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    ECOLOGICAL METHOD FOR CONSTRUCTING CIRCUIT BOARDS
    32.
    发明申请
    ECOLOGICAL METHOD FOR CONSTRUCTING CIRCUIT BOARDS 有权
    用于构造电路板的生态方法

    公开(公告)号：US20150096788A1

    公开(公告)日：2015-04-09

    申请号：US14047323

    申请日：2013-10-07

    Applicant: The Boeing Company

    Inventor： Donald F. Wilkins

    IPC: H05K3/46 ,  H05K1/02

    CPC classification number: H05K3/4673 ,  B29C35/0261 ,  B29C70/882 ,  B29K2995/0005 ,  H05K1/0298 ,  H05K1/092 ,  H05K3/0005 ,  H05K3/101 ,  H05K3/4644 ,  H05K3/4676 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/532

    Abstract: A method for fabrication of a circuit board using the disclosed embodiments relies on a CAD model of a multilayer circuit board with conductive elements defined by layer. A first granular conductive material layer is introduced into a mold. A fusion process element traverses across the mold to fuse selected portions of the first granular conductive material layer forming first layer conductive elements. An additional granular conductive material layer is introduced into the mold over the fused selected portions of the first layer and unfused portions of the first layer. The fusion process element is then traversed across the mold to fuse selected portions of the additional granular conductive material layer forming an additional layer of conductive elements. Unfused granular conductive material is then purged from the fused first conductive elements and additional conductive layer elements. A dielectric material is then infused into a structure formed by the fused first conductive elements and additional conductive layer elements.

    Abstract translation: 使用所公开的实施例的用于制造电路板的方法依赖于具有由层限定的导电元件的多层电路板的CAD模型。 将第一粒状导电材料层引入模具中。 融合过程元件穿过模具以熔合形成第一层导电元件的第一粒状导电材料层的选定部分。 在第一层的熔融选定部分和第一层的未熔合部分之后，将另外的粒状导电材料层引入模具中。 然后将融合过程元件穿过模具以熔合另外的颗粒状导电材料层的选定部分，形成附加的导电元件层。 然后从熔融的第一导电元件和附加的导电层元件清除未填充的颗粒状导电材料。 然后将电介质材料注入由熔融的第一导电元件和附加导电层元件形成的结构中。

    Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
    34.
    发明授权
    Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material 有权
    由树脂组合物得到的树脂组合物，成型体和基材，以及包含基板材料的电路基板

    公开(公告)号：US08921458B2

    公开(公告)日：2014-12-30

    申请号：US13816644

    申请日：2010-08-26

    Applicant: Kenji Miyata ,  Toshitaka Yamagata

    Inventor： Kenji Miyata ,  Toshitaka Yamagata

    IPC: C08K3/38 ,  C08G59/24 ,  C08L63/00 ,  H05K1/03 ,  H05K3/02

    CPC classification number: C08K3/38 ,  C08G59/245 ,  C08L63/00 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/09118

    Abstract: To provide a resin composition having excellent thermal conductivity and excellent insulation reliability, a molded object, a substrate material, and a circuit board. [Solution] Provided is a resin composition which comprises an epoxy resin, a hardener, and an inorganic filler, wherein the epoxy resin and/or the hardener has a naphthalene structure, the inorganic filler comprises hexagonal boron nitride, and the inorganic filler accounts for 50-85 vol. % of the whole resin composition. Since a naphthalene structure, which imparts the satisfactory ability to wet the hexagonal boron nitride included in the inorganic filler, has been introduced into the epoxy resin and/or the hardener to heighten the inorganic-filler loading characteristics, this resin composition attains excellent heat dissipation properties, heat resistance, insulating properties, etc.

    Abstract translation: 为了提供具有优异的导热性和优异的绝缘可靠性的树脂组合物，模制物体，基底材料和电路板。 [解决方案]提供一种树脂组合物，其包含环氧树脂，硬化剂和无机填料，其中环氧树脂和/或硬化剂具有萘结构，无机填料包括六方氮化硼，无机填料占 50-85卷 ％的整个树脂组合物。 由于赋予无机填料中包含的六方氮化硼润湿性良好的萘结构，因此已经引入到环氧树脂和/或硬化剂中以提高无机填料的负载特性，因此该树脂组合物具有优异的散热性 性能，耐热性，绝缘性能等

    AROMATIC POLYCARBONATE COMPOSITION
    38.
    发明申请
    AROMATIC POLYCARBONATE COMPOSITION 审中-公开
    芳香族聚碳酸酯组合物

