公开(公告)号：US20110155421A1

公开(公告)日：2011-06-30

申请号：US12929902

申请日：2011-02-23

Applicant: Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

Inventor： Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

IPC: H05K1/00

CPC classification number: H05K1/0269 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/0969 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53022 ,  Y10T29/53026 ,  Y10T29/5303 ,  Y10T29/53035 ,  Y10T29/53039 ,  Y10T29/53043

Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.

公开(公告)号：US07943860B2

公开(公告)日：2011-05-17

申请号：US11663699

申请日：2005-08-09

Applicant: Seitaro Mizuhara

Inventor： Seitaro Mizuhara

IPC: H05K1/11

CPC classification number: H01L25/162 ,  H01L21/4853 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/305 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/1034 ,  H05K2203/0169 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/49149 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections 1 on each of which an electronic component 2 is mounted and a metallic terminal plate 3 for external connection is bonded so as to project from the hybrid circuit board section. A frame portion 6 is defined between the hybrid circuit board sections, and the hybrid circuit board sections are integrally connected to the frame portion via a thin strip 8 provided at an intermediate portion of grooves 7 each surrounding a respective one of the hybrid circuit board sections entirely. In bonding the terminal plate 3 to the hybrid circuit board by soldering, the terminal plate is temporarily bonded to the frame portion 6 with an adhesive 9. The adhesive is prevented from spreading toward the end of the terminal plate. A hole or a recess 10 is formed in the frame portion 6 at a region with which the terminal plate 3 is to overlap and which is closer to an end of the terminal plate than a portion to which the adhesive 9 for temporarily bonding the terminal plate to the frame portion is to be applied is.

Abstract translation: 用于制造混合电路板的材料板包括多个混合电路板部分1，每个混合电路板部分1安装有电子部件2，并且用于外部连接的金属端子板3从混合电路板部分突出。 框架部分6限定在混合电路板部分之间，并且混合电路板部分经由设置在凹槽7的中间部分处的细条8一体地连接到框架部分，每个沟槽7围绕相应的一个混合电路板部分 完全。 在通过焊接将端子板3接合到混合电路板上时，端子板用粘合剂9暂时地接合到框架部分6.防止粘合剂向端子板的端部扩散。 在端子板3重叠的区域处，在框架部6中形成有孔或凹部10，并且比将端子板临时接合的粘合剂9更靠近端子板的端部 要施加到框架部分。

公开(公告)号：US20110069465A1

公开(公告)日：2011-03-24

申请号：US12579423

申请日：2009-10-15

Applicant: Ming-Chih HSIEH

Inventor： Ming-Chih HSIEH

IPC: H05K1/11

CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A printed circuit board (PCB) assembly includes two function boards which can be separated from each other. The PCB assembly can satisfy electronic devices of different dimensions, by arranging the separated function boards in appropriate available space in the electronic devices.

Abstract translation: 印刷电路板（PCB）组件包括彼此分离的两个功能板。 PCB组件可以通过将分离的功能板布置在电子设备中的适当可用空间中来满足不同尺寸的电子设备。

公开(公告)号：US07866562B2

公开(公告)日：2011-01-11

申请号：US11770661

申请日：2007-06-28

Applicant: Siew Sin Hiew ,  Nan Nan ,  Abraham Chih-Kang Ma ,  Jim Chin-Nan Ni

Inventor： Siew Sin Hiew ,  Nan Nan ,  Abraham Chih-Kang Ma ,  Jim Chin-Nan Ni

IPC: G06K19/06

CPC classification number: G06K19/07724 ,  G06K19/077 ,  G06K19/07732 ,  G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10159 ,  H05K2201/10446 ,  H05K2203/1316 ,  Y10T29/49155 ,  H01L2924/00

Abstract: In an embodiment of the present invention, a memory card includes a bottom plastic piece having a plurality of lateral sides, one of which includes a notch, and a cavity interposed along the lateral sides. A printed circuit board (PCB) assembly, including memory, is positioned in the cavity. A fin-structure is created as part of the manufacturing process of the bottom plastic piece of the card. The memory card is configured to function in a read-write mode when the fin-structure is present, and in a write-protect mode when the fins are snapped off, and the notch is exposed. Alternatively, a plug device can be insertably positioned into the notch, causing the memory card to function in a read-write mode when the plug device is positioned into the notch, and in a write-protect mode when the plug device is removed and the notch is exposed.

