Abstract:
A mounting device and method are provided for mounting of large discrete electronic components such as transformers on a surface mount circuit board. A carrier board is provided with small tabs extending laterally outwardly therefrom and the lead wires from the component are wrapped around the tabs. Corresponding solder pads are provided in the main circuit board so as to coincide with the tabs. The solder on the pads is flowed to secure the carrier to the main board in good electrical and mechanical contact.
Abstract:
Method and device are provided for use in the initial manufacture of surface mount printed circuit board assemblies or for use in the replacement and repair of J-leads surface mount electrical components on printed circuit boards.
Abstract:
A bus device, such as a memory board, is provided with a mother board and a daughter board mount at a predetermined distance above the surface of the mother board. The daughter board has integrated circuit components, such a memory chips, mounted on both of its sides. Means are provided for connecting the wires on the daughter board with those of the mother board and for connecting the wires on the mother board with the conductors of a system bus. In the preferred embodiment of the invention the distance at which the daughter board is mounted above the surface of the mother board is less than twice the maximum thickness of the electronic components mounted on the side of the memory board facing the mother board. The portion of the mother board under these components contains no electronic components itself. Instead, that portion of the mother board contains at least one ventilation opening to ventilate the components on the side of the daughter board that faces the mother board. The preferred embodiment allows two layers of chips to be mounted in a computer slot in which the maximum permissible extent to which components may stick out from the back of a bus device is too small to allow chips to be mounted on the back of the mother board.
Abstract:
This invention relates to a right angle light emitting diode assembly with snap-in feature wherein an insulating body, generally in the shape of a rectangular parallelepiped, no larger than a finger nail, holds a light emitting diode in the insulating body at right angles to the surface of a printed wiring board, the insulating body being shaped such that robotic equipment can be used to insert the diode assembly cheaply and efficiently onto said board. The insulating body has front and back generally parallel surfaces, top and bottom generally parallel surfaces, and first and second generally parallel side surfaces, the respective surfaces having grooves and protuberances to allow the light emitting diode (LED) to be fixedly mounted in said body and the body to be inserted into a printed wiring board which can then be wave soldered without deleterious effects on the LED or supporting body. The bottom of the body has two oppositely faced snap-in proturbances which pass through the hole on a printed wiring board which deform inwardly slightly while passing through the hole and expand outwardly after extending out from beyond the hole to fixedly mount the diode assembly in the correct position on the board.
Abstract:
A printed circuit board assembly is disclosed which includes a printed circuit board having in situ molded members for mechanically securing electrical and mechanical components and the like to the printed circuit board. The printed circuit board is manufactured using a method wherein a printed circuit board is initially prepared with the required printed circuit patterns and with apertures for in situ molded members and for the leads of the electrical components. The required molded members are then molded in situ in specified apertures of the printed circuit board. The electrical components are thereafter mechanically secured in place with the in situ molded members and the leads of the components are connected to the contact pads of the printed circuit pattern.
Abstract:
A bar coded index tab for affixation of a label to an article. The tab has a base (60) including a front face (70) and a notch (80) extending across the front face for affixing thereto a label (20) having machine-readable bar coded information on a portion of the label and human-readable information on another portion of the label. The machine-readable information is read in one portion of the notch and the human-readable information is read in another portion of the notch. Lips (110A and 110B) are provided along each side of the notch to grip the label. The reading instrument is located against one of the lips for movement along the lip to accurately read the bar code information without the necessity for human visual contact with the label. The tab has means (120) for attaching the base to an object to be labelled.
Abstract:
A mounting device for stacking of electrical components at an upright angle relative to the planar surface of an electrical circuit board is provided. The mounting device includes a base portion that is affixed to the surface of an electrical circuit board, and an upright portion snapably received by the base portion. The upright portion includes a front wall having a plurality of longitudinally spaced apart receptacles, and a stepped rear wall. Lead channels extend between the receptacles and the stepped rear wall. Electrical leads of components received within the front wall receptacles are led through the channels to the stepped rear wall. The lead portions extending beyond the rear wall may be bent along the stepped portions into generally parallel relationship with the front, with the stepped portions maintaining the leads in spaced apart relationship.
Abstract:
A mount is provided for electrolytic capacitors, the mount being in the form of a ring having an internal shoulder portion. On the opposite end of the mount from the end on which the shoulder portion is located is a groove containing a compressible O-ring. When the capacitor is inserted in the mount with its terminals extending downwardly to the surface of a circuit board, the top edge of the capacitor can rest on the shoulder of the ring mount. Screws are inserted from the opposite side of the circuit board and engage the terminals. Upon being tightened, the capacitor can is drawn downwards bringing the end of the capacitor can into firm engagement with the ring mount and causing it to compress the O-ring so as to provide a seal between the O-ring and the surface of the circuit board.
Abstract:
A mounting bracket supports electronic components, particularly a plurality of resistors in a parallel array. The mounting bracket is secured to a printed circuit board to which the resistors are attached in a predetermined circuit arrangement. The mounting bracket has cut-outs defined by oppositely disposed ears between which the resistor is forcibly placed. The mounting bracket forms a means for holding the resistors to facilitate attachment to the printed circuit board and furthermore forms a permanent support therefor so as to substantially eliminate detachment of the resistors due to vibration or other causes.
Abstract:
A support member for electronic devices, particularly for mounting devices on a printed circuit board, has a flat central web portion, side members extending down along each side of the central web portion, the side members connected to the web portion by inclined webs. Each side member has a plurality of slots extending down from its top edge, with an aperture at the bottom of each slot. A transverse rib extends upward at each end, with a resilient latch. The leads of an electronic device are guided by the upper surfaces of the inclined webs and the inner surfaces of the slots into the apertures and are correctly positioned for insertion in a printed circuit board. The device is held down by the latches. A protective cover can be positioned over the device, protrusions on the cover snapping into recesses in the transverse webs.