    公开(公告)号：US20140248564A1

    公开(公告)日：2014-09-04

    申请号：US14273796

    申请日：2014-05-09

    Applicant: MITSUBISHI CHEMICAL EUROPE GMBH

    Inventor： Bernardus Antonius Gerardus SCHRAUWEN

    IPC: H01B1/22 ,  G03F7/20

    CPC classification number: H01B1/22 ,  B41M5/267 ,  C08K3/22 ,  C08K5/42 ,  C08L51/04 ,  C08L55/02 ,  C08L69/00 ,  G03F7/20 ,  H05K1/0326 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/09118 ,  Y10T29/49155

    Abstract: The present invention relates to a polymer composition comprising the following components: a) 76,6-99,9 mass % of aromatic polycarbonate, b) 0,5-20 mass % of laser direct structuring additive, c) 0-2,4 mass % of rubber like polymer, and d) 0,01-1 mass % of acid and/or acid salt wherein the mass % is calculated relative to the sum of a), b), c) and d). The invention also relates to a moulded part containing this composition, to a circuit carrier containing such moulded part and to a process for producing such circuit carrier.

    Abstract translation: 本发明涉及包含以下组分的聚合物组合物：a）76,6-99.9质量％的芳族聚碳酸酯，b）0.5-20质量％的激光直接结构化添加剂，c）0-2,4 橡胶状聚合物的质量％，以及d）0.01-1质量％的酸和/或酸盐，其中相对于a），b），c）和d）的总和计算质量％。 本发明还涉及包含该组合物的成型部件，包含这种模制部件的电路载体以及用于制造这种电路载体的方法。

    MOUNTING STRUCTURE OF CHIP COMPONENT AND ELECTRONIC MODULE USING THE SAME
    39.
    发明申请
    MOUNTING STRUCTURE OF CHIP COMPONENT AND ELECTRONIC MODULE USING THE SAME 有权
    使用它的芯片组件和电子模块的安装结构

    公开(公告)号：US20140153196A1

    公开(公告)日：2014-06-05

    申请号：US14091056

    申请日：2013-11-26

    Applicant: TDK Corporation

    Inventor： Shuichi Takizawa ,  Kenichi Kawabata

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09118 ,  H05K2201/099 ,  Y02P70/611

    Abstract: An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.

    Abstract translation: 电子模块设置有电路板2，表面安装在电路板2上的芯片部件3和密封芯片部件3的模具部件4.电路板2包括焊盘7和抗蚀剂图案8A，其部分地 芯片部件3具有底部电极6b和侧面电极6c。 抗蚀剂图案8A在平面图中具有与芯片部件3的底部电极6b重叠的重叠部分。 至少在抗蚀剂图案8A和第一焊料部分10a之间的第一间隙D1中填充模具构件4的一部分。

    THREE-DIMENSIONAL CIRCUIT COMPONENT, METHOD OF MAKING THE SAME, AND PHYSICAL-QUANTITY MEASURING INSTRUMENT
    40.
    发明申请
    THREE-DIMENSIONAL CIRCUIT COMPONENT, METHOD OF MAKING THE SAME, AND PHYSICAL-QUANTITY MEASURING INSTRUMENT 有权
    三维电路组件及其制造方法和物理量测量仪器

    公开(公告)号：US20140022735A1

    公开(公告)日：2014-01-23

    申请号：US13941630

    申请日：2013-07-15

    Applicant: Nagano Keiki Co., Ltd.

    Inventor： Nobutaka Yamagishi ,  Naoki Yamashita ,  Atsushi Imai

    IPC: H05K1/16 ,  H05K3/34

    CPC classification number: H05K1/16 ,  H05K1/0284 ,  H05K3/34 ,  H05K3/3442 ,  H05K2201/09118 ,  H05K2201/0999 ,  Y10T29/49144

    Abstract: For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.

    Abstract translation: 为了制造三维电路部件，将电子部件安装在合成树脂块上。 用于建立与电子部件的电连接的多个导电图案沿块的三维形状形成在块上。 每个导电图案的端部设置有焊料放置部分。 在焊料设置部分和电子部件的相对表面之间设置焊料。 除了焊料设置部分之外的每个导电图案的部分和安装电子部件的部分内部形成在块中。 由于除了安装电子部件的部分之外的每个导电图案的部分内部形成在块中，所以导电图案不会被不必要地暴露。

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