公开(公告)号：US20140009898A1

公开(公告)日：2014-01-09

申请号：US14010631

申请日：2013-08-27

Applicant: Fujikura Ltd

Inventor： Satoshi YAMAMOTO

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/1461 ,  H05K1/0272 ,  H05K1/115 ,  H05K3/002 ,  H05K3/101 ,  H05K2201/0784 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

Abstract: An interposer substrate of the invention includes: a single substrate having a first main surface and a second main surface; a plurality of through-hole interconnections having at least a first portion formed so as to extend in a direction different from the thickness direction of the substrate, a second portion constituting one of end portions of a through-hole interconnection, and a third portion constituting the other of the end portions of the through-hole interconnection, the through-hole interconnections being provided inside the substrate so as to connect the first main surface to the second main surface, wherein the second portion is substantially perpendicular to the first main surface and is exposed to the first main surface, the third portion is substantially perpendicular to the second main surface and is exposed to the second main surface, and lengths of the through-hole interconnections are the same as each other.

Abstract translation: 本发明的内插衬底包括：具有第一主表面和第二主表面的单个衬底; 多个通孔互连，其至少具有第一部分，所述第一部分形成为沿着与所述基板的厚度方向不同的方向延伸，第二部分构成通孔互连的端部中的一个，以及构成 通孔互连的另一个端部，通孔互连设置在基板内部，以将第一主表面连接到第二主表面，其中第二部分基本上垂直于第一主表面，并且 暴露于第一主表面，第三部分基本上垂直于第二主表面并且暴露于第二主表面，并且通孔互连的长度彼此相同。

公开(公告)号：US08618423B2

公开(公告)日：2013-12-31

申请号：US12056854

申请日：2008-03-27

Applicant: Hirotoshi Ozaki ,  Akiko Morimoto ,  Tetsuya Yamashita

Inventor： Hirotoshi Ozaki ,  Akiko Morimoto ,  Tetsuya Yamashita

IPC: H05K1/00

CPC classification number: H01R12/7082 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09836 ,  H05K2201/10037 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/082

Abstract: A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a main portion which is bonded to a respective electrode face of the electrical element, and a bent portion which is inclined with respect to the main portion. The mounting board is constituted from a PC (printed circuit) board and the lead-attached electrical element. Two conductive lands are provided on a surface of the PC board. The lead-attached electrical element has been inserted into an aperture in the PC board, and bent portions of the leads attached to the electrical element are bonded to the conductive lands so that the electrical element is suspended in the aperture by the leads.

Abstract translation: 安装有引线的电气元件的引线附接电气元件和安装板都有助于减小安装板的尺寸并且便于返工。 引线连接的电气元件由电气元件和两个引线构成。 每个引线包括结合到电气元件的相应电极面的主要部分和相对于主要部分倾斜的弯曲部分。 安装板由PC（印刷电路板）和带引线的电气元件构成。 在PC板的表面上设置两个导电焊盘。 引线连接的电气元件已经插入到PC板的孔中，并且附接到电气元件的引线的弯曲部分被接合到导电焊盘，使得电气元件通过引线悬挂在孔中。

公开(公告)号：US20110127680A1

公开(公告)日：2011-06-02

申请号：US12674761

申请日：2008-08-25

Applicant: Koichiro Masuda ,  Tooru Mori

Inventor： Koichiro Masuda ,  Tooru Mori

IPC: H01L23/52 ,  H01L21/441 ,  H05K1/16 ,  H05K7/06 ,  B23K3/08 ,  B05D3/12

CPC classification number: H01L23/49816 ,  H01G2/06 ,  H01L23/49805 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09836 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: Provided are a spacer capable of avoiding a poor connection due to the suction of solder when the clearance width between a soldered semiconductor device and a printed circuit board is made constant, and a manufacturing method for the spacer. The spacer includes an electrically insulating base member, and at least one solder guiding terminal. The base member has a bottom face, a top face and at least one side face, of which the bottom face and the top face are out of contact with each other whereas the side face contacts one or both the bottom face and the top face. The solder guiding terminal covers the bottom face partially, the top face partially, and the side face partially or wholly. A solder guiding face as the surface of a portion of the solder guiding terminal covering the side face is not normal to the bottom face.

