公开(公告)号：US20140376196A1

公开(公告)日：2014-12-25

申请号：US14368623

申请日：2012-12-28

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Volodymyr Karpovych ,  Johannes Stahr

IPC: H05K3/46 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/4611 ,  H05K1/11 ,  H05K1/142 ,  H05K1/18 ,  H05K3/368 ,  H05K3/403 ,  H05K3/4694 ,  H05K2201/09045 ,  H05K2201/0919 ,  H05K2201/09572 ,  H05K2201/1059 ,  H05K2201/209 ,  Y10T29/49126

Abstract: The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board.

Abstract translation: 本发明涉及一种用于制造由至少两个印刷电路板区域组成的印刷电路板的方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域 彼此连接，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过机械联接相互连接。 根据本发明，导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧面处彼此导电耦合，从而在印刷之间形成简单且可靠的横向电耦合 使彼此连接的电路板区域成为可能。 本发明还涉及这种印刷电路板。

公开(公告)号：US20140017940A1

公开(公告)日：2014-01-16

申请号：US13546591

申请日：2012-07-11

Applicant: Bicheng Chen ,  Sean Patrick McCarthy ,  Charles Dudley Copper

Inventor： Bicheng Chen ,  Sean Patrick McCarthy ,  Charles Dudley Copper

IPC: H01R13/648 ,  H01R43/26

CPC classification number: H01R13/6477 ,  H01R12/721 ,  H05K1/117 ,  H05K1/142 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/209

Abstract: A layered connector includes a transmission unit having a supporting dielectric cell and an exposing dielectric cell. The supporting dielectric cell has a first surface supporting a signal conductor extending to a mating end of the supporting dielectric cell. The exposing dielectric cell is laminated to the first surface such that the signal conductor is positioned between the supporting dielectric cell and the exposing dielectric cell. The exposing dielectric cell is positioned on the first surface such that a portion of the first surface at the mating end and a portion of the signal conductor is exposed for direct electrical connection of the signal conductor to a mating component.

Abstract translation: 分层连接器包括具有支撑电介质电池和暴露电介质电池的传输单元。 支撑电介质单元具有支撑延伸到支撑介电单元的配合端的信号导体的第一表面。 曝光介质电池被层压到第一表面上，使得信号导体位于支撑电介质电池和曝光电介质电池之间。 曝光介质单元被定位在第一表面上，使得在配合端的第一表面的一部分和信号导体的一部分被暴露以将信号导体直接电连接到配合部件。

公开(公告)号：US08293577B2

公开(公告)日：2012-10-23

申请号：US12923590

申请日：2010-09-29

Applicant: Yuji Awano ,  Masataka Mizukoshi

Inventor： Yuji Awano ,  Masataka Mizukoshi

IPC: H01L21/44

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/12 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1134 ,  H01L2224/13193 ,  H01L2224/13582 ,  H01L2224/13693 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/026 ,  H05K2201/09472 ,  H05K2201/209 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, the connection mechanism electrically connecting the semiconductor device and the circuit board via the first conductive terminal and the second conductive terminal. At least one of the first conductive terminal and the second conductive terminal of the connection mechanism includes one or more carbon nanotubes each having one end thereof fixed to the surface of the at least one of the first conductive terminal and the second conductive terminal, and extending in a direction away from the surface. The first conductive terminal and the second conductive terminal engage each other through the carbon nanotubes.

Abstract translation: 公开了一种包括半导体器件的半导体封装; 电路板; 以及连接机构，其包括设置在所述半导体器件上的第一导电端子和设置在所述电路板侧的第二导电端子，所述连接机构经由所述第一导电端子和所述第二导电端子电连接所述半导体器件和所述电路板。 连接机构的第一导电端子和第二导电端子中的至少一个包括一个或多个碳纳米管，每个碳纳米管的一端固定到第一导电端子和第二导电端子中的至少一个的表面，并且延伸 在远离表面的方向上。 第一导电端子和第二导电端子通过碳纳米管彼此接合。

公开(公告)号：US20120260063A1

公开(公告)日：2012-10-11

申请号：US13082599

申请日：2011-04-08

Applicant: Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

Inventor： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

IPC: G06F15/76 ,  G06F9/02

CPC classification number: H05K3/365 ,  H01L2924/0002 ,  H05K1/148 ,  H05K2201/047 ,  H05K2201/10159 ,  H05K2201/209 ,  H01L2924/00

Abstract: A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.

Abstract translation: 在表面上具有树状突起的可拆卸的逻辑叶片模块连接到集群接口板的表面上的凹陷区域。 突起用于将逻辑模块设备电连接到集群接口板等，逻辑叶片的表面上的突起被灵活地和导电地连接到集群接口板的表面上的接收区域。 逻辑叶片连接器是可移动的，不需要焊料软化热循环或特殊工具，并且允许在任何时间简单地移除或更换单个叶片。

公开(公告)号：US20120108082A1

公开(公告)日：2012-05-03

申请号：US12917118

申请日：2010-11-01

Applicant: Walter V. Werner ,  Earl W. Stromberg ,  Wit Cezary Bushko ,  George Hanna Ghanime

Inventor： Walter V. Werner ,  Earl W. Stromberg ,  Wit Cezary Bushko ,  George Hanna Ghanime

IPC: H01R12/00 ,  B32B3/06

CPC classification number: H01R12/732 ,  H01R13/24 ,  H05K3/326 ,  H05K2201/2072 ,  H05K2201/209 ,  Y10T428/24008

Abstract: A plurality of connecting elements projects from a body's surface. A plurality of indents is defined in the body's surface. Each stem element includes first and second stalks projecting orthogonally from the surface. The first stub includes a pyramidical cap section and at least one generally planar wall. The second stalk is generally parallel to the first stub and spaced apart from the at least one wall, defining a gap therebetween. The second stalk includes a stem projecting from the surface. A lip section extends from a distal end of the stem and protrudes outwardly relative to the stem. An engagement section extends from the lip section. A free end of the engagement section defines a distal end of the second stalk. An outer surface of the engagement section defines a first gradient tapering from the lip section to the distal end of the second stalk.

