MICROELECTROMECHANICAL INFRARED SENSING DEVICE AND FABRICATION METHOD THEREOF

    公开(公告)号:US20230045432A1

    公开(公告)日:2023-02-09

    申请号:US17729873

    申请日:2022-04-26

    Abstract: A MEMS infrared sensing device includes a substrate and an infrared sensing component. The infrared sensing component is provided above the substrate. The infrared sensing component includes a sensing plate and at least one supporting element. The sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements. The sensing plate has a plurality of openings. The metallic elements respectively surround the openings. The sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another. The supporting element connecting the sensing plate with the substrate.

    DEVICE FOR DETECTING A TEMPERATURE, INSTALLATION FOR PRODUCING AN OPTICAL ELEMENT AND METHOD FOR PRODUCING AN OPTICAL ELEMENT

    公开(公告)号:US20230018331A1

    公开(公告)日:2023-01-19

    申请号:US17950635

    申请日:2022-09-22

    Abstract: A device (20) for detecting a temperature on a surface (15) of an optical element (14) for semiconductor lithography. The device includes an optical element (14) having a face (16) irradiated with electromagnetic radiation (7, 8, 43), a temperature recording device (21), and a temperature controlled element (22) configured to be temperature-controlled and arranged so that the predominant proportion of the intensity of the thermal radiation (25.2) detected by the temperature recording device and reflected by reflection at the surface of the optical element is emitted by the temperature-controlled element. Also disclosed are an installation (1) for producing a surface (15) of an optical element (14) for semiconductor lithography and a method for producing a surface (15) of an optical element (14) of a projection exposure apparatus (30), wherein the surface is temperature-controlled and the surface temperature is detected during the temperature control.

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