公开(公告)号：US20210065959A1

公开(公告)日：2021-03-04

申请号：US16557476

申请日：2019-08-30

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Denis Shishkov ,  Matthew Cavallaro ,  Michael Lekas ,  Ryan Davies

IPC: H01F27/24 ,  H01F10/06 ,  H01F10/08

Abstract: A method for manufacturing a vertically-laminated ferromagnetic core includes (a) depositing a conductive seed layer on or over a first side of a substrate; (b) depositing a masking layer on or over a second side of the substrate, the first and second sides on opposite sides of the substrate; (c) forming a pattern in the masking layer; (d) dry etching the substrate, based on the pattern in the masking layer, from the second side to the first side to expose portions of the conductive seed layer; and (e) depositing a ferromagnetic material onto the exposed portions of the conductive seed layer to form vertically-oriented ferromagnetic layers.

公开(公告)号：US10893609B2

公开(公告)日：2021-01-12

申请号：US16007158

申请日：2018-06-13

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F27/28 ,  H05K1/18 ,  H01F41/04 ,  H01F41/02 ,  H01F27/24 ,  H05K1/02 ,  H05K1/11 ,  H01F17/00 ,  H01F41/32 ,  H05K1/16 ,  H05K1/03

Abstract: A structure includes a semiconductor integrated circuit comprising a multilevel wiring network and an inductor integrated into the multilevel wiring network. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic layer comprises a ferromagnetic alloy having an iron composition of about 10 atomic percent to about 90 atomic percent.

公开(公告)号：US10593470B1

公开(公告)日：2020-03-17

申请号：US16118113

申请日：2018-08-30

Applicant: Ferric Inc.

Inventor： Michael Lekas ,  Noah Sturcken

IPC: H02J50/12 ,  H01F38/14 ,  H01L23/64 ,  H04B5/00 ,  H01F27/24

Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.

公开(公告)号：US20200075233A1

公开(公告)日：2020-03-05

申请号：US16118113

申请日：2018-08-30

Applicant: Ferric Inc.

Inventor： Michael Lekas ,  Noah Sturcken

IPC: H01F38/14 ,  H01L23/64 ,  H02J50/12 ,  H01F27/24 ,  H04B5/00

Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.

公开(公告)号：US10431371B2

公开(公告)日：2019-10-01

申请号：US15255804

申请日：2016-09-02

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu

IPC: H01F27/24 ,  H01F41/04 ,  H01F41/06 ,  H01F1/147 ,  H01F13/00 ,  H01F17/00 ,  H01F17/04 ,  H01F17/06 ,  H01F27/255 ,  H01F27/38 ,  H01F27/28 ,  H01F41/14 ,  H01L49/02 ,  C23C14/14 ,  H01F10/12

Abstract: A method of forming an inductor assembly includes depositing a magnetic core on a planar substrate lying in a core plane, forming an inductor coil that generates a magnetic field that passes through the magnetic core in a closed loop parallel to the core plane, and annealing the magnetic core while applying an external magnetic field that passes through the magnetic core in a radial direction to permanently fix the easy axis of magnetization parallel to the radial direction. As a result, the hard axis of magnetization of the magnetic core is permanently oriented in a generally circular closed path parallel to the closed loop of the inductor's magnetic field.

公开(公告)号：US20190172624A1

公开(公告)日：2019-06-06

申请号：US16257392

申请日：2019-01-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F27/24 ,  H01F17/00 ,  H01F1/147 ,  H01L49/02 ,  H01F41/14 ,  H01F41/06 ,  H01F17/04 ,  H01F13/00 ,  H01F27/38 ,  H01F27/255 ,  H01F17/06 ,  H01F27/28

Abstract: Inductive elements comprising anisotropic media and a bias coil for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. The bias coil generates a magnetic field that biases a magnetic core material during deposition thereof such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. The bias coil can generate the magnetic field by application of electrical current therethrough. Alternatively, the bias coil can include or can be replaced with a permanent magnet that can generate the magnetic field without application of electrical current therethrough.