Abstract translation: 在本发明的一个实施例中，存储卡包括底部塑料片，其具有多个横向侧面，其中一个包括凹口，以及沿横向插入的空腔。 包括存储器的印刷电路板（PCB）组件位于空腔中。 作为卡的底部塑料件的制造过程的一部分，形成翅片结构。 当存在鳍结构时，存储卡被配置为以读写模式工作，并且当散热片被卡扣并且凹口暴露时以写保护模式工作。 或者，插头装置可插入凹口中，当插头装置位于凹口中时，存储卡以读写模式工作，并且当插头装置被移除时以写保护模式 缺口暴露。

公开(公告)号：US20100307311A1

公开(公告)日：2010-12-09

申请号：US12479880

申请日：2009-06-08

Applicant: KUO-CHUNG WANG

Inventor： KUO-CHUNG WANG

IPC: B26D7/26

CPC classification number: B26D7/2614 ,  B26D7/18 ,  B26D2007/2607 ,  B26F1/40 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T83/929

Abstract: A PCB cutter module is disclosed to include a base panel having locating grooves arranged on one side thereof subject to a predetermined layout and mounting through holes arranged along the border, fastening members mounted in the mounting through holes for fastening the base panel to a worktable, positioning devices, for example, permanent magnets or electromagnets mounted in the locating grooves for detachably securing cutters at the base panel for cutting a workpiece, for example, PC board, and supplementary holder blocks selectively attached to the cutters to hold a respective alignment rod for securing the PC board in position for cutting by the cutters accurately.

Abstract translation: 公开了一种PCB切割器模块，其包括基板，该基板具有布置在其一侧上的预定布局的定位槽，并且通过沿边框布置的孔安装，紧固构件安装在安装通孔中，用于将基板紧固到工作台上， 定位装置，例如安装在定位槽中的永磁体或电磁铁，用于可拆卸地将切割器固定在基板上用于切割工件，例如PC板，以及辅助保持器块，其选择性地附接到切割器以保持相应的对准杆， 将PC板固定在适当位置，以便切割机精确切割。

公开(公告)号：US07795714B2

公开(公告)日：2010-09-14

申请号：US11744125

申请日：2007-05-03

Applicant: Siew Sin Hiew ,  Nan Nan ,  Abraham Chih-Kang Ma ,  Paul Hsueh

Inventor： Siew Sin Hiew ,  Nan Nan ,  Abraham Chih-Kang Ma ,  Paul Hsueh

IPC: H01L23/02 ,  H05K1/14 ,  G06K19/06

CPC classification number: G06K19/077 ,  G06K19/07724 ,  G06K19/07732 ,  G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  Y10T29/49002 ,  H01L2924/00014

Abstract: A molded secured digital (SD) card having a bottom plastic piece having a plurality of lateral sides, said bottom plastic piece further having a cavity interposed along said plurality of lateral sides, in accordance with an embodiment of the present invention. The molded SD card further having a printed circuit board (PCB) assembly positioned in said cavity, one of said plurality of lateral sides of said bottom plastic piece having a notch recess, said molded SD card further having a male guide insertably positioned into said notch recess, said molded SD card further having a female switch clamped onto said male guide to form a write-protect switch.

Abstract translation: 根据本发明的实施例，一种具有多个侧面的底部塑料片的模制的固定数字（SD）卡，所述底部塑料件还具有沿所述多个侧面插入的空腔。 所述模制SD卡还具有位于所述空腔中的印刷电路板（PCB）组件，所述底部塑料件的所述多个横向侧中的一个具有凹口凹槽，所述模制的SD卡还具有可插入地定位在所述凹口中的阳导向件 所述模制的SD卡还具有夹在所述阳引导件上的母开关以形成写保护开关。

公开(公告)号：US20100175913A1

公开(公告)日：2010-07-15

申请号：US12654101

申请日：2009-12-10

Applicant: Saori Ishigaki

Inventor： Saori Ishigaki

IPC: H05K1/03

CPC classification number: H05K1/0269 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/225 ,  H05K3/28 ,  H05K2201/0909 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/0989 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133

Abstract: A wired-circuit-board assembly sheet includes a plurality of wired circuit boards and a supporting sheet for supporting the wired circuit boards in an aligned state. Each of the wired circuit boards includes a distinguishing mark forming portion to be formed with a distinguishing mark for distinguishing between defectiveness and non-defectiveness of the wired circuit board. The distinguishing mark forming portion is divided by a weir portion for preventing the distinguishing mark from flowing out from the distinguishing mark forming portion.