Abstract translation: 多个连接元件从身体的表面伸出。 在身体的表面定义了多个缩进。 每个杆元件包括从表面垂直突出的第一和第二茎。 第一短柱包括金字塔盖部分和至少一个大致平面的壁。 所述第二杆通常平行于所述第一短柱并且与所述至少一个壁间隔开，从而在其之间形成间隙。 第二根杆包括从表面突出的杆。 唇部从茎的远端延伸并且相对于茎向外突出。 接合部从唇部延伸。 接合部分的自由端限定第二茎的远端。 接合部分的外表面限定了从唇部到第二茎的远端渐缩的第一梯度。

公开(公告)号：US20120080801A1

公开(公告)日：2012-04-05

申请号：US13315350

申请日：2011-12-09

Applicant: Satoru HARA ,  Shuzo AKEJIMA

Inventor： Satoru HARA ,  Shuzo AKEJIMA

IPC: H01L23/48

CPC classification number: H05K3/325 ,  H01L23/32 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/4046 ,  H05K7/142 ,  H05K2201/10416 ,  H05K2201/10704 ,  H05K2201/2036 ,  H05K2201/209 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

Abstract translation: 半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。 外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。

公开(公告)号：US08097950B2

公开(公告)日：2012-01-17

申请号：US11620799

申请日：2007-01-08

Applicant: Satoru Hara ,  Shuzo Akejima

Inventor： Satoru Hara ,  Shuzo Akejima

IPC: H01L23/48

CPC classification number: H05K3/325 ,  H01L23/32 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/4046 ,  H05K7/142 ,  H05K2201/10416 ,  H05K2201/10704 ,  H05K2201/2036 ,  H05K2201/209 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

Abstract translation: 半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。 外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。

公开(公告)号：US20110223782A1

公开(公告)日：2011-09-15

申请号：US13114591

申请日：2011-05-24

Applicant: Thomas Michael Ales ,  Davis-Dang Hoang Nhan

Inventor： Thomas Michael Ales ,  Davis-Dang Hoang Nhan

IPC: H01R12/71

CPC classification number: H01R43/0256 ,  H01R13/03 ,  H05K3/308 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/209 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present disclosure is directed to conductive connector attachments for use in electrically connecting printed circuit boards to absorbent products such as diapers, training pants, incontinence products, feminine hygiene products, and the like. Specifically, various configurations and methods of securely attaching conventional conductive hook and loop attachments to printed circuit boards are disclosed.

Abstract translation: 本公开涉及用于将印刷电路板电连接到诸如尿布，训练裤，失禁产品，女性卫生产品等吸收产品的导电连接器附件。 具体地，公开了将常规导电钩和环附接件牢固地连接到印刷电路板的各种配置和方法。

公开(公告)号：US07946869B2

公开(公告)日：2011-05-24

申请号：US12795717

申请日：2010-06-08

Applicant: Thomas Michael Ales ,  Davis-Dang Hoang Nhan

Inventor： Thomas Michael Ales ,  Davis-Dang Hoang Nhan

IPC: H01R29/00

CPC classification number: H01R43/0256 ,  H01R13/03 ,  H05K3/308 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/209 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present disclosure is directed to conductive connector attachments for use in electrically connecting printed circuit boards to absorbent products such as diapers, training pants, incontinence products, feminine hygiene products, and the like. Specifically, various configurations and methods of securely attaching conventional conductive hook and loop attachments to printed circuit boards are disclosed.

Abstract translation: 本公开涉及用于将印刷电路板电连接到诸如尿布，训练裤，失禁产品，女性卫生产品等吸收产品的导电连接器附件。 具体地，公开了将常规导电钩和环附接件牢固地连接到印刷电路板的各种配置和方法。

公开(公告)号：US07766671B2

公开(公告)日：2010-08-03

申请号：US12171856

申请日：2008-07-11

Applicant: Atsuo Hattori

Inventor： Atsuo Hattori

IPC: H01R9/00

CPC classification number: H05K3/365 ,  H01L2924/0002 ,  H01R12/52 ,  H01R12/718 ,  H01R13/11 ,  H01R13/20 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/209 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An electronic component includes a substrate, an interconnection element, and a connector. The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base, at least one stopper, and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface.

Abstract translation: 电子部件包括基板，互连元件和连接器。 互连元件具有导电性。 互连元件存在于衬底上。 连接器存在于互连元件上。 连接器还可以包括但不限于底座，至少一个止动器和至少一个倾斜的引导表面。 基底从垂直于基底表面的第一方向突出互连元件。 至少一个止动件在与基板的表面平行的第二方向从基座突出。 一个止动器具有止动器表面。