公开(公告)号：US20180268982A1

公开(公告)日：2018-09-20

申请号：US15911778

申请日：2018-03-05

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu

IPC: H01F27/24 ,  H01L49/02 ,  H01F27/28 ,  H01F13/00 ,  H01F41/14 ,  H01F41/06 ,  H01F27/38 ,  H01F1/147 ,  H01F27/255 ,  H01F17/06 ,  H01F17/04 ,  H01F17/00

CPC classification number: H01F27/24 ,  H01F1/14708 ,  H01F13/003 ,  H01F17/0013 ,  H01F17/04 ,  H01F17/062 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/2895 ,  H01F27/38 ,  H01F41/046 ,  H01F41/06 ,  H01F41/14 ,  H01F2017/0066 ,  H01L28/10

Abstract: Inductive elements comprising anisotropic media and biasing coils for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. Application of an electrical current through the bias coils generates a magnetic field that biases the magnetic material such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. Electrical conductors coupled to interconnects are magnetically coupled to magnetic core layers to produce self and/or mutual inductors.

公开(公告)号：US09906131B1

公开(公告)日：2018-02-27

申请号：US15243022

申请日：2016-08-22

Applicant: Ferric Inc.

Inventor： William Lee ,  David Jew ,  Joseph Meyer ,  Noah Sturcken

IPC: H02M3/158 ,  H02M3/157 ,  H02M1/00

CPC classification number: H02M3/158 ,  H02M1/38 ,  H02M3/157 ,  H02M3/1588 ,  H02M2001/0058 ,  Y02B70/1491

Abstract: A switched-mode power converter includes timing control feedback loop circuits to minimize or eliminate the potential difference across a high-power switch and a low-power switch during their transitions times. A first feedback circuit compares the measured voltage across the high-power switch at the moment the high-power switch closes with the input voltage to the high-power switch to control a low-to-high delay time. A second feedback circuit compares the measured voltage across the low-power switch at the moment the low-power switch closes with the input voltage to the low-power switch to control a high-to-low delay time. A third feedback circuit compares the measured voltage across the low-power switch at the moment the low-power switch opens. The output of the third feedback circuit is provided as inputs to the first and second feedback circuits. The third feedback circuit also controls the frequency of the power converter.

公开(公告)号：US20160372251A1

公开(公告)日：2016-12-22

申请号：US15255804

申请日：2016-09-02

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu

IPC: H01F27/24 ,  H01L49/02 ,  H01F41/14 ,  H01F1/147 ,  H01F27/28 ,  H01F41/06

CPC classification number: H01F27/24 ,  C23C14/14 ,  H01F1/14708 ,  H01F10/12 ,  H01F13/003 ,  H01F17/0013 ,  H01F17/04 ,  H01F17/062 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/2895 ,  H01F27/38 ,  H01F41/046 ,  H01F41/06 ,  H01F41/14 ,  H01F2017/0066 ,  H01L28/10 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: Inductive elements comprising anisotropic media and biasing coils for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. Application of an electrical current through the bias coils generates a magnetic field that biases the magnetic material such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. Electrical conductors coupled to interconnects are magnetically coupled to magnetic core layers to produce self and/or mutual inductors.

公开(公告)号：US20230343602A1

公开(公告)日：2023-10-26

申请号：US17655832

申请日：2022-03-22

Applicant: Ferric Inc.

Inventor： Michael Lekas ,  Salahuddin Raju ,  Noah Sturcken ,  Ryan Davies ,  Denis Shishkov

IPC: H01L21/324 ,  H01L21/3205 ,  H01L21/02

CPC classification number: H01L21/3205 ,  H01L21/02172 ,  H01L21/324

Abstract: A method for manufacturing a ferromagnetic-dielectric composite material comprises: (a) placing patterned ferromagnetic layer regions, in a patterning substrate assembly that includes a patterning substrate and a first dielectric layer, in physical contact with a second dielectric layer, the second dielectric layer in a receiving substrate assembly that includes a receiving substrate, (b) forming a bond between the patterned ferromagnetic layer regions and the second dielectric layer; (c) releasing the patterning substrate from the patterning substrate assembly to transfer the patterned ferromagnetic layer regions and the first dielectric layer from the patterning substrate assembly to the receiving substrate assembly; and (d) releasing the receiving substrate from the receiving substrate assembly to form the ferromagnetic-dielectric composite material.