公开(公告)号：US20210321518A1

公开(公告)日：2021-10-14

申请号：US17358318

申请日：2021-06-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H05K1/18 ,  H01F41/04 ,  H01F41/02 ,  H01F27/28 ,  H01F27/24 ,  H05K1/02 ,  H05K1/11 ,  H01F17/00 ,  H01F41/32

Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 μm of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 μm of an opposing face of the planar laminated magnetic core.

公开(公告)号：US11116081B2

公开(公告)日：2021-09-07

申请号：US16007569

申请日：2018-06-13

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F17/00 ,  H05K1/18 ,  H01F41/04 ,  H01F41/02 ,  H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H01F41/32

Abstract: An inductor comprises a planar laminated magnetic core and a conductive winding. The core includes an alternating sequence of (a) a magnetic layer having a thickness of about 100 angstroms to about 10,000 angstroms and (b) a non-magnetic layer having a thickness of about 10 angstroms to about 2,000 angstroms. Magnetic flux passes through a first magnetic layer parallel to a first easy axis of magnetization of the first magnetic layer and the magnetic flux passes through a second magnetic layer, disposed adjacent to the first magnetic layer, parallel to a second easy axis of magnetization of the second magnetic layer. The magnetic flux path extends through the first and second magnetic layers parallel to the first and second easy axes of magnetization, respectively. At least one orthogonal magnetic layer can be disposed laterally from the core such that the magnetic flux path extends through the orthogonal magnetic layer(s).

公开(公告)号：US10347709B2

公开(公告)日：2019-07-09

申请号：US15419562

申请日：2017-01-30

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01F7/06 ,  H01L49/02 ,  H01L23/522 ,  H01L21/3205 ,  H01L21/288 ,  H01F27/28 ,  H01F41/04 ,  H01F17/00 ,  H01F41/26

Abstract: Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.

公开(公告)号：US10244633B2

公开(公告)日：2019-03-26

申请号：US15844107

申请日：2017-12-15

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  David Jew ,  Joseph Meyer ,  Ryan Davies ,  Michael Lekas

IPC: H05K1/18 ,  H01F41/04 ,  H01F41/02 ,  H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/02 ,  H05K1/11

Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate.

公开(公告)号：US20180302986A1

公开(公告)日：2018-10-18

申请号：US16007569

申请日：2018-06-13

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H05K1/18 ,  H01F41/02 ,  H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/02

Abstract: An inductor comprises a planar laminated magnetic core and a conductive winding. The core includes an alternating sequence of (a) a magnetic layer having a thickness of about 100 angstroms to about 10,000 angstroms and (b) a non-magnetic layer having a thickness of about 10 angstroms to about 2,000 angstroms. Magnetic flux passes through a first magnetic layer parallel to a first easy axis of magnetization of the first magnetic layer and the magnetic flux passes through a second magnetic layer, disposed adjacent to the first magnetic layer, parallel to a second easy axis of magnetization of the second magnetic layer. The magnetic flux path extends through the first and second magnetic layers parallel to the first and second easy axes of magnetization, respectively. At least one orthogonal magnetic layer can be disposed laterally from the core such that the magnetic flux path extends through the orthogonal magnetic layer(s).

公开(公告)号：US20180295726A1

公开(公告)日：2018-10-11

申请号：US16007631

申请日：2018-06-13

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H05K1/18 ,  H01F41/02 ,  H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/02

Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 μm of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 μm of an opposing face of the planar laminated magnetic core.

公开(公告)号：US20180295725A1

公开(公告)日：2018-10-11

申请号：US16007158

申请日：2018-06-13

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H05K1/18 ,  H01F41/02 ,  H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/02

Abstract: A structure includes a semiconductor integrated circuit comprising a multilevel wiring network and an inductor integrated into the multilevel wiring network. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic layer comprises a ferromagnetic alloy having an iron composition of about 10 atomic percent to about 90 atomic percent.

公开(公告)号：US09781834B1

公开(公告)日：2017-10-03

申请号：US15408096

申请日：2017-01-17

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01L23/49 ,  H05K1/18 ,  H01L23/522 ,  H01L23/498 ,  H01F27/28 ,  H03H7/38

CPC classification number: H03H7/38 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2823 ,  H01L23/49822 ,  H01L23/5227 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/086 ,  Y02P70/611

Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.

公开(公告)号：US20170250133A1

公开(公告)日：2017-08-31

申请号：US15053747

申请日：2016-02-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies

IPC: H01L23/522 ,  H01L23/528 ,  H01L23/29 ,  C08K3/08 ,  H01L21/56 ,  H01L23/00 ,  C08K3/22 ,  H01L49/02 ,  H01L23/31

CPC classification number: H01L23/5227 ,  C08K3/08 ,  C08K3/22 ,  C08K2003/0843 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2003/2265 ,  C08K2003/2289 ,  C08K2003/2293 ,  H01F1/26 ,  H01F1/37 ,  H01F17/0013 ,  H01F41/0206 ,  H01F41/04 ,  H01F41/046 ,  H01F2003/106 ,  H01L21/321 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3142 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L28/10 ,  H01L2224/13022 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/831 ,  H01L2224/8312 ,  H01L2224/83855 ,  H01L2224/83909 ,  H01L2224/92125 ,  H01L2924/0665 ,  H01L2924/13067 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1425 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/2064 ,  H01L2924/2075 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.

公开(公告)号：US09647053B2

公开(公告)日：2017-05-09

申请号：US14571649

申请日：2014-12-16

Applicant: Ferric Inc.

Inventor： Noah Andrew Sturcken ,  Ryan Davies

IPC: H01L49/02 ,  H01L23/522 ,  H01L23/64 ,  H01L21/3205

CPC classification number: H01L28/10 ,  H01L21/32051 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Integrated multi-layer magnetic films for use in passive devices in microelectronic applications and methods of manufacture thereof. Soft ferromagnetic materials exhibiting high permeability and low coercivity are laminated together with insulating layers interposed. Electrical conductors coupled to interconnects are magnetically coupled to magnetic film layers to engender an inductor (self and mutual). Soft ferromagnetic materials are provided in an alternating array of parallel plate capacitors. Each alternating magnetic film is electrically coupled to either a primary or secondary electrical conductor interconnects and separated by an electrically insulating dielectric material. Alternatively, each alternating magnetic layer comprises an induced anisotropy material, which can also be combined with coiled conductor giving rise to a hybrid inductive/capacitive device. Also, soft ferromagnetic material are also selected and tuned to provide for FMR notch filtering.