公开(公告)号：US07324352B2

公开(公告)日：2008-01-29

申请号：US11068688

申请日：2005-03-01

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K1/11

CPC classification number: G11C5/04 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.

Abstract translation: 多个DIMM电路或实例被呈现在单个模块中。 在一些实施例中，存储器集成电路（优选CSP）和伴随的AMB或伴随的存储器寄存器被布置在柔性电路的每一侧的两个场中的两个等级中。 柔性电路具有沿着一侧设置的扩展触点。 柔性电路围绕支撑衬底或板设置，以在构造的模块的每一侧上放置一个完整的DIMM电路或实例化。 在替代但也优选的实施例中，最靠近基板的柔性电路一侧的IC至少部分地设置在优选实施例中在基板中的窗口，凹穴或切口区域中。 其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。 其他实施例可能错开或偏移IC或包括更多数量的IC。

公开(公告)号：US20070201208A1

公开(公告)日：2007-08-30

申请号：US11364489

申请日：2006-02-27

Applicant: Paul Goodwin ,  James Wehrly

Inventor： Paul Goodwin ,  James Wehrly

IPC: H05K7/20

CPC classification number: G11C5/00 ,  G06F1/20 ,  G11C5/143 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having first and second lateral sides, an edge, and an integrated cooling component. The integrated cooling component reduces thermal variation and cools the circuit module. Flex circuitry populated with a plurality of ICs and exhibiting a connective facility that comprises plural contacts for use with an edge connector is wrapped about the edge of the thermally-conductive substrate. Heat from the plurality of ICs is thermally-conducted by the thermally-conductive substrate to the integrated cooling component.

公开(公告)号：US20070111606A1

公开(公告)日：2007-05-17

申请号：US11564199

申请日：2006-11-28

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H01R24/00

CPC classification number: G11C5/04 ,  H01L23/34 ,  H01L23/36 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: Multiple fully buffered DIMM circuits or instantiations are presented in a single module. In a preferred embodiment, memory integrated circuits (preferably CSPs) and accompanying AMBs are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete FB-DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.

Abstract translation: 多个完全缓冲的DIMM电路或实例被呈现在单个模块中。 在优选实施例中，存储器集成电路（优选CSP）和伴随的AMB被布置在柔性电路的每一侧的两个场中的两个等级中。 柔性电路具有沿着一侧设置的扩展触点。 柔性电路围绕支撑衬底或板设置，以在构造的模块的每一侧上放置一个完整的FB-DIMM电路或实例化。 在替代但也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在优选实施例中在基板中的窗口，凹部或切口区域中。 其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。 其他实施例可能错开或偏移IC或包括更多数量的IC。

公开(公告)号：US20060198238A1

公开(公告)日：2006-09-07

申请号：US11397597

申请日：2006-04-03

Applicant: Julian Partridge ,  David Roper ,  Paul Goodwin

Inventor： Julian Partridge ,  David Roper ,  Paul Goodwin

IPC: G11C8/18

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The rigid substrate exhibits adhesion features that allow more advantageous use of thermoplastic adhesives with concomitant rework advantages and while providing flexibility in meeting dimensional specifications such as those promulgated by JEDEC, for example.

Abstract translation: 灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。 填充的柔性电路设置在刚性衬底附近，以将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或两层集成电路。 刚性基材表现出粘合特征，其允许更有利地使用具有伴随返工优点的热塑性粘合剂，并且同时提供满足例如由JEDEC公布的尺寸规格的柔性。

公开(公告)号：US20060125067A1

公开(公告)日：2006-06-15

申请号：US11331969

申请日：2006-01-13

Applicant: James Wehrly ,  Paul Goodwin ,  Russell Rapport

Inventor： James Wehrly ,  Paul Goodwin ,  Russell Rapport

IPC: H01L23/02

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.

公开(公告)号：US20060072297A1

公开(公告)日：2006-04-06

申请号：US10956442

申请日：2004-10-01

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K1/14

CPC classification number: H05K1/189 ,  H05K1/141 ,  H05K2201/10189 ,  H05K2201/10734

Abstract: Abstract of the DisclosureOne or more connectors are mounted to a module having one or more integrated circuits. In one embodiment, multiple ICs are stacked and interconnected to form a high-density module. The connectors are preferably mounted above the top IC of the module, but may be mounted at other locations. Electrical or fiber-optic cables may be plugged into the connectors. Other devices may be plugged into the connectors. Other embodiments may have one or more connectors mounted to flexible circuitry. Schemes are disclosed to employ various embodiments for test or operational signaling purposes.

