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    DC-DC converter module and multi-layer substrate
    31.
    发明授权
    DC-DC converter module and multi-layer substrate 有权
    DC-DC转换器模块和多层基板

    公开(公告)号：US09320134B2

    公开(公告)日：2016-04-19

    申请号：US13792472

    申请日：2013-03-11

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Tomoyoshi Hiei

    IPC: B23K11/24 ,  H05K1/02 ,  H02M3/158 ,  H05K1/16 ,  H02M3/04 ,  H02M1/44 ,  H01F37/00

    CPC classification number: H05K1/0233 ,  H01F37/005 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/15313 ,  H01L2924/19105 ,  H02M1/44 ,  H02M3/04 ,  H02M3/158 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/10015 ,  Y10T307/74

    Abstract: A DC-DC converter module includes a multi-layer substrate, a switching IC, and a coil. The multi-layer substrate includes component mounting electrodes provided on the top surface and an input terminal, an output terminal, and ground terminals provided on the bottom surface. The switching IC switches an input voltage and includes an input electrode, an output electrode, and a ground electrode, and is mounted on the top surface of the substrate by connecting the electrodes to the component mounting electrodes. The coil is arranged within the multi-layer substrate in a spiral shape with an axis extending in the substrate stacking direction. The bottom surface side end of the coil is connected to the input/output electrode of the switching IC.

    Abstract translation: DC-DC转换器模块包括多层基板，开关IC和线圈。 多层基板包括设置在顶表面上的部件安装电极和设置在底表面上的输入端子，输出端子和接地端子。 开关IC切换输入电压并且包括输入电极，输出电极和接地电极，并且通过将电极连接到部件安装电极而安装在基板的顶表面上。 线圈被布置在多层基板内，螺旋形状具有在基板堆叠方向上延伸的轴线。 线圈的底面侧端部与开关IC的输入输出电极连接。

    EMBEDDED MAGNETIC COMPONENTS AND METHODS
    32.
    发明申请
    EMBEDDED MAGNETIC COMPONENTS AND METHODS 有权
    嵌入式磁性元件和方法

    公开(公告)号：US20160086709A1

    公开(公告)日：2016-03-24

    申请号：US14963579

    申请日：2015-12-09

    Applicant: Radial Electronics, Inc.

    Inventor： James E. Quilici

    IPC: H01F17/00 ,  H01F17/06

    CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F27/027 ,  H01F41/02 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/042 ,  H01F41/064 ,  H01F2027/2814 ,  H05K1/0284 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/045 ,  H05K3/4611 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/2036 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T156/10

    Abstract: Disclosed are apparatus and methods for a magnetic component. In accordance with an embodiment, a magnetic component comprises a base substrate defining a winding cup having a shape of a closed groove surrounding a hub. The winding cup defines a core space operable to receive a core therein. A first conductive pattern is disposed on at least a portion of the base substrate including the winding cup. A second substrate defines a second conductive pattern. The second substrate is coupled to the first base surface with the first conductive pattern in operable alignment with the second conductive pattern. The first and second conductive patterns are coupled in electrical communication so as to define one or more winding-type electric circuits surrounding the core space so as to induce a magnetic flux within the core space when the one or more electric circuits are energized by a voltage source.

    Abstract translation: 公开了用于磁性部件的装置和方法。 根据一个实施例，磁性部件包括限定具有围绕轮毂的封闭凹槽的形状的绕线杯的基底基板。 绕组杯限定了可操作以在其中容纳芯的芯空间。 第一导电图案设置在包括卷绕杯的基底基板的至少一部分上。 第二衬底限定第二导电图案。 第二衬底被耦合到第一基底表面，其中第一导电图案与第二导电图案可操作地对准。 第一和第二导电图案电连接地耦合，以便限定一个或多个围绕磁芯空间的绕组电路，以便当一个或多个电路通过电压激励时，在磁芯空间内引起磁通量 资源。

    Planar electronic device having a magnetic component
    36.
    发明授权
    Planar electronic device having a magnetic component 有权
    具有磁性部件的平面电子器件

    公开(公告)号：US09113570B2

    公开(公告)日：2015-08-18

    申请号：US13665517

    申请日：2012-10-31

    Applicant: TYCO ELECTRONICS SERVICES GMBH

    Inventor： Haiying Li ,  Sidharth Dalmia ,  Mark McGrath

    IPC: H05K1/16 ,  H01F17/06

    CPC classification number: H05K1/165 ,  H01F17/062 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2203/1178

    Abstract: A planar electronic device includes a dielectric substrate having a recess. A functional electrical component is disposed within the recess of the substrate. A vent opening extends within the substrate such that the vent opening intersects the recess within a thickness of the substrate. The vent opening is open to atmosphere such that the vent opening fluidly connects the recess to the atmosphere.

