公开(公告)号：US11766563B2

公开(公告)日：2023-09-26

申请号：US17881589

申请日：2022-08-04

Applicant: Pulse Biosciences, Inc.

Inventor： Chaofeng Huang ,  Gregory P. Schaadt ,  Kenneth R. Krieg

IPC: H01F27/28 ,  A61N1/36 ,  A61N1/04 ,  H01F27/24 ,  H03K3/353 ,  H05K1/18

CPC classification number: A61N1/36034 ,  A61N1/0472 ,  H01F27/24 ,  H01F27/2823 ,  H03K3/353 ,  H05K1/181 ,  H01F2027/2833 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Described herein are apparatuses and methods for applying high voltage, sub-microsecond (e.g., nanosecond range) pulsed output to a biological material, e.g., tissues, cells, etc., using a high voltage (e.g., MOSFET) gate driver circuit having a high voltage isolation and a low inductance. In particular, described herein are multi-core pulse transformers comprising independent transformer cores arranged in parallel on opposite sides of a substrate. The transformer cores may have coaxial primary and secondary windings. Also describe are pulse generators including multi-core pulse transformers arranged in parallel (e.g., on opposite sides of a PCB) to reduce MOSFET driver gate inductance.

公开(公告)号：US20230292430A1

公开(公告)日：2023-09-14

申请号：US18179955

申请日：2023-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Taro HIGUCHI ,  Yoshihiro IMANISHI

IPC: H05K1/02 ,  H05K5/02

CPC classification number: H05K1/0233 ,  H05K5/02 ,  H05K2201/1003 ,  H04B3/548

Abstract: A circuit module includes a wiring board, first and second lines, a first inductor, and a sheet-like first conductor. The first line is on the wiring board, for transmitting a signal to a first circuit, outside the wiring board, and a power supply voltage for supplying power to the first circuit. The second line is on the wiring board side by side with the first line, for transmitting a signal to a second circuit and a power supply voltage for supplying power to the second circuit, which is outside the wiring board independently of the first circuit. The first inductor is on the wiring board, having one end connected to the first line, and another end connected to a power supply circuit for supplying the power. The sheet-like first conductor is on or near at least part of a side surface of a housing that holds the first inductor.

公开(公告)号：US11737214B2

公开(公告)日：2023-08-22

申请号：US17535572

申请日：2021-11-25

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Ming-Sheng Lai ,  Yan-Zheng Wu

IPC: H05K1/18 ,  H01Q3/28 ,  H01Q3/34 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01Q3/28 ,  H01Q3/34 ,  H05K1/0219 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10196 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10674

Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

公开(公告)号：US11735352B2

公开(公告)日：2023-08-22

申请号：US16925729

申请日：2020-07-10

Applicant: Infineon Technologies Austria AG

Inventor： Danny Clavette ,  Gerald Deboy ,  Roberto Rizzolatti ,  Otto Wiedenbauer ,  Yong Zhou

IPC: H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/04 ,  H05K1/18

CPC classification number: H01F27/28 ,  H01F27/24 ,  H01F41/0206 ,  H01F41/04 ,  H05K1/185 ,  H05K2201/1003

Abstract: According to one configuration, an inductor device comprises core material and at least a first electrically conductive path. The core material is fabricated from magnetically permeable material. The first electrically conductive path extends axially through the core material from a proximal end of the inductor device to a distal end of the inductor device. The core material is operable to confine first magnetic flux generated from first current flowing through the first electrically conductive path. The inductor device further includes a gap in the core material. The gap (gas or solid material) has a different magnetic permeability than the core material. Inclusion of the gap in the core material provides a way to tune an inductance of the inductor device and increase a magnetic saturation level of the inductor device. The core material includes any number of electrically conductive paths and corresponding gaps.

公开(公告)号：US11705272B2

公开(公告)日：2023-07-18

申请号：US16570744

申请日：2019-09-13

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kenichiro Nogi ,  Yoshio Hayashide

IPC: H01F1/24 ,  H01F1/26 ,  H01F17/04 ,  H01F17/06 ,  H01F27/00 ,  H01F27/06 ,  H01F27/28 ,  H01F27/29 ,  H01F27/33 ,  H01F27/245 ,  H01F41/00 ,  H01F41/02 ,  H01F41/04 ,  H01F41/06 ,  H05K3/18 ,  H01F27/32 ,  H01F41/12 ,  H05K1/18

CPC classification number: H01F27/292 ,  H01F27/06 ,  H01F27/2823 ,  H01F27/327 ,  H01F41/127 ,  H05K1/181 ,  H01F2027/065 ,  H05K2201/1003

Abstract: A coil component includes: a coil embedded in a substrate body and having a winding part constituted by a wound conductor; wherein the substrate body has: a first region sandwiched between one end surface of the substrate body and a plane parallel with the one end surface and running through a portion of a first external electrode farthest away from the one end surface; a second region sandwiched between another end of the substrate body and a plane parallel with the another end surface and running through a portion of a second external electrode farthest away from the another end surface; and a third region between the first region and the second region; and the winding part is provided in the third region, and also in the first region where it is wound by one turn or more.

