公开(公告)号：US20170303385A1

公开(公告)日：2017-10-19

申请号：US15508127

申请日：2014-10-29

Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.

Inventor： Kosuke Ikeda ,  Yuji Morinaga ,  Osamu Matsuzaki

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/021 ,  H01L23/3672 ,  H01L25/07 ,  H01L25/18 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10189 ,  H01L2924/00

Abstract: The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component. The connector has a first outlet into which a first connecting terminal on a side of the first heat generating component is insertable, and a second outlet into which a second connecting terminal on a side of the second heat generating component is insertable.

公开(公告)号：US20170280564A1

公开(公告)日：2017-09-28

申请号：US15464516

申请日：2017-03-21

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K3/30 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/181 ,  H01G2/06 ,  H05K1/0353 ,  H05K1/111 ,  H05K1/113 ,  H05K1/186 ,  H05K3/0044 ,  H05K3/205 ,  H05K3/301 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10174 ,  H05K2201/10378 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component includes a first functional element including a pair of first connecting electrode portions formed on a first mounting surface, a pair of pillar electrodes connected to the corresponding first connecting electrode portions, a second functional element that includes a pair of second connecting electrode portions formed on a second mounting surface and that is arranged in a space defined by the first mounting surface of the first functional element and the pair of pillar electrodes, a pair of pad electrodes connected to the corresponding second connecting electrode portions, and a sealing resin that seals the pair of pillar electrodes, the pair of pad electrodes and the second functional element so as to expose the first lower surfaces of the pair of pillar electrodes and the second lower surfaces of the pair of pad electrodes.

公开(公告)号：US20170278638A1

公开(公告)日：2017-09-28

申请号：US15460265

申请日：2017-03-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

IPC: H01G4/40 ,  H01C1/012 ,  H01G4/005 ,  H01G4/248 ,  H01G4/232 ,  H01G4/30 ,  H01C1/14

CPC classification number: H01G4/40 ,  H01C1/012 ,  H01C1/14 ,  H01G2/06 ,  H01G4/005 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611

Abstract: A composite electronic component includes a capacitor device and a resistor device disposed on one another in a heightwise direction. The capacitor device includes a capacitor body, a first external electrode, and a second external electrode. The resistor device includes a base portion, a resistor body, a first upper surface conductor, a second upper surface conductor, a first lower surface conductor, a second lower surface conductor, a first end surface connection conductor, and a second end surface connection conductor. An upper surface of the base portion of the resistor device faces a lower surface of the capacitor body of the capacitor device, the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.

公开(公告)号：US20170229816A1

公开(公告)日：2017-08-10

申请号：US15326121

申请日：2015-07-01

Applicant: ERNI Production GmbH & Co. KG

Inventor： Roland MOEDINGER ,  Stefan MOLITOR ,  Juergen LAPPOEHN ,  Thomas GNEITING

IPC: H01R13/6471 ,  H01R13/66 ,  H01R12/71 ,  H01R13/658

CPC classification number: H01R13/6471 ,  H01R12/716 ,  H01R13/6473 ,  H01R13/658 ,  H01R13/6616 ,  H01R13/665 ,  H05K1/0246 ,  H05K2201/10022

Abstract: A plug connector which comprises contact elements that are subdivided into at least one signal contact element and at least one shielding contact element, and a component having an electrical circuit ground. The plug connector and the component are characterized by an ohmic resistance which connects the shielding contact element to the electrical circuit ground. The measure suppresses parasitic oscillations.

公开(公告)号：US09730334B2

公开(公告)日：2017-08-08

申请号：US15138354

申请日：2016-04-26

Applicant: FANUC Corporation

Inventor： Makoto Bekke ,  Takeshi Sawada

IPC: H05K3/34

CPC classification number: H05K3/3415 ,  H05K3/3468 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2203/1178 ,  Y02P70/613

Abstract: In a leaded electronic component mounting structure in which the effect of reducing the occurrence of a blow hole is not impaired even if resin of a lead-inserted component is softened by heat during soldering and which can reduce a load placed on a lead when an external force acts, the lead of the lead-inserted component is inserted into a through hole provided in a base material of a printed wiring board, soldering is performed by immersing into molten solder, and a surface mount component and a surface mount component pad form an air vent tunnel. The air vent tunnel does not come into direct contact with the lead-inserted component, and therefore is not blocked even if the resin of the lead-inserted component softens due to soldering. Thus, the effect of reducing the occurrence of a blow hole is not impaired.