Abstract translation: 布线电路板组装片包括多个布线电路板和用于支撑处于对准状态的布线电路板的支撑片。 每个布线电路板包括一个区别标记形成部分，形成有用于区分布线电路板的缺陷性和非缺陷性的区别标记。 识别标记形成部分被堰部分除以防止区分标记从区分标记形成部分流出。

公开(公告)号：US20100089631A1

公开(公告)日：2010-04-15

申请号：US12573256

申请日：2009-10-05

Applicant: Hideaki Sakaguchi ,  Akinori Shiraishi

Inventor： Hideaki Sakaguchi ,  Akinori Shiraishi

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/0052 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15788 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2203/0191 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board, includes a substrate main body; a piercing electrode configured to pierce the substrate main body; a first wiring pattern provided at a first surface side of the substrate main body, the first wiring pattern having a pad, the pad being electrically connected to one end part of the piercing electrode, the pad being where an electronic component is mounted; and a second wiring pattern provided at a second surface side of the substrate main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an outside connection pad, the outside connection pad being electrically connected to another end part of the piercing electrode.

Abstract translation: 一种布线板，包括：基板主体; 穿孔电极，其构造成刺穿所述基板主体; 设置在所述基板主体的第一表面侧的第一布线图案，所述第一布线图案具有焊盘，所述焊盘与所述穿孔电极的一个端部电连接，所述焊盘是安装有电子部件的位置; 以及设置在所述基板主体的第二表面侧的第二布线图案，所述第二表面侧位于与所述第一表面侧相反的一侧，所述第二布线图案具有外部连接垫，所述外部连接垫电连接 到穿刺电极的另一端部。

公开(公告)号：US20100020518A1

公开(公告)日：2010-01-28

申请号：US12220757

申请日：2008-07-28

Applicant: Ulysses T. Bustamante

Inventor： Ulysses T. Bustamante

IPC: H05K9/00 ,  H01L21/50

CPC classification number: H01L23/3121 ,  H01L23/49805 ,  H01L23/552 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A packaging for semiconductor modules such as multi chip modules (MCM). At least one via is created on saw street region of a substrate having circuit components. The substrate is transfer molded and the transfer molded substrate is partially singulated from a first surface along with the via to create a groove. The partially singulated substrate including the groove on the saw street region and the via is coated or plated with a conducting material for RF shielding. Accordingly, the conducting material and a ground terminal of the substrate are connected through the via on the substrate.

Abstract translation: 用于诸如多芯片模块（MCM）的半导体模块的封装。 在具有电路部件的基板的锯齿区域上形成至少一个通孔。 衬底被传递模制，并且传输模制衬底与通孔一起从第一表面部分地单独化以产生凹槽。 包括在锯街区域上的槽和通孔的部分分割的衬底被涂覆或镀有用于RF屏蔽的导电材料。 因此，基板的导电材料和接地端子通过基板上的通孔连接。

公开(公告)号：US20090294156A1

公开(公告)日：2009-12-03

申请号：US12473609

申请日：2009-05-28

Applicant: Seigo UENO ,  Toshiya Asano

Inventor： Seigo UENO ,  Toshiya Asano

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K3/0052 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/007 ,  H05K3/4644 ,  H05K2201/0909 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/016 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.

Abstract translation: 中间多层布线板产品包括：多个树脂绝缘层，第一导体层和第二导体层的叠层。 堆叠包括：产品形成区域，包括沿着堆叠的主表面布置的多个产品部分，多个产品部分中的每一个成为多层布线板的产品; 以及围绕产品形成区域的框架部分。 第一导体层形成在多个产品部分的每一个内的多个树脂绝缘层中的至少一个上。 第二导体层形成在框架部分内的多个树脂绝缘层中的至少一个上。 框架部分具有在其厚度方向上穿透框架部分的多个切口，多个切口以基本相等的间隔布置。