Abstract translation: 提供了当焊接的半导体器件和印刷电路板之间的间隙宽度恒定时，能够避免由于焊料的吸引引起的连接不良的隔离件以及间隔件的制造方法。 间隔件包括电绝缘基底构件和至少一个焊料引导端子。 基部构件具有底面，顶面和至少一个侧面，底面和顶面彼此不接触，而侧面接触底面和顶面中的一个或两个。 焊料引导端子部分或全部部分覆盖底面，部分地覆盖侧面。 作为覆盖侧面的焊料引导端子的一部分的表面的焊料引导面与底面不正交。

公开(公告)号：US20110101411A1

公开(公告)日：2011-05-05

申请号：US13000042

申请日：2009-06-23

Applicant: Marcus Johannes Gerardus Elzinga

Inventor： Marcus Johannes Gerardus Elzinga

IPC: H01L33/62 ,  F21V21/00

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

Abstract translation: 一种支撑模块（1），包括具有槽孔（5）的导电层（2）和适于接收固态光源（3）的接收表面，所述电接触焊盘（4）与所述通孔 （5）。 支撑模块（1）还包括电绝缘元件（8）和延伸穿过电绝缘元件（8）并且穿过通孔（5）突出的至少一个接触销（9）。 此外，电绝缘元件（8）包括通道（10），允许接触到接触销（9）的端部和由固态光源（3）的表面接收的固态光源（3）的电接触焊盘（4） 导电层（2）。 这样的通道使得可以用焊接工具通过绝缘元件到达接触针和接触垫的端部。 因此，可以通过将接触销焊接到接触焊盘来将固态光源附着在金属表面上。 由于金属表面的散热性优于印刷电路板，因此在金属表面上安装固态照明装置在需要良好散热的应用中是有利的。

公开(公告)号：US20100089632A1

公开(公告)日：2010-04-15

申请号：US12641498

申请日：2009-12-18

Applicant: Tomoyuki Ikeda

Inventor： Tomoyuki Ikeda

IPC: H05K1/11

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

公开(公告)号：US07479792B2

公开(公告)日：2009-01-20

申请号：US11403138

申请日：2006-04-11

Applicant: Gaetan L. Mathieu ,  Igor Y. Khandros ,  Carl V. Reynolds

Inventor： Gaetan L. Mathieu ,  Igor Y. Khandros ,  Carl V. Reynolds

IPC: G01R31/02

CPC classification number: H05K3/42 ,  G01R1/06711 ,  G01R1/07307 ,  G01R3/00 ,  H05K3/308 ,  H05K2201/09836 ,  H05K2203/0338 ,  Y10T29/49117 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49194

Abstract: Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method, wires coated with a first etchable layer are initially bonded to a substrate, a second non-etchable plating layer is then applied over the first layer, and the first layer is etched away leaving plated through holes with wires disposed inside. In a third embodiment, a layer of masking material is initially deposited on a substrate and etched to form holes which are filled with a sacrificial fill material, the masking material is then removed, the fill material plated, grinding is performed to remove some plating to expose the fill material, and the fill material is then etched away leaving plated attachment wells. Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires.

Abstract translation: 提供了用于制造用于插入和连接连接器探针的电镀通孔的方法。 在第一种方法中，通过将弯曲的可蚀刻线接合到第一衬底上形成弯曲的电镀通孔，用不可蚀刻的导电材料镀覆电线，用电介质材料包住电镀线以形成第二衬底， 衬底以暴露可蚀刻线，并蚀刻电线以留下镀通孔。 在第二种方法中，首先将涂覆有第一可蚀刻层的线接合到衬底上，然后将第二不可蚀刻镀层施加在第一层上，并且第一层被蚀刻掉，从而通过设置在内部的布线的孔通过电镀。 在第三实施例中，掩模材料层最初沉积在衬底上并被蚀刻以形成填充有牺牲填充材料的孔，然后去除掩模材料，电镀填充材料，进行研磨以除去一些电镀 露出填充材料，然后将填充材料蚀刻掉，留下电镀的连接孔。 探针可以附着到电镀通孔或连接孔，以产生弹性弹簧触点，以形成晶片探针卡组件。 通过将涂覆有电镀材料的扭转牺牲线支撑在基板中，并且随后蚀刻掉线来形成扭曲管镀通孔结构。

公开(公告)号：US20080237882A1

公开(公告)日：2008-10-02

申请号：US11731432

申请日：2007-03-30

Applicant: Islam Salama

Inventor： Islam Salama

IPC: H01L23/52 ,  H01L21/44

CPC classification number: H01L23/5226 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/09827 ,  H05K2201/09836 ,  H01L2924/00

Abstract: In some embodiments, annular via drilling (AVD) technology is presented. In this regard, an annular via is introduced comprising an inner wall and an outer wall, the inner wall and the outer wall coupled with a dielectric layer and extending linearly from a surface of a conductor to a top of the dielectric layer. Other embodiments are also disclosed and claimed.

