公开(公告)号：US11434578B2

公开(公告)日：2022-09-06

申请号：US17220540

申请日：2021-04-01

Applicant: MacDermid Enthone Inc.

Inventor： John Commander ,  Vincent Paneccasio, Jr. ,  Eric Rouya ,  Kyle Whitten ,  Shaopeng Sun ,  Jianwen Han

IPC: C25D3/16 ,  C25D7/12 ,  C25D3/56 ,  C25D5/18

Abstract: Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising sub-micron-sized electrical interconnect features. In the process, a metalizing substrate within the interconnect features is contacted with an electrodeposition composition comprising a source of cobalt ions, an accelerator comprising an organic sulfur compound, an acetylenic suppressor, a buffering agent and water. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The process is effective for superfilling the interconnect features.

公开(公告)号：US11384446B2

公开(公告)日：2022-07-12

申请号：US17005407

申请日：2020-08-28

Applicant: MacDermid Enthone Inc.

Inventor： Kyle M. Whitten ,  Stephan I. Braye ,  Jianwen Han ,  Pingping Ye ,  Thomas B. Richardson ,  Elie H. Najjar

IPC: C25D3/38 ,  C25D5/00 ,  B82Y40/00 ,  B82Y30/00

Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

公开(公告)号：US20220170172A1

公开(公告)日：2022-06-02

申请号：US17591071

申请日：2022-02-02

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/46 ,  C25D5/12 ,  H01R43/26 ,  C25D3/32

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

公开(公告)号：US20220081776A1

公开(公告)日：2022-03-17

申请号：US17018004

申请日：2020-09-11

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards

IPC: C23C18/40 ,  C23C18/16

Abstract: An electroless copper deposition composition, comprising: (a) a source of copper ions; (b) a chelator; (c) a source of alkalinity; (d) a reducing agent; (e) nickel ions; (f) a bipyridine; (g) optionally, an additional stabilizer; and (h) optionally, a water soluble polymer. The electroless copper deposition composition can be used to deposit a ductile copper deposit on a substrate that exhibits high % elongation and high tensile strength.

公开(公告)号：US20220064811A1

公开(公告)日：2022-03-03

申请号：US17416703

申请日：2020-01-31

Applicant: MacDermid Enthone Inc.

Inventor： Eric Yakobson ,  Shaopeng Sun ,  Elie Najjar ,  Thomas Richardson ,  Vincent Paneccasio, Jr. ,  Wenbo Shao ,  Kyle Whitten

IPC: C25D3/18 ,  H01L21/768 ,  H01L21/288 ,  C25D7/12 ,  C25D5/02 ,  C25D21/10

Abstract: A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.

公开(公告)号：US11230778B2

公开(公告)日：2022-01-25

申请号：US16713871

申请日：2019-12-13

Applicant: MacDermid Enthone Inc.

Inventor： Shaopeng Sun ,  Kyle Whitten ,  Stephan Braye ,  Elie Najjar

IPC: C25D3/16 ,  C25D5/02 ,  C25D7/12 ,  C25D5/18

Abstract: An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.

公开(公告)号：US20210371998A1

公开(公告)日：2021-12-02

申请号：US16884314

申请日：2020-05-27

Applicant: MacDermid Enthone Inc.

Inventor： Roger Bernards ,  Emely Abel-Tatis

IPC: C25D3/48 ,  H05K3/18 ,  H05K3/46

Abstract: An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon. The autocatalytic gold bath includes (a) a chelator; (b) a gold salt; and (c) a reducing agent, wherein the reducing agent comprises an organic molecule having more than one carbon atom on the organic molecule. A process of plating gold onto the surface of the one or more metal layers on the substrate is also included. The gold plating bath can be used to deposit a final finish to the surface of the one or more metal layers which can be formed in an ENIG, ENEPIG, EPAG, direct gold over copper or gold over silver process.

公开(公告)号：US10828668B2

公开(公告)日：2020-11-10

申请号：US15717275

申请日：2017-09-27

Applicant: MacDermid Enthone Inc.

Inventor： Keith Paul Parsons ,  Herrick Man Hin Yu

IPC: B05D5/02 ,  B29C45/14 ,  B29C69/02 ,  B05D3/02 ,  B29C69/00 ,  B05D3/06 ,  B29K669/00 ,  B05D1/28 ,  B29C51/10 ,  B05D7/04 ,  B05D1/42

Abstract: Textured hardcoat films are disclosed for preferable use in film insert moulding. Texture in the hardcoat film is created through the use of a textured protective overlayer, which can impart texture to the curable coating of the hardcoat film. This process preferably avoids the need to alter the composition of the curable coating to allow for texture and preferably produces a hardcoat film with a matte and reduced-glare finish. An apparatus and a method embodying the invention are disclosed.

公开(公告)号：US20200040478A1

公开(公告)日：2020-02-06

申请号：US15739314

申请日：2016-06-30

Applicant: MacDermid Enthone Inc.

Inventor： John Commander ,  Vincent Paneccasio, Jr. ,  Eric Rouya ,  Kyle Whitten ,  Shaopeng Sun

IPC: C25D7/12 ,  C25D3/56 ,  C25D3/16

Abstract: Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising submicron-sized electrical interconnect features. In the process, a metalizing substrate within the interconnect features is contacted with an electrodeposition composition comprising a source of cobalt ions, an accelerator comprising an organic sulfur compound, an acetylenic suppressor, a buffering agent and water. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The process is effective for superfilling the interconnect features.

公开(公告)号：US10443135B1

公开(公告)日：2019-10-15

申请号：US15977526

申请日：2018-05-11

Applicant: MacDermid Enthone Inc.

Inventor： Chalo Aoun

IPC: B08B3/08 ,  C23G1/26 ,  C23G1/00

Abstract: A near neutral pH pickling composition for the removal of oxides from metallic surfaces, including heat treated steel. The pickling composition comprises a) a water-soluble organic or inorganic nitro compound, wherein a central N atom has an oxidation state of 3+; b) a polarizing agent for the nitro compound, wherein the polarizing agent comprises at least one of a phosphonate and a carboxylate; c) a pH buffer, and d) at least one metal complexing agent. The composition is preferably maintained at a pH between about 4.5 and about 7.5. The near neutral pH pickle composition can be used on various metallic surfaces as well as composite surfaces comprising metallic and non-metallic portions.