公开(公告)号：US20230216465A1

公开(公告)日：2023-07-06

申请号：US18146898

申请日：2022-12-27

Applicant: TOKIN Corporation

Inventor： Shu SATO ,  Yuta NAKANO ,  Koichi KONDO ,  Koki HARADA

IPC: H03H7/06 ,  H05K1/18

CPC classification number: H03H7/06 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/1006

Abstract: A noise filter that can be miniaturized is provided. A noise filter includes a terminal fitting, a board, a coil mounted on the board, and an electronic component mounted on the board. The terminal fitting includes a terminal body electrically connected to an external device, a coil connection part electrically connected to the coil through a lead wire, and a board connection part electrically connected to the board. The coil connection part caulks the lead wire.

公开(公告)号：US20230209789A1

公开(公告)日：2023-06-29

申请号：US18178588

申请日：2023-03-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Junichi SAITO ,  Masaaki MIZUSHIRO

IPC: H05K9/00 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K9/0022 ,  H05K3/284 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003

Abstract: A module includes a substrate having main surfaces; components mounted on at least one main surface of the substrate; a sealing resin on a surface of the substrate to embed the components; and a shielding film containing Cu as a main component and covering a top surface and at least one side surface of the sealing resin, wherein a surface of the shielding film is directly covered by a first Ni layer containing Ni—B or Ni—N as a main component, and a surface of the first Ni layer is covered by a second Ni layer containing Ni—P as a main component.

公开(公告)号：US20230189442A1

公开(公告)日：2023-06-15

申请号：US18015702

申请日：2020-09-16

Applicant: Intel Corporation

Inventor： Kaladhar RADHAKRISHNAN ,  Wei SHEN

IPC: H05K1/18 ,  H05K1/02 ,  H01L25/16

CPC classification number: H05K1/183 ,  H05K1/0209 ,  H01L25/162 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10734 ,  H01L24/16

Abstract: Embodiments disclosed herein include microelectronic boards and electronic systems. In an embodiment, a microelectronic board comprises aboard substrate, where the board substrate has a first thickness between a first surface and a second surface opposite from the first surface. In an embodiment, a recess is formed into the first surface of the board substrate, where the recess comprises a third surface between the first surface and the second surface. In an embodiment, the board substrate has a second thickness between the third surface and the second surface. In an embodiment, the microelectronic board further comprises a voltage regulator (VR) module attached to the third surface.

公开(公告)号：US20230187714A1

公开(公告)日：2023-06-15

申请号：US18092210

申请日：2022-12-31

Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.

Inventor： Guozhen SUN

IPC: H01M10/42 ,  H01M50/284 ,  H05K9/00

CPC classification number: H01M10/4257 ,  H01M50/284 ,  H05K9/0071 ,  H05K2201/1003 ,  H05K1/181

Abstract: Provided are a circuit structure, a battery, and an electronic device. The circuit structure comprises: a battery, comprising a first positive electrode, a first negative electrode, and a battery cell, wherein the battery cell is connected between the first positive electrode and the first negative electrode, and the battery cell is configured to generate a first induced magnetic field when a changing current flows therethrough; and an electromagnetic inductor, configured to generate a second induced magnetic field when the changing current flows therethrough, wherein the second induced magnetic field is superposed on the first induced magnetic field.

公开(公告)号：US20190207077A1

公开(公告)日：2019-07-04

申请号：US16294975

申请日：2019-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shingo ITO ,  Isamu MORITA ,  Naoki GOUCHI

IPC: H01L41/047 ,  H01L41/083 ,  H01L41/09 ,  H01L41/193 ,  H01F7/20 ,  H01F27/28 ,  H01F27/32 ,  H05K1/18

CPC classification number: H01L41/0475 ,  H01F7/20 ,  H01F27/2804 ,  H01F27/323 ,  H01F2027/2809 ,  H01L41/083 ,  H01L41/0986 ,  H01L41/193 ,  H05K1/02 ,  H05K1/16 ,  H05K1/181 ,  H05K3/46 ,  H05K2201/1003

Abstract: A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.