公开(公告)号：US20170221611A1

公开(公告)日：2017-08-03

申请号：US15490333

申请日：2017-04-18

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Hiroki YAMAMOTO ,  Katsuya MATSUURA ,  Yasuhiro KONDO

IPC: H01C1/14 ,  H01C10/16 ,  H01C17/00 ,  H01G5/40 ,  H01L33/62 ,  H05K1/18 ,  H05K3/34 ,  H01F29/08 ,  H01F41/04 ,  H01L27/15 ,  H01G5/011 ,  H01G5/38

CPC classification number: H01C1/14 ,  H01C10/16 ,  H01C10/50 ,  H01C17/006 ,  H01C17/23 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/40 ,  H01F29/00 ,  H01F29/08 ,  H01F41/041 ,  H01G2/16 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H01G5/011 ,  H01G5/38 ,  H01G5/40 ,  H01L24/32 ,  H01L25/105 ,  H01L25/13 ,  H01L27/0802 ,  H01L27/15 ,  H01L33/62 ,  H01L2221/68304 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3478 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10212 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00

Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

公开(公告)号：US20170208710A1

公开(公告)日：2017-07-20

申请号：US15409260

申请日：2017-01-18

Applicant: Apple Inc.

Inventor： Albert Wang ,  Paul A. Martinez

IPC: H05K9/00 ,  H05K3/30 ,  G06F1/16 ,  G06F1/26 ,  H05K1/18

CPC classification number: G06F1/1613 ,  G06F1/1656 ,  G06F1/1658 ,  G06F1/182 ,  G06F1/183 ,  H01R43/205 ,  H05K2201/0715 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10636 ,  Y02P70/611

Abstract: The present disclosure relates to shield frames that reduce electromagnetic interference in electrical devices. The shield frames may be formed by coupling a shield frame lid to a ground connection of the circuit board through terminations in electrical components. The terminations in these electrical components thus may act both as a ground termination for the component as well as a ground connection for the shield frame. The components may be disposed in the perimeter of the circuit board to establish, with or without additional conductive posts, sections of the shield frame wall.

公开(公告)号：US20170186516A1

公开(公告)日：2017-06-29

申请号：US15456879

申请日：2017-03-13

Applicant: ROHM CO., LTD.

Inventor： Masaki YONEDA

IPC: H01C1/012 ,  H01C1/14

CPC classification number: H01C1/012 ,  H01C1/014 ,  H01C1/028 ,  H01C1/14 ,  H01C1/142 ,  H01C3/12 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

公开(公告)号：US09681559B2

公开(公告)日：2017-06-13

申请号：US14135018

申请日：2013-12-19

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Lisa M Albaugh ,  David A Smith

IPC: H05K3/46 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24 ,  H05K1/05

CPC classification number: H05K3/46 ,  H05K1/053 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/245 ,  H05K3/4685 ,  H05K2201/10022 ,  H05K2203/1126 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Disclosed herein are a variety of embodiments of thick film circuits with conductive components formed using different conductive elements and related methods for forming such circuits. One embodiment consistent with the present disclosure includes a multi-level thick film circuit formed on a substrate and having a first layer disposed on the substrate. The first layer may include a first conductive component formed using a first conductive element. The first conductive element may be a precious metal. The circuit may further include a second layer having a second conductive component. The second conductive component may be formed using a second conductive element. In one embodiment, the second conductive element may be a base metal. At least a portion of the first conductive element may directly contact at least a portion of the second conductive element such that the first layer is in electrical communication with the second layer.

公开(公告)号：US20170162927A1

公开(公告)日：2017-06-08

申请号：US15437445

申请日：2017-02-21

Applicant: Hatem Mohamed Aead

Inventor： Hatem Mohamed Aead

IPC: H01P11/00 ,  H05K1/02 ,  H05K3/40 ,  H05K3/00 ,  H05K3/30 ,  H01P3/08 ,  H05K1/03

CPC classification number: H01P11/003 ,  H01P3/08 ,  H01P5/12 ,  H01P5/185 ,  H05K1/0243 ,  H05K1/0306 ,  H05K3/0044 ,  H05K3/30 ,  H05K3/4038 ,  H05K2201/10022 ,  H05K2201/1006 ,  Y10T29/49018

Abstract: A method for creating an air gap in an electronic device, for example, a passive electronic component chip (PECC) for high frequency microwave transmission is provided. Electronic circuitry of a passive electronic component, for example, a termination, an attenuator, etc., is fabricated in a predetermined configuration on a single layer of a substrate to create the PECC. An air gap of configurable dimensions is created at a configurable location on the substrate by dicing the substrate at the configurable location to create a suspended substrate-like environment in the PECC. The created air gap reduces the dielectric constant at the configurable location and reduces capacitance of the substrate along areas located directly above the air gap. The created air gap also reduces a loss tangent, high frequency attenuation, and electromagnetic fields near a ground plane of the PECC, creates a wide strip dimension, and creates less stringent tolerance in the PECC.