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    PACKAGING BOARD
    32.
    发明申请
    PACKAGING BOARD 有权
    包装板

    公开(公告)号：US20120145436A1

    公开(公告)日：2012-06-14

    申请号：US13209062

    申请日：2011-08-12

    Applicant: Yukinori KITA

    Inventor： Yukinori KITA

    IPC: H05K1/00

    CPC classification number: H05K3/306 ,  H01R43/0256 ,  H05K3/02 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10757 ,  H05K2201/10818

    Abstract: A packaging board of the type having board terminals soldered on a printed board and including an insulation support member made of a resin disposed on a printed board having tubular support portions configured to receive board terminals, visual recognition windows configured for visually recognizing soldering portions of the board terminals inserted into the printed board through the windows, and engaging portions that engage the board terminals and define insertion amounts of the board terminals.

    Abstract translation: 一种具有板端子的封装板，其焊接在印刷电路板上，并且包括由设置在印刷电路板上的树脂构成的绝缘支撑部件，所述绝缘支撑部件设置在具有用于容纳电路板端子的管状支撑部分的印刷电路板上， 板端子通过窗口插入印刷电路板，以及接合部分，其接合电路板端子并限定电路板端子的插入量。

    Electronic component, mounted structure, and inverter device therewith
    34.
    发明授权
    Electronic component, mounted structure, and inverter device therewith 有权
    电子部件，安装结构和逆变器装置

    公开(公告)号：US07839621B2

    公开(公告)日：2010-11-23

    申请号：US12039284

    申请日：2008-02-28

    Applicant: Yukihiko Shirakawa ,  Iwao Miura

    Inventor： Yukihiko Shirakawa ,  Iwao Miura

    IPC: H01G4/228 ,  H01G4/248 ,  H01G4/06

    CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

    Abstract translation: 表面安装型电子部件具有电介质元件主体，电极，引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上，另一个电极形成在另一个主面上，电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

    Power semiconductor module with flush terminal elements
    36.
    发明申请
    Power semiconductor module with flush terminal elements 有权
    具有齐平端子元件的功率半导体模块

    公开(公告)号：US20070235860A1

    公开(公告)日：2007-10-11

    申请号：US11403169

    申请日：2006-04-12

    Applicant: Jurgen Steger ,  Yvonne Manz

    Inventor： Jurgen Steger ,  Yvonne Manz

    IPC: H01L23/12 ,  H01L21/00

    CPC classification number: H01L25/072 ,  H01L23/492 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/0061 ,  H05K3/222 ,  H05K3/3426 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being comprised of an insulating body and having on the first main face facing away from the base plate a plurality of connecting tracks electrically insulated from each other. The terminal and connecting elements are arranged on a connecting track in with contact faces contacting connecting tracks or power semiconductor components, with the individual contact faces having a plurality of partial contact faces. In one optional embodiment, each partial contact face has a maximum area of 20 mm2. In another embodiment, partial contact faces each are arranged at a distance of approximately 5 mm with regard to each other and the connection of the partial faces to the connecting tracks or the power semiconductor components is flush.

    Abstract translation: 功率半导体模块包括壳体，通向壳体外部的端子元件，布置在壳体内部的电绝缘基板，其中基板由绝缘体构成，并且在第一主面上背离基板a 多个连接轨道彼此电绝缘。 端子和连接元件布置在连接轨道上，接触面接触连接轨道或功率半导体部件，各个接触面具有多个部分接触面。 在一个可选实施例中，每个部分接触面的最大面积为20mm 2。 在另一个实施例中，部分接触面各自相对于彼此以大约5mm的距离布置，并且部分面与连接轨道或功率半导体部件的连接是齐平的。

    LEADED SEMICONDUCTOR DEVICE PACKAGE FOR USE IN NONSOLDERING ASSEMBLING
    39.
    发明申请
    LEADED SEMICONDUCTOR DEVICE PACKAGE FOR USE IN NONSOLDERING ASSEMBLING 失效
    领先的半导体器件封装，用于非焊接组装

    公开(公告)号：US20010013421A1

    公开(公告)日：2001-08-16

    申请号：US09209345

    申请日：1998-12-11

    Inventor： WILLIAM JOHN NELSON ,  ALICE TSENG ,  K.R. LEE ,  STANLEY LAI

    IPC: H01L023/02

    CPC classification number: H05K3/308 ,  H01L21/4842 ,  H01L23/49555 ,  H01L2924/0002 ,  H05K2201/10818 ,  H01L2924/00

    Abstract: A leaded semiconductor device package for nonsoldering assembling is disclosed. In the package of the invention, both leads of a semiconductor device package are flattened, cut and bent by automatic machines on the bais of conventional packaging process. Unlike a conventional semiconductor device package which is electrically connected to a circuit by soldering, the flattened and bent parts of both leads of the semiconductor device package can be electrically connected to a circuit by elastically contact and directly assembling without soldering.

    Abstract translation: 公开了一种用于非焊接组装的引线半导体器件封装。 在本发明的封装中，半导体器件封装的两个引线通过常规封装工艺的自动机械被平坦化，切割和弯曲。 与通过焊接电连接到电路的常规半导体器件封装不同，半导体器件封装的两个引线的扁平和弯曲部分可以通过弹性接触而电连接到电路，并且在没有焊接的情况下直接组装。

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