Abstract translation: 公开摘要将一个或多个连接器安装到具有一个或多个集成电路的模块。 在一个实施例中，多个IC被堆叠并互连以形成高密度模块。 连接器优选地安装在模块的顶部IC上方，但是可以安装在其他位置。 电缆或光纤电缆可能插入连接器中。 其他设备可能插入到连接器中。 其他实施例可以具有安装到柔性电路的一个或多个连接器。 公开了采用用于测试或操作信令目的的各种实施例的方案。

公开(公告)号：US20060050492A1

公开(公告)日：2006-03-09

申请号：US10934027

申请日：2004-09-03

Applicant: Paul Goodwin ,  James Cady ,  Douglas Wehrly

Inventor： Paul Goodwin ,  James Cady ,  Douglas Wehrly

IPC: H05K7/06 ,  H05K7/10

CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.

公开(公告)号：US20060049502A1

公开(公告)日：2006-03-09

申请号：US11125018

申请日：2005-05-09

Applicant: Paul Goodwin ,  James Cady

Inventor： Paul Goodwin ,  James Cady

IPC: H01L23/02

CPC classification number: G11C5/00 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  G11C5/143 ,  H01L23/367 ,  H01L25/105 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated along each of its first and second major sides with two ranks of ICs which are, preferably, array type (CSP) devices. Insertion contacts are disposed in two sets on the first side of the flex circuit typically between the two ranks of ICs along the first side of the IC. A substrate with first and second lateral sides provides a form for the module. That substrate is preferably comprised of metallic material and exhibits an edge about which the flex circuit is wrapped and an extension at the other extremity of the substrate that is thermally connected to a chassis component of the application, either directly or, preferably, through a thermal conduit such as a thermally conductive compliant material.

公开(公告)号：US20240242173A1

公开(公告)日：2024-07-18

申请号：US18154944

申请日：2023-01-16

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: G06Q10/087 ,  H04W4/35 ,  H04W4/38

CPC classification number: G06Q10/087 ,  H04W4/35 ,  H04W4/38 ,  H04W88/04

Abstract: Sensor modules referred to herein as “buds”, are connected by wireline or wirelessly to a controller referred to herein as a “root” in what is referred to herein as a vine to provide inventory control information for a wine storage facility. Buds sense when objects are moved into or out of sensing range of a proximity sensor and, in alternative embodiments, may also track or control other quantities of interest, like the local temperature, humidity, or VOCs. A root may broadcast a message to all buds, or send a message to an individual bud, while buds return messages back to the root. Scaling of the system is accomplished through the use of roots as repeaters or targets. In a preferred embodiment, the vine originates at the root and each bud has at least two downstream facing ports, which dispatch messages along paths referred to here as “primary” and “divergent”.

公开(公告)号：US20110309231A1

公开(公告)日：2011-12-22

申请号：US13221710

申请日：2011-08-30

Applicant: Jeremy Cooper ,  Paul Goodwin

Inventor： Jeremy Cooper ,  Paul Goodwin

IPC: G02B27/40

CPC classification number: G02B21/16 ,  G02B21/245

Abstract: The current application is directed to autofocus subsystems within optical instruments that continuously monitor the focus of the optical instruments and adjust distances within the optical instrument along the optical axis in order to maintain a precise and stable optical-instrument focus at a particular point or surface on, within, or near a sample. Certain autofocus implementations operate asynchronously with respect to operation of other components and subsystems of the optical instrument in which they are embedded. The described autofocus subsystems employ multiple calibration curves to precisely adjust the z-position of an optical instrument.

Abstract translation: 目前的应用是针对光学仪器内的自动对焦子系统，其连续地监视光学仪器的焦点并且沿着光轴调整光学仪器内的距离，以便在特定点或表面上保持精确和稳定的光学仪器焦点 ，在样本内或附近。 某些自动对焦实现方式相对于嵌入其中的光学仪器的其他组件和子系统的操作而异步操作。 所描述的自动对焦子系统使用多个校准曲线来精确地调整光学仪器的z位置。