    Abstract translation: 平面电子器件包括具有凹陷的电介质基片。 功能性电气部件设置在基板的凹部内。 通气孔在基底内延伸，使得通气口与衬底的厚度内的凹槽相交。 通风口对大气开放，使排气口与凹槽大气连通。

    Magnetic element having improved transformers and common mode chokes
    37.
    发明授权
    Magnetic element having improved transformers and common mode chokes 有权
    具有改进的变压器和共模扼流圈的磁性元件

    公开(公告)号：US09101071B2

    公开(公告)日：2015-08-04

    申请号：US12951099

    申请日：2010-11-22

    Applicant: Li-Chun Wu ,  Yong-Chun Xu ,  Chao-Tung Huang ,  Chih-Min Lin ,  Jian-She Hu ,  Kuo-Chuan Huang

    Inventor： Li-Chun Wu ,  Yong-Chun Xu ,  Chao-Tung Huang ,  Chih-Min Lin ,  Jian-She Hu ,  Kuo-Chuan Huang

    IPC: H01F27/28 ,  H05K1/16 ,  H01R12/52 ,  H01R13/66 ,  H05K1/18

    CPC classification number: H05K1/165 ,  H01F27/28 ,  H01F27/2804 ,  H01R12/526 ,  H01R13/6633 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/1003 ,  H05K2201/1034 ,  Y10T29/4913

    Abstract: A magnetic element (100) includes a board unit (2) including a paddle board (21) having a row of first conductive vias (251) and a row of second conductive vias (252) for insertion of terminals (3), a number of embedded magnetic components (22), and a number of SMDs (surface mount devices) (23) mounted on the paddle board by SMT (surface mount technology). Each embedded magnetic component includes a magnetic core (221) embedded in the paddle board, and a number of PCB (printed circuit board) layout traces (222) disposed in the paddle board. Each PCB layout trace includes a first PCB layout trace (222a) encircling around the magnetic core and connecting with the first conductive via, and a second PCB layout trace (222b) encircling around the magnetic core and connecting with the SMD.

    Abstract translation: 磁性元件（100）包括板单元（2），其包括具有一列第一导电通孔（251）和用于插入端子（3）的一排第二导电通孔（252）的桨板（21） 的嵌入式磁性部件（22）和通过SMT（表面贴装技术）安装在桨板上的多个SMD（表面安装装置）（23）。 每个嵌入式磁性部件包括嵌入在该桨板中的磁芯（221）和布置在该桨板中的多个PCB（印刷电路板）布局轨迹（222）。 每个PCB布局迹线包括环绕磁芯并与第一导电通孔连接的第一PCB布局迹线（222a）和环绕磁芯并与SMD连接的第二PCB布局迹线（222b）。

    PRINTED CIRCUIT BOARD ASSEMBLY METHODS
    40.
    发明申请
    PRINTED CIRCUIT BOARD ASSEMBLY METHODS 有权
    印刷电路板组装方法

    公开(公告)号：US20150090390A1

    公开(公告)日：2015-04-02

    申请号：US14504208

    申请日：2014-10-01

    Applicant: Norman L. Call ,  Jose M. Chavez ,  Rodolfo Chavez

    Inventor： Norman L. Call ,  Jose M. Chavez ,  Rodolfo Chavez

    IPC: H05K3/30 ,  H05K13/04

    CPC classification number: H05K3/30 ,  H05K3/007 ,  H05K13/04 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53265 ,  Y10T156/10

    Abstract: A method includes aligning a first portion of a magnetic core with respect to a first side of a PCB using a first alignment device. The method includes applying a first bonding material to a surface of at least one of the first portion of the magnetic core and a second portion of the magnetic core. The method further includes coupling a second alignment device that retains the second portion of the magnetic core to the first alignment device. When the first alignment device and the second alignment device are coupled, the first portion and the second portion of the magnetic core are retained in a specified assembly position. The specified assembly position includes a specified gap between the first portion and the second portion of the magnetic core. The method also includes curing the first bonding material.

    Abstract translation: 一种方法包括使用第一对准装置将磁芯的第一部分相对于PCB的第一侧对准。 该方法包括将第一接合材料施加到磁芯的第一部分和磁芯的第二部分中的至少一个的表面上。 该方法还包括将保持磁芯的第二部分的第二对准装置耦合到第一对准装置。 当第一对准装置和第二对准装置联接时，磁芯的第一部分和第二部分保持在指定的组装位置。 指定的组装位置包括在磁芯的第一部分和第二部分之间的指定间隙。 该方法还包括固化第一接合材料。

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