TECHNOLOGIES B.V.

Inventor： Maikel A.J. HUYGENS ,  René J. VAN DER MEER ,  Reinier PANNEKOEK ,  Alex N. WESTLAND

IPC: B81C99/00 ,  G01R31/02 ,  G01R31/26 ,  B81C1/00 ,  H05K1/11

CPC classification number: B81C99/004 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2002/14241 ,  B41J2002/14459 ,  B41J2002/14491 ,  B81B7/007 ,  B81B2201/052 ,  B81B2207/03 ,  B81C1/00301 ,  G01R31/02 ,  G01R31/2601 ,  H05K1/0268 ,  H05K1/111 ,  H05K2201/09372

Abstract: A substrate plate is provided for at least one MEMS device to be mounted thereon. The MEMS device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the MEMS device. The pattern forms contact pads within the footprint of the MEMS device and includes at least one lead structure that extends on the substrate plate outside of the footprint of the MEMS device and connects a number of the contact pads to an extra contact pad. The lead structure is a shunt bar that interconnects a plurality of contact pads of the MEMS device and is arranged to be removed by means of a dicing cut separating the substrate plate into a plurality of chip-sized units. At least a major part of the extra contact pad is formed within the footprint of one of the MEMS devices.

Abstract translation: 为安装在其上的至少一个MEMS装置提供基板。 MEMS器件在衬底板上具有一定的占地面积，并且衬底板具有连接到MEMS器件的电气部件的导电引线的图案。 该图案形成MEMS器件的覆盖区内的接触焊盘，并且包括至少一个引线结构，该引线结构在MEMS器件的覆盖区外部的衬底板上延伸，并将多个接触焊盘连接到额外的接触焊盘。 引线结构是将MEMS器件的多个接触焊盘互连的分流棒，并且被布置成通过将衬底板分成多个芯片尺寸的单元的切割切割来去除。 额外接触焊盘的至少主要部分形成在MEMS器件之一的覆盖区内。

公开(公告)号：US11895776B2

公开(公告)日：2024-02-06

申请号：US17278782

申请日：2019-09-20

Applicant: Proterial, Ltd.

Inventor： Takahiro Umeyama

IPC: H05K1/18 ,  G01L9/00 ,  G01L9/04 ,  G01L19/14 ,  G05D7/06 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/189 ,  G01L9/0041 ,  G01L9/04 ,  G01L19/141 ,  G05D7/06 ,  H05K1/115 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/09372 ,  H05K2201/09836 ,  H05K2201/10151

Abstract: In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

公开(公告)号：US20230300987A1

公开(公告)日：2023-09-21

申请号：US18175898

申请日：2023-02-28

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Masahiro KYOZUKA

IPC: H05K3/00 ,  H05K1/05

CPC classification number: H05K3/0011 ,  H05K1/05 ,  H05K2201/10204 ,  H05K2201/093 ,  H05K2201/09372

Abstract: A wiring board includes a first insulating layer, a pad formed on one surface of the first insulating layer, a second insulating layer, formed on the one surface of the first insulating layer, and including an opening exposing the pad, and a reinforcing metal layer formed in contact with the first insulating layer, and provided around the pad so as to be separated from the pad in a plan view. The pad is disposed inside the opening without making contact with the second insulating layer. An end, on a side of the first insulating layer, in a portion of an inner side surface of the opening of the second insulating layer makes contact with the reinforcing metal layer, and an end in another portion of the inner side surface of the opening of the second insulating layer makes contact with the one surface of the first insulating layer.

公开(公告)号：US20190207327A1

公开(公告)日：2019-07-04

申请号：US16233310

申请日：2018-12-27

Applicant: Tyco Electronics (Shanghai) Co. Ltd. ,  TE Connectivity Corporation

Inventor： Liang Huang ,  Bruce Allen Champion

IPC: H01R4/02 ,  H01R12/52 ,  H01R12/70 ,  H05K1/11 ,  H05K3/34 ,  H01R13/50 ,  H01R13/502

CPC classification number: H01R4/02 ,  H01R12/52 ,  H01R12/7082 ,  H01R13/50 ,  H01R13/502 ,  H05K1/11 ,  H05K3/34 ,  H05K2201/09372

Abstract: A circuit board comprises a row of solder pads adapted to be soldered to a row of contacts of a connector, a plurality of first conductive vias, and a plurality of second conductive vias. The contacts include a plurality of ground contacts and a plurality of signal contacts. The solder pads include a plurality of ground solder pads each soldered to a solder foot of one of the ground contacts and a plurality of signal solder pads each soldered to a solder foot of one of the signal contacts. The first conductive vias correspond to and are electrically connected to the ground solder pads and are electrically connected to each other by a first connection bar. The second conductive vias correspond to and are electrically connected to the ground solder pads and are electrically connected to each other by a second connection bar. The solder foot of each of the ground contacts is disposed between one of the first conductive vias and one of the second conductive vias.

公开(公告)号：US20180242462A1

公开(公告)日：2018-08-23

申请号：US15897560

申请日：2018-02-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Kunihiko Minegishi ,  Mitsutoshi Hasegawa ,  Takashi Sakaki

IPC: H05K3/34 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09372 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1305

Abstract: An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.

公开(公告)号：US20180139852A1

公开(公告)日：2018-05-17

申请号：US15351066

申请日：2016-11-14

Applicant: International Business Machines Corporation

Inventor： Bruce J. CHAMBERLIN ,  Scott B. KING ,  Joseph KUCZYNSKI ,  David J. RUSSELL

IPC: H05K3/40 ,  H05K3/22 ,  H05K3/46 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K3/4076 ,  H05K1/09 ,  H05K1/116 ,  H05K3/002 ,  H05K3/0038 ,  H05K3/0047 ,  H05K3/22 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/09372 ,  H05K2201/095 ,  H05K2201/09581 ,  H05K2203/0723 ,  H05K2203/0793 ,  H05K2203/10 ,  H05K2203/11 ,  H05K2203/1184

Abstract: In some embodiments, methods include drilling one or a plurality of PTHs with any industrial grade drill to fabricate holes with positive etch back, flooding the PTHs with a dilute solution of an acrylate monomer/oligomer containing an appropriate level of peroxide initiator, polymerizing the acrylate, and then rising the PTHs with the solvent used in the formulation of the acrylate material. In one embodiment, the printed circuit board may include a substrate comprising a plurality of metal layers separated by a plurality of insulating layers; a plurality of plated through holes formed in the substrate, each plated through hole comprising: recesses formed at each insulating layer, copper lands between the recesses, a polymer coating in each recess, and a metal layer lining the plated through hole.

公开(公告)号：US20240196538A1

公开(公告)日：2024-06-13

申请号：US18522664

申请日：2023-11-29

Applicant: TDK Corporation

Inventor： Akihiro MASUDA ,  Katsuya MIURA ,  Natsuki KUMAGAI

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/183 ,  H05K1/0203 ,  H05K2201/09372 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: An electronic device comprises chip components aligned along a predetermined first direction and including respective terminal electrodes, and a metal block including an electrode-opposing surface and a mounting surface. The electrode-opposing surface is opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction. The mounting surface is substantially perpendicular to the electrode-opposing surface and is substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.