Abstract translation: 在一些实施例中，呈现环形通孔钻孔（AVD）技术。 在这方面，引入环形通孔，其包括内壁和外壁，内壁和外壁与电介质层耦合并且从导体的表面线性地延伸到电介质层的顶部。 还公开并要求保护其他实施例。

公开(公告)号：US20080236880A1

公开(公告)日：2008-10-02

申请号：US12056854

申请日：2008-03-27

Applicant: Hirotoshi OZAKI ,  Akiko MORIMOTO ,  Tetsuya YAMASHITA

Inventor： Hirotoshi OZAKI ,  Akiko MORIMOTO ,  Tetsuya YAMASHITA

IPC: H01R12/06 ,  H05K1/00

CPC classification number: H01R12/7082 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09836 ,  H05K2201/10037 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/082

Abstract: A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a main portion which is bonded to a respective electrode face of the electrical element, and a bent portion which is inclined with respect to the main portion. The mounting board is constituted from a PC (printed circuit) board and the lead-attached electrical element. Two conductive lands are provided on a surface of the PC board. The lead-attached electrical element has been inserted into an aperture in the PC board, and bent portions of the leads attached to the electrical element are bonded to the conductive lands so that the electrical element is suspended in the aperture by the leads.

Abstract translation: 安装有引线的电气元件的引线附接电气元件和安装板都有助于减小安装板的尺寸并且便于返工。 引线连接的电气元件由电气元件和两个引线构成。 每个引线包括结合到电气元件的相应电极面的主要部分和相对于主要部分倾斜的弯曲部分。 安装板由PC（印刷电路板）和带引线的电气元件构成。 在PC板的表面上设置两个导电焊盘。 引线连接的电气元件已经插入到PC板的孔中，并且附接到电气元件的引线的弯曲部分被接合到导电焊盘，使得电气元件通过引线悬挂在孔中。

公开(公告)号：US07335979B2

公开(公告)日：2008-02-26

申请号：US10880154

申请日：2004-06-28

Applicant: Michael J. Walk

Inventor： Michael J. Walk

IPC: H01L23/12 ,  H01L23/04

CPC classification number: H01L23/49811 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/16152 ,  H05K1/114 ,  H05K2201/09836 ,  H05K2201/10719

Abstract: An article of manufacture and system, as well as fabrication methods therefore, may include a plurality of lands disposed on a surface of a substrate wherein the lands are oriented at an angle to the surface of the substrate and further wherein the substrate is formed of conductive layers that are formed such that a non-conductive layer does not interpose between the conductive layers and their coupling.

Abstract translation: 因此，制品和系统以及制造方法可以包括设置在基板的表面上的多个焊盘，其中焊盘与衬底的表面成一定角度定向，并且其中衬底由导电 形成为使得不导电层不插入在导电层之间的层和它们的耦合。

公开(公告)号：US07207107B2

公开(公告)日：2007-04-24

申请号：US10495564

申请日：2002-11-14

Applicant: Juergen Usner ,  Ando Welling

Inventor： Juergen Usner ,  Ando Welling

IPC: H05K3/02

CPC classification number: G06K19/0775 ,  B26D7/27 ,  B26F1/18 ,  B26F1/22 ,  G06K19/077 ,  H05K3/4084 ,  H05K2201/09081 ,  H05K2201/09836 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49156 ,  Y10T29/5136 ,  Y10T29/5148 ,  Y10T29/5313 ,  Y10T83/0207

Abstract: A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a cut 11 is produced obliquely to the surfaces of the substrate in the area of the contact zones, and the two substrate areas 20, 30 adjoining the oblique cut are moved past each other until they lock behind each other. Moving them past each other is effected by a ram 12, by the action of compressed air 13, by applying a vacuum 14 or by a driving hook 15 fixed to the cutting tool. The two steps of producing the cut and moving the two substrate areas adjoining the cut past each other are effected in a common processing station, preferably in a single operation.

Abstract translation: 存在于基板的两个相对表面1a，1b上的具有导电接触区域41,41的柔性基板1，特别是电路板的通过接触的方法和装置提供了一种切口11，其倾斜于 接触区域中的基板和与倾斜切口相邻的两个基板区域20,30彼此移动，直到它们彼此锁定。 通过压头空气13的作用，通过施加真空14或固定在切割工具上的驱动钩15，通过柱塞12进行移动。 在共同的处理站中，优选地在单个操作中实现产生切割和移动邻接切割的两个基板区域的两个步骤。